JP6464921B2 - 透過性評価方法 - Google Patents
透過性評価方法 Download PDFInfo
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- JP6464921B2 JP6464921B2 JP2015101942A JP2015101942A JP6464921B2 JP 6464921 B2 JP6464921 B2 JP 6464921B2 JP 2015101942 A JP2015101942 A JP 2015101942A JP 2015101942 A JP2015101942 A JP 2015101942A JP 6464921 B2 JP6464921 B2 JP 6464921B2
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- 238000011156 evaluation Methods 0.000 title claims description 65
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- 229910001385 heavy metal Inorganic materials 0.000 claims description 106
- 150000002500 ions Chemical class 0.000 claims description 93
- 238000012360 testing method Methods 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 43
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- 239000004065 semiconductor Substances 0.000 claims description 26
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 21
- 229910001431 copper ion Inorganic materials 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 239000003960 organic solvent Substances 0.000 claims description 14
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- 229910052710 silicon Inorganic materials 0.000 description 29
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
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- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
[接着フィルムA(B−stage品、C−stage品)の作製]
まず、熱硬化性成分としてYDCN−700(東都化成株式会社製、商品名、クレゾールノボラック型エポキシ樹脂)10質量部及びミレックスXLC−LL(三井化学株式会社製、商品名、フェノール樹脂)10質量部と、シランカップリング剤としてNUC A−189(日本ユニカー株式会社製、商品名、γ−メルカプトプロピルトリメトキシシラン)1質量部及びNUCA−1160(日本ユニカー株式会社製、商品名、γ−ウレイドプロピルトリエトキシシラン)1質量部と、フィラーとしてアエロジルR972(日本アエロジル株式会社製、商品名、シリカ、平均粒径0.016μm)10質量部とからなる組成物にシクロヘキサノンを加えて撹拌混合した後、ビーズミルを用いて90分混練した。
まず、熱硬化性成分として1032H60(ジャパンエポキシレジン株式会社製、トリス(ヒドロキシフェニル)メタン型固形エポキシ樹脂)45質量部、YL−983U(ジャパンエポキシレジン株式会社製、ビスフェノールF型液状エポキシ樹脂)15質量部、及び、YL−7175(ジャパンエポキシレジン株式会社製、長鎖ビスフェノールF型エポキシ樹脂)5質量部と、硬化剤として2MAOK(四国化成工業株式会社製、2,4−ジアミノ−6−[2’−メチルイミダゾジル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物)2質量部と、フラックス成分としてアジピン酸(和光純薬工業株式会社製、試薬)2質量部及びZX−1356−2(東都化成株式会社製、BPA/BPF共重合型フェノキシ樹脂(重量平均分子量(Mw)6万))30質量部とを、トルエンと酢酸エチルの混合溶媒中に溶解した。
まず、熱硬化性成分としてE−1032−H60(ジャパンエポキシレジン株式会社製、多官能エポキシ樹脂)3質量部と、硬化剤としてジアミノジフェニルスルホン(和光純薬工業株式会社製、試薬)2質量部と、シランカップリング剤としてNUC A−189(日本ユニカー株式会社製、商品名、γ−メルカプトプロピルトリメトキシシラン)1質量部及びNUCA−1160(日本ユニカー株式会社製、商品名、γ−ウレイドプロピルトリエトキシシラン)1質量部と、フィラーとしてアエロジルR972(日本アエロジル株式会社製、商品名、シリカ、平均粒径0.016μm)10質量部とからなる組成物にシクロヘキサノンを加えて撹拌混合した後、ビーズミルを用いて90分混練した。
ポリアクリル酸水溶液(Nv=25%、粘度8000〜12000mPa・s)、硫酸銅水溶液(銅元素換算500mg/kg)及び蒸留水を適宜混合し、Nv=1%、銅イオン含有量5000mg/kg(対固形分)となる銅イオン含有ポリアクリル酸水溶液を調製した。この水溶液をカバーガラス上にキャストした。そして、ホットプレート上にて100℃10分乾燥した後に175℃10分乾燥することにより、銅イオンで汚染されたガラス基板を作製した。
(実施例1)
[A液の調製]
硫酸銅(II)五水和物4.0gを蒸留水2040gに溶解し、完全に硫酸銅が溶解するまでよく撹拌することにより、銅イオン濃度がCu元素換算で濃度500mg/kg(500ppm)となるように調整した硫酸銅水溶液を調製した。この水溶液をA液として用いた。
無水硫酸ナトリウム1.0gを蒸留水1000gに溶解し、完全に硫酸ナトリウムが溶解するまでよく撹拌した。これにN−メチル−2−ピロリドン(NMP)を1000g加え、よくかき混ぜた。その後、室温になるまで空冷して溶液を得た。この溶液をB液として用いた。
上記で作製した接着フィルムA(C−stage品、厚さ20μm)を、直径約3cmの円状に切り抜いた。次に、厚さ1.5mm、外径約3cm、内径1.8cmのシリコンパッキンシートを2枚作製した。接着フィルムAを2枚のシリコンパッキンシートで挟んだ。シリコンパッキンシートで挟んだ接着フィルムAを容積50mlの2つのガラス製セル(図1の構成を有するセル)のフランジ部で挟み、ゴムバンドで固定した。
A液の構成成分を、下記表2に示す成分に変更したことを除き実施例1と同様に評価を行った。結果を表2に示す。
実施例1と同様のA液及びB液を準備した。
A液の構成成分、B液の構成成分及び印加電圧を、下記表3に示す条件に変更した以外は実施例1と同様に実施した。結果を表3に示す。
(実施例4)
実施例1と同様のA液及びB液を準備した。
Claims (8)
- 試験片に対する重金属イオンの透過性を評価する透過性評価方法であって、
重金属イオンを含有する第1の液と、水及び有機溶媒を含有する第2の液とが試験片を介して隔てられた状態で、前記第1の液に接する陽極と、前記第2の液に接する陰極との間に電圧を印加して前記陽極と前記陰極との間に流れる電流値を測定する工程を備え、
前記第1の液の重金属イオン濃度が5mg/kg以上であり、
前記試験片が、半導体製造に用いられる絶縁材料を含有し、
前記絶縁材料が硬化性材料の硬化物を含む、透過性評価方法。 - 試験片に対する重金属イオンの透過性を評価する透過性評価方法であって、
重金属イオンを含有する第1の液と、水及び有機溶媒を含有する第2の液とが試験片を介して隔てられた状態で、前記第1の液に接する陽極と、前記第2の液に接する陰極との間に電圧を印加した後に前記第2の液の重金属イオン濃度を測定する工程を備え、
前記第1の液の重金属イオン濃度が5mg/kg以上であり、
前記試験片が、半導体製造に用いられる絶縁材料を含有し、
前記絶縁材料が硬化性材料の硬化物を含む、透過性評価方法。 - 前記第2の液が前記有機溶媒としてN−メチル−2−ピロリドンを含有する、請求項1又は2に記載の評価方法。
- 前記第2の液のN−メチル−2−ピロリドンの含有量が20質量%以上80質量%以下である、請求項3に記載の評価方法。
- 前記第2の液の導電率が23℃において1μS以上である、請求項1〜4のいずれか一項に記載の評価方法。
- 前記第1の液が前記重金属イオンとして銅イオンを含有する、請求項1〜5のいずれか一項に記載の評価方法。
- 前記第1の液の銅イオン濃度が50000mg/kg以下である、請求項6に記載の評価方法。
- 前記硬化性材料が、熱硬化性材料、エネルギー線硬化性材料及び湿気硬化性材料からなる群より選ばれる少なくとも1種である、請求項1〜7いずれか一項に記載の評価方法。
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