JP6259366B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP6259366B2
JP6259366B2 JP2014141732A JP2014141732A JP6259366B2 JP 6259366 B2 JP6259366 B2 JP 6259366B2 JP 2014141732 A JP2014141732 A JP 2014141732A JP 2014141732 A JP2014141732 A JP 2014141732A JP 6259366 B2 JP6259366 B2 JP 6259366B2
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JP
Japan
Prior art keywords
polishing
rotary joint
ring
cooling water
polishing table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014141732A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016016491A5 (enExample
JP2016016491A (ja
Inventor
相澤　英夫
英夫 相澤
正雄 梅本
正雄 梅本
曽根　忠一
忠一 曽根
隆一 小菅
隆一 小菅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2014141732A priority Critical patent/JP6259366B2/ja
Priority to SG10201505284QA priority patent/SG10201505284QA/en
Priority to KR1020150095813A priority patent/KR102314416B1/ko
Priority to US14/792,062 priority patent/US9522453B2/en
Publication of JP2016016491A publication Critical patent/JP2016016491A/ja
Publication of JP2016016491A5 publication Critical patent/JP2016016491A5/ja
Application granted granted Critical
Publication of JP6259366B2 publication Critical patent/JP6259366B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2014141732A 2014-07-09 2014-07-09 研磨装置 Active JP6259366B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置
SG10201505284QA SG10201505284QA (en) 2014-07-09 2015-07-03 Polishing apparatus
KR1020150095813A KR102314416B1 (ko) 2014-07-09 2015-07-06 연마 장치
US14/792,062 US9522453B2 (en) 2014-07-09 2015-07-06 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置

Publications (3)

Publication Number Publication Date
JP2016016491A JP2016016491A (ja) 2016-02-01
JP2016016491A5 JP2016016491A5 (enExample) 2017-08-03
JP6259366B2 true JP6259366B2 (ja) 2018-01-10

Family

ID=55066894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014141732A Active JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置

Country Status (4)

Country Link
US (1) US9522453B2 (enExample)
JP (1) JP6259366B2 (enExample)
KR (1) KR102314416B1 (enExample)
SG (1) SG10201505284QA (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP7050560B2 (ja) * 2018-04-18 2022-04-08 株式会社荏原製作所 研磨装置及び基板処理装置
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
SG11202103477TA (en) * 2018-09-07 2021-05-28 Hangzhou Zhonggui Electronic Technology Co Ltd Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
CN119368489A (zh) * 2024-11-28 2025-01-28 江苏科沛达半导体科技有限公司 一种晶圆底面清洗装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3002300B2 (ja) * 1991-07-12 2000-01-24 日本トムソン株式会社 球面滑り軸受及びその製造方法
US5303959A (en) * 1993-02-01 1994-04-19 The Johnson Corporation High speed rotary joint
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
US6021695A (en) * 1996-11-11 2000-02-08 Hitachi Seiki Co., Ltd. Lathe and a machining system of a lathe
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
JP3192396B2 (ja) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 流体用ロータリジョイント
GB9726981D0 (en) * 1997-12-22 1998-02-18 Rolls Royce Plc Method and apparatus for grinding
JP2000000730A (ja) * 1998-06-12 2000-01-07 Yamato Kikai Kigu Kk 冷凍チャック
JP2000177984A (ja) * 1998-12-16 2000-06-27 Tadano Ltd 油圧作業機のロータリージョイント取付構造
JP2000205469A (ja) * 1999-01-13 2000-07-25 Surpass Kogyo Kk ロ―タリ―ジョイント
US6126207A (en) * 1999-03-08 2000-10-03 The Johnson Corporation Rotary joint with shear pins
JP2000254356A (ja) * 1999-03-12 2000-09-19 Kinki Sharyo Co Ltd 揺動装置
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6402602B1 (en) * 2001-01-04 2002-06-11 Speedfam-Ipec Corporation Rotary union for semiconductor wafer applications
JP2004042163A (ja) * 2002-07-09 2004-02-12 Ebara Corp 研磨装置及びその消耗・交換部品の貼付け剥がし方法
JP2004181586A (ja) * 2002-12-04 2004-07-02 Koyo Seiko Co Ltd 油圧ロータリージョイント及びこれを用いた超仕上機
JP2007222965A (ja) 2006-02-21 2007-09-06 Ebara Corp 研磨テーブルの定盤製造方法、研磨テーブル、及び研磨装置
KR101358645B1 (ko) * 2007-09-04 2014-02-05 삼성전자주식회사 웨이퍼 연마 캐리어 장치 및 그가 채용되는 화학적 기계적연마 설비
JP2009079652A (ja) * 2007-09-26 2009-04-16 Minebea Co Ltd 樹脂ライナ付き球面すべり軸受およびロッドエンド軸受
US20150118944A1 (en) * 2013-01-31 2015-04-30 Ebara Corporation Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
US20150017889A1 (en) * 2013-07-12 2015-01-15 Ebara Corporation Polishing apparatus
JP6362390B2 (ja) * 2014-04-10 2018-07-25 株式会社荏原製作所 ロータリージョイント、及び、研磨装置

Also Published As

Publication number Publication date
KR20160006611A (ko) 2016-01-19
SG10201505284QA (en) 2016-02-26
JP2016016491A (ja) 2016-02-01
US9522453B2 (en) 2016-12-20
US20160008948A1 (en) 2016-01-14
KR102314416B1 (ko) 2021-10-19

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