CN103014823B - 改进铜电沉积的添加剂效果快速判定方法 - Google Patents
改进铜电沉积的添加剂效果快速判定方法 Download PDFInfo
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- CN103014823B CN103014823B CN201310002555.5A CN201310002555A CN103014823B CN 103014823 B CN103014823 B CN 103014823B CN 201310002555 A CN201310002555 A CN 201310002555A CN 103014823 B CN103014823 B CN 103014823B
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- Prior art keywords
- additive
- plating solution
- positive plate
- hole
- anode plate
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- 230000000996 additive effect Effects 0.000 title claims abstract description 44
- 239000000654 additive Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 14
- 239000010949 copper Substances 0.000 title claims abstract description 14
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 12
- 230000000694 effects Effects 0.000 title abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000005684 electric field Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- -1 polydithio-dipropyl Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- VZCCTDLWCKUBGD-UHFFFAOYSA-N 8-[[4-(dimethylamino)phenyl]diazenyl]-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1N=NC1=CC=C(N=C2C(C=C(N)C=C2)=[N+]2C=3C=CC=CC=3)C2=C1 VZCCTDLWCKUBGD-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002555.5A CN103014823B (zh) | 2013-01-05 | 2013-01-05 | 改进铜电沉积的添加剂效果快速判定方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002555.5A CN103014823B (zh) | 2013-01-05 | 2013-01-05 | 改进铜电沉积的添加剂效果快速判定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103014823A CN103014823A (zh) | 2013-04-03 |
| CN103014823B true CN103014823B (zh) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310002555.5A Active CN103014823B (zh) | 2013-01-05 | 2013-01-05 | 改进铜电沉积的添加剂效果快速判定方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103014823B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6170938B2 (ja) | 2011-12-12 | 2017-07-26 | ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ | 電気めっき溶液内のレベラー濃度の監視 |
| US9689083B2 (en) | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
| CN103388172B (zh) * | 2013-07-22 | 2016-06-22 | 苏州昕皓新材料科技有限公司 | 一种快速判断电镀添加剂性能的方法 |
| US10094038B2 (en) | 2015-04-13 | 2018-10-09 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| CN105628755B (zh) * | 2015-12-30 | 2018-05-08 | 上海新阳半导体材料股份有限公司 | 一种双阳极检测镀液均镀性的方法 |
| CN108823608A (zh) * | 2018-06-19 | 2018-11-16 | 新疆中亚新材料科技有限公司 | 一种制造锂离子电池用双面光铜箔的添加剂 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0246494A1 (de) * | 1986-05-21 | 1987-11-25 | Siemens Aktiengesellschaft | Verfahren zur polarographischen Bestimmung von Zusätzen in galvanischen Bädern |
| JPH08178893A (ja) * | 1994-12-26 | 1996-07-12 | Nikko Kinzoku Kk | 電解液中添加剤濃度の測定方法および添加剤濃度の管理方法 |
| CN1186875A (zh) * | 1996-12-29 | 1998-07-08 | 中南工业大学 | 金属电积过程中在线控制有机添加剂的方法和装置 |
| US20050208201A1 (en) * | 2003-11-07 | 2005-09-22 | Makoto Kubota | Method and apparatus for determining the concentrations of additives in a plating solution |
| CN2828067Y (zh) * | 2005-06-09 | 2006-10-18 | 福州大学 | 电镀液中添加剂浓度的实时监测装置 |
| CN101004402A (zh) * | 2006-01-18 | 2007-07-25 | 伊希特化股份有限公司 | 监控铜电镀液填孔能力的方法 |
-
2013
- 2013-01-05 CN CN201310002555.5A patent/CN103014823B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0246494A1 (de) * | 1986-05-21 | 1987-11-25 | Siemens Aktiengesellschaft | Verfahren zur polarographischen Bestimmung von Zusätzen in galvanischen Bädern |
| JPH08178893A (ja) * | 1994-12-26 | 1996-07-12 | Nikko Kinzoku Kk | 電解液中添加剤濃度の測定方法および添加剤濃度の管理方法 |
| CN1186875A (zh) * | 1996-12-29 | 1998-07-08 | 中南工业大学 | 金属电积过程中在线控制有机添加剂的方法和装置 |
| US20050208201A1 (en) * | 2003-11-07 | 2005-09-22 | Makoto Kubota | Method and apparatus for determining the concentrations of additives in a plating solution |
| CN2828067Y (zh) * | 2005-06-09 | 2006-10-18 | 福州大学 | 电镀液中添加剂浓度的实时监测装置 |
| CN101004402A (zh) * | 2006-01-18 | 2007-07-25 | 伊希特化股份有限公司 | 监控铜电镀液填孔能力的方法 |
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| Publication number | Publication date |
|---|---|
| CN103014823A (zh) | 2013-04-03 |
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