JP2015001523A5 - - Google Patents
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- Publication number
- JP2015001523A5 JP2015001523A5 JP2014115335A JP2014115335A JP2015001523A5 JP 2015001523 A5 JP2015001523 A5 JP 2015001523A5 JP 2014115335 A JP2014115335 A JP 2014115335A JP 2014115335 A JP2014115335 A JP 2014115335A JP 2015001523 A5 JP2015001523 A5 JP 2015001523A5
- Authority
- JP
- Japan
- Prior art keywords
- potential
- electrode
- current density
- experiment
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 claims 44
- 238000000034 method Methods 0.000 claims 33
- 238000002474 experimental method Methods 0.000 claims 29
- 239000000243 solution Substances 0.000 claims 21
- 239000000758 substrate Substances 0.000 claims 10
- 239000000654 additive Substances 0.000 claims 8
- 239000000463 material Substances 0.000 claims 8
- 230000000996 additive effect Effects 0.000 claims 7
- 238000012360 testing method Methods 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 238000005429 filling process Methods 0.000 claims 4
- 239000003792 electrolyte Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 230000001133 acceleration Effects 0.000 claims 1
- 238000003486 chemical etching Methods 0.000 claims 1
- 238000012937 correction Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000012487 rinsing solution Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361835418P | 2013-06-14 | 2013-06-14 | |
| US61/835,418 | 2013-06-14 | ||
| US14/275,750 | 2014-05-12 | ||
| US14/275,750 US9689083B2 (en) | 2013-06-14 | 2014-05-12 | TSV bath evaluation using field versus feature contrast |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015001523A JP2015001523A (ja) | 2015-01-05 |
| JP2015001523A5 true JP2015001523A5 (cg-RX-API-DMAC7.html) | 2017-07-13 |
| JP6433161B2 JP6433161B2 (ja) | 2018-12-05 |
Family
ID=52018295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014115335A Active JP6433161B2 (ja) | 2013-06-14 | 2014-06-04 | フィールド対フィーチャのコントラストを用いたtsv浴評価 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9689083B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6433161B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR102297508B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN104233451B (cg-RX-API-DMAC7.html) |
| SG (2) | SG10201802369YA (cg-RX-API-DMAC7.html) |
| TW (1) | TWI643980B (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6170938B2 (ja) | 2011-12-12 | 2017-07-26 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 電気めっき溶液内のレベラー濃度の監視 |
| US9598787B2 (en) * | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| US9689083B2 (en) | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
| JP6890375B2 (ja) * | 2014-10-21 | 2021-06-18 | 株式会社半導体エネルギー研究所 | 装置 |
| US10094038B2 (en) | 2015-04-13 | 2018-10-09 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| CN105018977B (zh) * | 2015-07-17 | 2017-09-12 | 深圳市板明科技有限公司 | 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液 |
| US10508357B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| WO2017204019A1 (ja) * | 2016-05-27 | 2017-11-30 | 公立大学法人大阪府立大学 | 電気銅めっき液評価システム、電気銅めっき液評価方法および電気銅めっき液評価用チップ |
| US20180202060A1 (en) * | 2017-01-18 | 2018-07-19 | Eci Technology, Inc. | Measurement of total accelerator in an electrodeposition solution |
| US10094035B1 (en) * | 2017-10-16 | 2018-10-09 | Lam Research Corporation | Convection optimization for mixed feature electroplating |
| KR102785430B1 (ko) * | 2017-11-17 | 2025-03-21 | 라시크 아이엔씨. | 기재로부터의 프로세스 가스의 저장 및 전달을 위한 방법, 시스템, 및 디바이스 |
| JP6971915B2 (ja) * | 2018-06-05 | 2021-11-24 | 株式会社荏原製作所 | めっき方法、めっき装置、及び限界電流密度を推定する方法 |
| US10903050B2 (en) | 2018-12-10 | 2021-01-26 | Lam Research Corporation | Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity |
| CN114514340B (zh) * | 2019-07-26 | 2025-03-21 | 朗姆研究公司 | 先进封装应用的差别对比镀覆 |
| US12305307B2 (en) | 2020-01-10 | 2025-05-20 | Lam Research Corporation | TSV process window and fill performance enhancement by long pulsing and ramping |
| CN113311032B (zh) * | 2020-02-27 | 2024-05-31 | 芯恩(青岛)集成电路有限公司 | Ecp填充监测设备及监测方法 |
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| US8535504B2 (en) * | 2010-05-03 | 2013-09-17 | Eci Technology, Inc. | Analysis of an auxiliary leveler additive in an acid copper plating bath |
| CN102286760B (zh) | 2010-05-19 | 2016-10-05 | 诺发系统有限公司 | 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 |
| JP2013077619A (ja) | 2011-09-29 | 2013-04-25 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP6170938B2 (ja) | 2011-12-12 | 2017-07-26 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 電気めっき溶液内のレベラー濃度の監視 |
| CN103014823B (zh) | 2013-01-05 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | 改进铜电沉积的添加剂效果快速判定方法 |
| US9689083B2 (en) | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
-
2014
- 2014-05-12 US US14/275,750 patent/US9689083B2/en active Active
- 2014-05-16 SG SG10201802369YA patent/SG10201802369YA/en unknown
- 2014-05-16 SG SG10201402383QA patent/SG10201402383QA/en unknown
- 2014-06-04 JP JP2014115335A patent/JP6433161B2/ja active Active
- 2014-06-13 TW TW103120592A patent/TWI643980B/zh active
- 2014-06-16 CN CN201410268283.8A patent/CN104233451B/zh active Active
- 2014-06-16 CN CN201710979575.6A patent/CN107858742B/zh active Active
- 2014-06-16 KR KR1020140073074A patent/KR102297508B1/ko active Active
-
2017
- 2017-05-09 US US15/590,718 patent/US10508359B2/en active Active
-
2021
- 2021-08-27 KR KR1020210114197A patent/KR102335508B1/ko active Active
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