JP6410626B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6410626B2
JP6410626B2 JP2015022301A JP2015022301A JP6410626B2 JP 6410626 B2 JP6410626 B2 JP 6410626B2 JP 2015022301 A JP2015022301 A JP 2015022301A JP 2015022301 A JP2015022301 A JP 2015022301A JP 6410626 B2 JP6410626 B2 JP 6410626B2
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JP
Japan
Prior art keywords
blade
cutting
cutting blade
spindle
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015022301A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016144839A (ja
Inventor
聡 花島
聡 花島
栄一 吉村
栄一 吉村
洋行 平賀
洋行 平賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2015022301A priority Critical patent/JP6410626B2/ja
Priority to TW104144042A priority patent/TWI672193B/zh
Priority to KR1020160011145A priority patent/KR102407413B1/ko
Priority to CN201610080291.9A priority patent/CN105856443B/zh
Publication of JP2016144839A publication Critical patent/JP2016144839A/ja
Application granted granted Critical
Publication of JP6410626B2 publication Critical patent/JP6410626B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
JP2015022301A 2015-02-06 2015-02-06 切削装置 Active JP6410626B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015022301A JP6410626B2 (ja) 2015-02-06 2015-02-06 切削装置
TW104144042A TWI672193B (zh) 2015-02-06 2015-12-28 切削裝置
KR1020160011145A KR102407413B1 (ko) 2015-02-06 2016-01-29 절삭 장치
CN201610080291.9A CN105856443B (zh) 2015-02-06 2016-02-04 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015022301A JP6410626B2 (ja) 2015-02-06 2015-02-06 切削装置

Publications (2)

Publication Number Publication Date
JP2016144839A JP2016144839A (ja) 2016-08-12
JP6410626B2 true JP6410626B2 (ja) 2018-10-24

Family

ID=56624016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022301A Active JP6410626B2 (ja) 2015-02-06 2015-02-06 切削装置

Country Status (4)

Country Link
JP (1) JP6410626B2 (zh)
KR (1) KR102407413B1 (zh)
CN (1) CN105856443B (zh)
TW (1) TWI672193B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113799190B (zh) 2017-05-01 2023-04-25 艾利丹尼森零售信息服务公司 使用切割装置来减少标签浪费的方法
JP6560714B2 (ja) * 2017-06-26 2019-08-14 Ｔｏｗａ株式会社 ブレード交換機構、切断装置およびブレード交換方法
JP6966883B2 (ja) * 2017-07-04 2021-11-17 株式会社ディスコ ブレード脱着治具、ブレード脱着方法、ブレード取り出し方法、及び切削装置
JP6998158B2 (ja) * 2017-09-07 2022-01-18 株式会社ディスコ 切削ブレード供給装置
JP6612372B2 (ja) * 2018-01-30 2019-11-27 Ｔｏｗａ株式会社 フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法
JP7126749B2 (ja) * 2018-03-19 2022-08-29 株式会社ディスコ 切削装置
JP7206065B2 (ja) * 2018-07-26 2023-01-17 株式会社ディスコ 切削装置
JP7258566B2 (ja) * 2019-01-16 2023-04-17 株式会社東京精密 平面加工装置
JP7157674B2 (ja) * 2019-01-30 2022-10-20 株式会社ディスコ ブレード交換ユニット
JP7341602B2 (ja) * 2019-05-13 2023-09-11 株式会社ディスコ 切削装置
JP2021013968A (ja) * 2019-07-10 2021-02-12 株式会社ディスコ 加工装置
CN112466785B (zh) * 2020-11-23 2022-09-02 江西世星科技有限公司 一种集成电路v形槽开槽机
TWI765709B (zh) * 2021-05-19 2022-05-21 佳陞科技有限公司 換刀裝置及換刀裝置操作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641084B2 (ja) * 1987-10-06 1994-06-01 三菱電機株式会社 加工プログラムの工具位置情報補正方法
JP2598721B2 (ja) * 1991-03-27 1997-04-09 大日本スクリーン製造株式会社 回転式基板処理装置
JP2617876B2 (ja) 1994-02-04 1997-06-04 株式会社ディスコ ブレードオートチェンジャー
JPH10154646A (ja) * 1996-11-22 1998-06-09 Nikon Corp 搬送装置
JP4104099B2 (ja) * 1999-07-09 2008-06-18 東京エレクトロン株式会社 プローブカード搬送機構
JP2001077178A (ja) * 1999-09-03 2001-03-23 Dainippon Screen Mfg Co Ltd 基板有無検出装置及び基板有無検出方法
JP4246420B2 (ja) * 2000-09-14 2009-04-02 平田機工株式会社 Ｆｏｕｐオープナ及びｆｏｕｐオープナのマッピング方法
JP2002154054A (ja) 2000-11-17 2002-05-28 Disco Abrasive Syst Ltd 切削ブレードの装着機構
JP4210462B2 (ja) * 2002-03-29 2009-01-21 株式会社ディスコ 切削装置
JP2007229843A (ja) * 2006-02-28 2007-09-13 Disco Abrasive Syst Ltd 切削装置
US7495759B1 (en) * 2007-10-23 2009-02-24 Asm Assembly Automation Ltd. Damage and wear detection for rotary cutting blades
JP2010253619A (ja) * 2009-04-24 2010-11-11 Aw Service:Kk 可搬型切削液再利用処理装置及びそれを用いる切削液再利用処理方法
JP5415184B2 (ja) * 2009-08-21 2014-02-12 株式会社ディスコ 切削装置
JP5457131B2 (ja) * 2009-10-07 2014-04-02 株式会社ディスコ ブレード交換装置
JP2012004414A (ja) * 2010-06-18 2012-01-05 Disco Abrasive Syst Ltd 切削装置
WO2013054576A1 (ja) * 2011-10-12 2013-04-18 株式会社村田製作所 加工廃液処理装置及び加工廃液処理方法
JP6041380B2 (ja) * 2012-11-09 2016-12-07 株式会社ｉｎｄｕｓｔｒｉａ 加工液浄化システム
JP6069122B2 (ja) * 2013-07-22 2017-02-01 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
TWI672193B (zh) 2019-09-21
TW201634185A (zh) 2016-10-01
KR20160097132A (ko) 2016-08-17
JP2016144839A (ja) 2016-08-12
KR102407413B1 (ko) 2022-06-10
CN105856443B (zh) 2019-07-30
CN105856443A (zh) 2016-08-17

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