JP6497487B2 - 多層配線基板 - Google Patents
多層配線基板 Download PDFInfo
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- JP6497487B2 JP6497487B2 JP2018553710A JP2018553710A JP6497487B2 JP 6497487 B2 JP6497487 B2 JP 6497487B2 JP 2018553710 A JP2018553710 A JP 2018553710A JP 2018553710 A JP2018553710 A JP 2018553710A JP 6497487 B2 JP6497487 B2 JP 6497487B2
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- resin
- wiring board
- multilayer wiring
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- 229920005989 resin Polymers 0.000 claims description 133
- 239000011347 resin Substances 0.000 claims description 133
- 239000002344 surface layer Substances 0.000 claims description 66
- 239000010410 layer Substances 0.000 claims description 61
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 12
- 238000005304 joining Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 61
- 239000004020 conductor Substances 0.000 description 59
- 239000000945 filler Substances 0.000 description 59
- 239000002245 particle Substances 0.000 description 33
- 239000000463 material Substances 0.000 description 29
- 239000011229 interlayer Substances 0.000 description 23
- 239000010408 film Substances 0.000 description 22
- 238000009826 distribution Methods 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 230000001681 protective effect Effects 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000002902 bimodal effect Effects 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
図1は、全体が100で表される本発明の実施の形態1にかかる平板状の多層配線基板の断面図である。多層配線基板100は、樹脂層を構成する樹脂シート10、20、30を含む。樹脂シート10は、絶縁基材13と、その表面上に形成された導電性パターン15からなる。絶縁基材13は、例えば液晶ポリマー(LCP:Liquid Crystal Polymer)のような熱可塑性樹脂からなり、導電性パターン15は、例えば銅のような導電性金属からなる(絶縁基材23、33、導電性パターン25、35も同じ)。なお、樹脂シートは、ビルドアップ型基板に用いられるような印刷形成された樹脂シートでも良い。また、平板状とは、必ずしも表面や裏面が平滑でなくても、おおよそ平坦な表面および裏面を有すれば良い。
図16は、全体が200で表される本発明の実施の形態2にかかる多層配線基板の断面図であり、表面実装部品80が実装された状態を示す。図16中、図1、8と同一符号は、同一または相当箇所を示す。
図17は、全体が300で表される本発明の実施の形態3にかかる多層配線基板の表面に表面実装部品80が実装された状態で、かつ実装基板500の上に実装された状態の断面図を示す。図17中、図1、8と同一符号は、同一または相当箇所を示す。
図18は、全体が400で表される本発明の実施の形態4にかかる多層配線基板の、フレキシブル部410aを挟む2つのリジッド部410b、410cに、それぞれ実装基板520、510を実装した場合の断面図である。
13、23、33 絶縁基材
15、25、35 導電性パターン
27 層間接続導体(ビア導体)
50 表面シート(表面層)
60 表面導体
69 層間接続導体(スルーホールめっき導体)
70 保護膜
77 開口部
90 裏面シート(裏面層)
100 多層配線基板
Claims (3)
- 平板状の多層配線基板の製造方法であって、
絶縁基材と該絶縁基材の上に設けられた導電性パターンとを含む樹脂層を、少なくとも2枚準備する工程と、
該樹脂層を重ねて配置し、加熱プレスを行って樹脂層同士を接合するとともに、該樹脂層の表面に凹凸を形成する工程と、
該樹脂層の上に、該樹脂層より弾性率の高い表面層を重ねる工程と、
該表面層の上から加熱状態で平坦な面で加圧プレスを行い、該樹脂層と該表面層とを接合するプレス工程と、を含み、
該樹脂層と該表面層との接合面が凹凸を有することを特徴とする多層配線基板の製造方法。 - 上記プレス工程は、
無加圧で表面層の温度を、温度粘性曲線の、溶融開始温度から最低粘度温度までの間の温度に保持した後に、該最低粘度温度以上の温度で加圧する工程を含むことを特徴とする請求項1に記載の多層配線基板の製造方法。 - 更に、上記表面層の上に、実装部品を固定する工程を含むことを特徴とする請求項1または2に記載の多層配線基板の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016235365 | 2016-12-02 | ||
JP2016235365 | 2016-12-02 | ||
JP2017108417 | 2017-05-31 | ||
JP2017108417 | 2017-05-31 | ||
PCT/JP2017/038178 WO2018100922A1 (ja) | 2016-12-02 | 2017-10-23 | 多層配線基板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019044729A Division JP2019134172A (ja) | 2016-12-02 | 2019-03-12 | 多層配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6497487B2 true JP6497487B2 (ja) | 2019-04-10 |
JPWO2018100922A1 JPWO2018100922A1 (ja) | 2019-04-11 |
Family
ID=62242546
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018553710A Active JP6497487B2 (ja) | 2016-12-02 | 2017-10-23 | 多層配線基板 |
JP2019044729A Pending JP2019134172A (ja) | 2016-12-02 | 2019-03-12 | 多層配線基板 |
JP2020132217A Active JP6996595B2 (ja) | 2016-12-02 | 2020-08-04 | 多層配線基板 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019044729A Pending JP2019134172A (ja) | 2016-12-02 | 2019-03-12 | 多層配線基板 |
JP2020132217A Active JP6996595B2 (ja) | 2016-12-02 | 2020-08-04 | 多層配線基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10959327B2 (ja) |
JP (3) | JP6497487B2 (ja) |
CN (1) | CN210579551U (ja) |
WO (1) | WO2018100922A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7484711B2 (ja) * | 2018-05-09 | 2024-05-16 | 株式会社レゾナック | 支持体付き層間絶縁層用樹脂フィルム、多層プリント配線板及び多層プリント配線板の製造方法 |
CN215268953U (zh) | 2018-09-27 | 2021-12-21 | 株式会社村田制作所 | 树脂多层基板 |
CN114175860B (zh) * | 2019-08-08 | 2024-10-11 | 株式会社村田制作所 | 树脂多层基板以及树脂多层基板的制造方法 |
EP4081005A1 (en) * | 2021-04-23 | 2022-10-26 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier |
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US10959327B2 (en) | 2021-03-23 |
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JP6996595B2 (ja) | 2022-01-17 |
WO2018100922A1 (ja) | 2018-06-07 |
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