JP6433161B2 - フィールド対フィーチャのコントラストを用いたｔｓｖ浴評価 - Google Patents

フィールド対フィーチャのコントラストを用いたｔｓｖ浴評価 Download PDF

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Publication number
JP6433161B2
JP6433161B2 JP2014115335A JP2014115335A JP6433161B2 JP 6433161 B2 JP6433161 B2 JP 6433161B2 JP 2014115335 A JP2014115335 A JP 2014115335A JP 2014115335 A JP2014115335 A JP 2014115335A JP 6433161 B2 JP6433161 B2 JP 6433161B2
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electrode
experiment
potential
current density
electroplating
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Japanese (ja)
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JP2015001523A5 (cg-RX-API-DMAC7.html
JP2015001523A (ja
Inventor
リー・ブローガン
スティーブン・ティー．・マイヤー
マシュー・トラム
ジョセフ・リチャードソン
デビッド・ダブリュ．・ポーター
ハイイーン・フー
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Lam Research Corp
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Lam Research Corp
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/18—Curved printing formes or printing cylinders
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/413—Concentration cells using liquid electrolytes measuring currents or voltages in voltaic cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2014115335A 2013-06-14 2014-06-04 フィールド対フィーチャのコントラストを用いたｔｓｖ浴評価 Active JP6433161B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361835418P 2013-06-14 2013-06-14
US61/835,418 2013-06-14
US14/275,750 2014-05-12
US14/275,750 US9689083B2 (en) 2013-06-14 2014-05-12 TSV bath evaluation using field versus feature contrast

Publications (3)

Publication Number Publication Date
JP2015001523A JP2015001523A (ja) 2015-01-05
JP2015001523A5 JP2015001523A5 (cg-RX-API-DMAC7.html) 2017-07-13
JP6433161B2 true JP6433161B2 (ja) 2018-12-05

Family

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Family Applications (1)

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JP2014115335A Active JP6433161B2 (ja) 2013-06-14 2014-06-04 フィールド対フィーチャのコントラストを用いたｔｓｖ浴評価

Country Status (6)

Country Link
US (2) US9689083B2 (cg-RX-API-DMAC7.html)
JP (1) JP6433161B2 (cg-RX-API-DMAC7.html)
KR (2) KR102297508B1 (cg-RX-API-DMAC7.html)
CN (2) CN104233451B (cg-RX-API-DMAC7.html)
SG (2) SG10201802369YA (cg-RX-API-DMAC7.html)
TW (1) TWI643980B (cg-RX-API-DMAC7.html)

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US10903050B2 (en) 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
CN114514340B (zh) * 2019-07-26 2025-03-21 朗姆研究公司 先进封装应用的差别对比镀覆
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Also Published As

Publication number Publication date
KR102297508B1 (ko) 2021-09-02
US9689083B2 (en) 2017-06-27
US20140367279A1 (en) 2014-12-18
KR20140146015A (ko) 2014-12-24
SG10201802369YA (en) 2018-04-27
TW201510293A (zh) 2015-03-16
CN104233451A (zh) 2014-12-24
KR20210110787A (ko) 2021-09-09
SG10201402383QA (en) 2015-01-29
US20170241041A1 (en) 2017-08-24
KR102335508B1 (ko) 2021-12-06
US10508359B2 (en) 2019-12-17
JP2015001523A (ja) 2015-01-05
TWI643980B (zh) 2018-12-11
CN107858742B (zh) 2020-06-23
CN107858742A (zh) 2018-03-30
CN104233451B (zh) 2017-11-24

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