JP6269821B2 - 透過性評価方法 - Google Patents
透過性評価方法 Download PDFInfo
- Publication number
- JP6269821B2 JP6269821B2 JP2016513530A JP2016513530A JP6269821B2 JP 6269821 B2 JP6269821 B2 JP 6269821B2 JP 2016513530 A JP2016513530 A JP 2016513530A JP 2016513530 A JP2016513530 A JP 2016513530A JP 6269821 B2 JP6269821 B2 JP 6269821B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- heavy metal
- permeability
- evaluation method
- test piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000035699 permeability Effects 0.000 title claims description 76
- 238000011156 evaluation Methods 0.000 title claims description 66
- 239000007788 liquid Substances 0.000 claims description 123
- 229910001385 heavy metal Inorganic materials 0.000 claims description 111
- 150000002500 ions Chemical class 0.000 claims description 98
- 238000012360 testing method Methods 0.000 claims description 66
- 239000004065 semiconductor Substances 0.000 claims description 32
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 31
- 229910001431 copper ion Inorganic materials 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 239000003960 organic solvent Substances 0.000 claims description 15
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 210000004027 cell Anatomy 0.000 description 55
- 239000002313 adhesive film Substances 0.000 description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 24
- 239000010703 silicon Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- 238000005259 measurement Methods 0.000 description 22
- 238000012856 packing Methods 0.000 description 18
- 239000000243 solution Substances 0.000 description 15
- 238000005247 gettering Methods 0.000 description 14
- -1 vinyl resins, acrylic Chemical compound 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 210000005056 cell body Anatomy 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052938 sodium sulfate Inorganic materials 0.000 description 4
- 235000011152 sodium sulphate Nutrition 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000003586 protic polar solvent Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- STTGYIUESPWXOW-UHFFFAOYSA-N 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline Chemical compound C=12C=CC3=C(C=4C=CC=CC=4)C=C(C)N=C3C2=NC(C)=CC=1C1=CC=CC=C1 STTGYIUESPWXOW-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 241001424392 Lucia limbaria Species 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 159000000021 acetate salts Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910001451 bismuth ion Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- WLZRMCYVCSSEQC-UHFFFAOYSA-N cadmium(2+) Chemical compound [Cd+2] WLZRMCYVCSSEQC-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000010220 ion permeability Effects 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910001437 manganese ion Inorganic materials 0.000 description 1
- 238000001819 mass spectrum Methods 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 1
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/08—Investigating permeability, pore-volume, or surface area of porous materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N2013/003—Diffusion; diffusivity between liquids
Landscapes
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Adhesive Tapes (AREA)
- Sampling And Sample Adjustment (AREA)
Description
エポキシ樹脂としてYDCN−703(東都化成株式会社製、商品名、クレゾールノボラック型エポキシ樹脂、エポキシ当量210、分子量1200、軟化点80℃)55質量部と、フェノール樹脂としてミレックスXLC−LL(三井化学株式会社製、商品名、フェノール樹脂、水酸基当量175、吸水率1.8%、350℃における加熱質量減少率4%)45質量部と、シランカップリング剤としてNUC A−189(日本ユニカー株式会社製、商品名、γ−メルカプトプロピルトリメトキシシラン)1.7質量部及びNUCA−1160(日本ユニカー株式会社製、商品名、γ−ウレイドプロピルトリエトキシシラン)3.2質量部と、フィラーとしてアエロジルR972(シリカ表面にジメチルジクロロシランを被覆し、400℃の反応器中で加水分解させた、メチル基等の有機基を表面に有するフィラー、日本アエロジル株式会社製、商品名、シリカ、平均粒径0.016μm)32質量部とからなる組成物にシクロヘキサノンを加えて攪拌混合した後、ビーズミルを用いて90分混練した。
エポキシ樹脂としてYDCN−703(東都化成株式会社製、商品名、クレゾールノボラック型エポキシ樹脂、エポキシ当量210、分子量1200、軟化点80℃)15質量部と、フェノール樹脂としてミレックスXLC−LL(三井化学株式会社製、商品名、フェノール樹脂、水酸基当量175、吸水率1.8%、350℃における加熱質量減少率4%)12質量部と、フィラーとして球状シリカ(株式会社アドマテックス製、商品名:SO−25R、平均粒径0.5μm)200質量部と、シクロヘキサノンとを加えて攪拌混合した後、ビーズミルを用いて90分混練した。
ポリアクリル酸水溶液(Nv=25%、粘度8000〜12000mPa・s)、硫酸銅水溶液(銅元素換算500mg/kg)及び蒸留水を適宜混合し、Nv=1%、銅イオン含有量5000mg/kg(対固形分)となる銅イオン含有ポリアクリル酸水溶液を調製した。この水溶液をカバーガラス上にキャストした。そして、ホットプレート上にて100℃10分乾燥した後に175℃10分乾燥することにより、銅イオンで汚染されたガラス基板を作製した。
(実施例1)
[A液の調製]
無水硫酸銅(II)2.0gを蒸留水1020gに溶解し、完全に硫酸銅が溶解するまでよく撹拌することにより、銅イオン濃度がCu元素換算で濃度500mg/kgとなるように調整した硫酸銅水溶液を調製した。この水溶液をA液として用いた。
無水硫酸ナトリウム1.0gを蒸留水1000gに溶解し、完全に硫酸ナトリウムが溶解するまでよく撹拌した。これにN−メチル−2−ピロリドン(NMP)を1000g加え、よくかき混ぜた。その後、室温になるまで空冷して溶液を得た。この溶液をB液として用いた。
上記で作製した接着フィルムA(厚さ20μm)を、直径約3cmの円状に切り抜いた。次に、厚さ1.5mm、外径約3cm、内径1.8cmのシリコンパッキンシートを2枚作製した。接着フィルムAを2枚のシリコンパッキンシートで挟んだ。シリコンパッキンシートで挟んだ接着フィルムAを容積50mlの2つのガラス製セル(図1の構成を有するセル)のフランジ部で挟み、ゴムバンドで固定した。
B液の構成成分を下記表2,3に示す成分に変更したことを除き実施例1と同様に評価を行った。結果を表2,3に示す。
電圧を印加しなかったことを除き実施例1と同様に評価を行った。結果を下記表3に示す。
(実施例5)
実施例1と同様のA液及びB液を準備した。
B液の構成成分を下記表4,5に示す成分に変更したことを除き実施例5と同様に評価を行った。結果を表4,5に示す。
Claims (8)
- 試験片に対する重金属イオンの透過性を評価する透過性評価方法であって、
重金属イオンを含有する第1の液と、水及び有機溶媒を含有する第2の液とが試験片を介して隔てられた状態で、前記第1の液側に設けられた陽極と、前記第2の液側に設けられた陰極との間に電圧を印加して前記陽極と前記陰極との間に流れる電流値を測定する工程を備え、
前記試験片が、半導体製造に用いられる絶縁材料を含有し、
前記第1の液の重金属イオン濃度が0.5mg/kg以上である、透過性評価方法。 - 試験片に対する重金属イオンの透過性を評価する透過性評価方法であって、
重金属イオンを含有する第1の液と、水及び有機溶媒を含有する第2の液とが試験片を介して隔てられた状態で、前記第1の液側に設けられた陽極と、前記第2の液側に設けられた陰極との間に電圧を印加した後に前記第2の液の重金属イオン濃度を測定する工程を備え、
前記試験片が、半導体製造に用いられる絶縁材料を含有し、
前記第1の液の重金属イオン濃度が0.5mg/kg以上である、透過性評価方法。 - 前記第2の液が前記有機溶媒としてN−メチル−2−ピロリドンを含有する、請求項1又は2に記載の評価方法。
- 前記第2の液のN−メチル−2−ピロリドンの含有量が20質量%以上80質量%以下である、請求項3に記載の評価方法。
- 前記第2の液の導電率が23℃において1μS以上である、請求項1〜4のいずれか一項に記載の評価方法。
- 前記第1の液が前記重金属イオンとして銅イオンを含有する、請求項1〜5のいずれか一項に記載の評価方法。
- 前記第1の液の銅イオン濃度が50000mg/kg以下である、請求項6に記載の評価方法。
- 前記半導体製造に用いられる絶縁材料が半導体用接着テープである、請求項1〜7いずれか一項に記載の評価方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/060726 WO2015159367A1 (ja) | 2014-04-15 | 2014-04-15 | 透過性評価方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015159367A1 JPWO2015159367A1 (ja) | 2017-04-13 |
JP6269821B2 true JP6269821B2 (ja) | 2018-01-31 |
Family
ID=54323614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016513530A Active JP6269821B2 (ja) | 2014-04-15 | 2014-04-15 | 透過性評価方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10598622B2 (ja) |
JP (1) | JP6269821B2 (ja) |
KR (1) | KR102239642B1 (ja) |
CN (1) | CN106170693B (ja) |
TW (1) | TWI669503B (ja) |
WO (1) | WO2015159367A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10338020B2 (en) | 2015-01-29 | 2019-07-02 | Lg Chem, Ltd. | Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film |
KR101761891B1 (ko) | 2015-01-29 | 2017-08-04 | 주식회사 엘지화학 | 고분자 필름의 금속 이온 투과도 측정 방법 및 고분자 필름의 금속 이온 투과도 측정 장치 |
CN107807083A (zh) * | 2017-10-27 | 2018-03-16 | 广东电网有限责任公司电力科学研究院 | 一种硅橡胶渗透性的测试方法及其测试装置 |
CN108717934B (zh) * | 2018-05-23 | 2020-12-04 | 上海华力微电子有限公司 | 金属离子监控方法 |
CN117491245A (zh) * | 2023-11-06 | 2024-02-02 | 广州美域医学检验有限公司 | 一种评价树脂材料盐渗透性的方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61226637A (ja) * | 1985-03-30 | 1986-10-08 | Agency Of Ind Science & Technol | 膜の透過率および拡散定数の測定方法 |
JP2966874B2 (ja) * | 1990-02-27 | 1999-10-25 | 浜松ホトニクス株式会社 | 被試験用膜の物質透過性能を評価する方法および装置 |
JPH05326661A (ja) * | 1992-05-25 | 1993-12-10 | Matsushita Electron Corp | 絶縁膜欠陥検出方法 |
JP2904697B2 (ja) * | 1993-11-08 | 1999-06-14 | 大日本スクリーン製造株式会社 | 半導体ウェハのc−v測定方法および可動イオン量測定方法 |
JP3248039B2 (ja) * | 1994-01-14 | 2002-01-21 | コニカ株式会社 | ソータ |
JP2000040726A (ja) * | 1998-07-24 | 2000-02-08 | Nippon Telegr & Teleph Corp <Ntt> | 誘電体膜の評価方法 |
US20060157355A1 (en) * | 2000-03-21 | 2006-07-20 | Semitool, Inc. | Electrolytic process using anion permeable barrier |
KR100629683B1 (ko) * | 1999-11-02 | 2006-09-29 | 김태진 | 필름의 산소 투과도 측정 장치 및 이를 이용한 산소투과도 측정방법 |
JP2002156359A (ja) * | 2000-11-16 | 2002-05-31 | Hitachi Chem Co Ltd | プリント配線板用絶縁材料のイオンマイグレーション発生評価試験方法 |
DE102005040592A1 (de) * | 2005-08-26 | 2007-03-01 | Heinze, Peter, Dipl.-Ing. | Verfahren zur Bestimmung der Ionendurchlässigkeit von Korrosionsschutzbeschichtungen |
DE102006030224A1 (de) * | 2006-06-30 | 2008-01-03 | Imi Intelligent Medical Implants Ag | Vorrichtung und Verfahren zum Überprüfen der Dichtigkeit von Feuchtigkeitsbarrieren für Implantate |
JP5049063B2 (ja) * | 2007-07-09 | 2012-10-17 | 株式会社アツミテック | イオン伝導性電解質膜の検査方法および検査装置 |
TW200928358A (en) * | 2007-12-27 | 2009-07-01 | Ying Shr | Heavy metal detection method |
CN201163274Y (zh) | 2008-01-22 | 2008-12-10 | 中国建筑科学研究院 | 混凝土氯离子电通量测定仪 |
JP5326661B2 (ja) * | 2009-03-02 | 2013-10-30 | 株式会社ジェイテクト | 砥石成形方法 |
JP2011222779A (ja) * | 2010-04-09 | 2011-11-04 | Dainippon Printing Co Ltd | 薄膜素子用基板の製造方法、薄膜素子の製造方法および薄膜トランジスタの製造方法 |
JP2011213878A (ja) | 2010-03-31 | 2011-10-27 | Lintec Corp | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
CN101832966B (zh) * | 2010-05-28 | 2012-12-19 | 东北大学 | 金属氢渗透性能测定的装置及方法 |
JP2012216621A (ja) | 2011-03-31 | 2012-11-08 | Lintec Corp | 樹脂膜のゲッタリング性能評価方法 |
JP2012216622A (ja) | 2011-03-31 | 2012-11-08 | Lintec Corp | 樹脂膜のゲッタリング性能評価方法 |
JP2012241157A (ja) | 2011-05-23 | 2012-12-10 | Nitto Denko Corp | 半導体装置製造用の接着剤組成物、及び、半導体装置製造用の接着シート |
JP5777098B2 (ja) * | 2011-08-26 | 2015-09-09 | Jfeスチール株式会社 | 金属内部への侵入水素量の測定方法および移動体の金属部位内部へ侵入する水素量のモニタリング方法 |
CN102866094B (zh) * | 2012-09-09 | 2015-02-25 | 中国科学院金属研究所 | 一种隔膜四价钒离子渗透率的测试方法 |
CN203164096U (zh) | 2013-04-24 | 2013-08-28 | 中国石油天然气股份有限公司 | 一种涂膜耐氯离子渗透性评价试验装置 |
-
2014
- 2014-04-15 JP JP2016513530A patent/JP6269821B2/ja active Active
- 2014-04-15 CN CN201480077969.7A patent/CN106170693B/zh active Active
- 2014-04-15 US US15/304,430 patent/US10598622B2/en active Active
- 2014-04-15 KR KR1020167028360A patent/KR102239642B1/ko active IP Right Grant
- 2014-04-15 WO PCT/JP2014/060726 patent/WO2015159367A1/ja active Application Filing
-
2015
- 2015-04-14 TW TW104111852A patent/TWI669503B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201546449A (zh) | 2015-12-16 |
JPWO2015159367A1 (ja) | 2017-04-13 |
CN106170693B (zh) | 2020-03-03 |
CN106170693A (zh) | 2016-11-30 |
KR102239642B1 (ko) | 2021-04-12 |
US20170038324A1 (en) | 2017-02-09 |
WO2015159367A1 (ja) | 2015-10-22 |
TWI669503B (zh) | 2019-08-21 |
KR20160145010A (ko) | 2016-12-19 |
US10598622B2 (en) | 2020-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6269821B2 (ja) | 透過性評価方法 | |
CN105206546A (zh) | 覆晶芯片失效分析方法及电性定位中检测样品的制备方法 | |
WO2016031067A1 (ja) | はんだ材料、はんだ継手及びはんだ材料の製造方法 | |
CN103576039B (zh) | 找到连接孔顶部开路的方法 | |
CN102565680A (zh) | 半导体器件的失效分析方法 | |
KR20180105205A (ko) | 이방 도전성 접합 부재, 반도체 디바이스, 반도체 패키지 및 반도체 디바이스의 제조 방법 | |
EP3032545A1 (en) | A conductive paste containing lead-free glass frit | |
EP3032546A1 (en) | A conductive paste containing lead-free glass frit | |
JP2009010057A (ja) | 電子素子の実装方法 | |
JP6464921B2 (ja) | 透過性評価方法 | |
JP2008122136A (ja) | 重金属イオンセンサ | |
US10629557B2 (en) | Improving mechanical and thermal reliability in varying form factors | |
CN103956974B (zh) | 一种确认半成品电池片抗pid性能的测试方法 | |
CN205656237U (zh) | 半导体绝缘电阻测量装置 | |
TWI417539B (zh) | Nickel oxide base pH sensor and its manufacturing method | |
JP7452187B2 (ja) | 重金属イオンの拡散性の評価方法、及び、構造体の製造方法 | |
Schwab et al. | Investigation of electric field induced ion migration in semiconductor encapsulation materials without the interference of electron conductivity | |
CN108594541A (zh) | 一种封框胶及其制备方法、液晶显示面板 | |
JP2003147317A (ja) | 接着用樹脂ペースト組成物及びこれを用いた半導体装置 | |
JP2003147316A (ja) | 接着用樹脂ペースト組成物及びこれを用いた半導体装置 | |
Lall et al. | Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages | |
Chen et al. | Investigation of electrochemical migration on fine pitch BGA package | |
Lall et al. | Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application | |
JP2004059709A (ja) | 半導体封止用液状エポキシ樹脂組成物及び半導体装置 | |
KR20140129922A (ko) | 반도체용 접착 조성물, 이를 이용하여 제조된 반도체용 접착 필름 및 반도체 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170217 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171205 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171218 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6269821 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |