SG11202103477TA - Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit - Google Patents

Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit

Info

Publication number
SG11202103477TA
SG11202103477TA SG11202103477TA SG11202103477TA SG11202103477TA SG 11202103477T A SG11202103477T A SG 11202103477TA SG 11202103477T A SG11202103477T A SG 11202103477TA SG 11202103477T A SG11202103477T A SG 11202103477TA SG 11202103477T A SG11202103477T A SG 11202103477TA
Authority
SG
Singapore
Prior art keywords
wafer
planarization
chemical
transfer method
unit
Prior art date
Application number
SG11202103477TA
Inventor
Edwardlicang Lee
Jingran Gu
Ming Zhu
Siyuan Yang
Original Assignee
Hangzhou Zhonggui Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201811043848.7A external-priority patent/CN109015314A/en
Priority claimed from CN201811466539.0A external-priority patent/CN109262444A/en
Application filed by Hangzhou Zhonggui Electronic Technology Co Ltd filed Critical Hangzhou Zhonggui Electronic Technology Co Ltd
Publication of SG11202103477TA publication Critical patent/SG11202103477TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202103477TA 2018-09-07 2019-08-20 Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit SG11202103477TA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201811043848.7A CN109015314A (en) 2018-09-07 2018-09-07 A kind of based CMP apparatus
CN201811466539.0A CN109262444A (en) 2018-12-03 2018-12-03 Wafer planarization unit
CN201910481448.2A CN110026879A (en) 2018-09-07 2019-06-04 A kind of based CMP apparatus and wafer transfer method
PCT/CN2019/101581 WO2020048311A1 (en) 2018-09-07 2019-08-20 Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit

Publications (1)

Publication Number Publication Date
SG11202103477TA true SG11202103477TA (en) 2021-05-28

Family

ID=69721596

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103477TA SG11202103477TA (en) 2018-09-07 2019-08-20 Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit

Country Status (4)

Country Link
US (1) US20210260716A1 (en)
KR (1) KR102533567B1 (en)
SG (1) SG11202103477TA (en)
WO (1) WO2020048311A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023009116A1 (en) * 2021-07-28 2023-02-02 Applied Materials, Inc. High throughput polishing modules and modular polishing systems

Family Cites Families (26)

* Cited by examiner, † Cited by third party
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US5904611A (en) * 1996-05-10 1999-05-18 Canon Kabushiki Kaisha Precision polishing apparatus
US5947802A (en) * 1997-11-05 1999-09-07 Aplex, Inc. Wafer shuttle system
KR100710915B1 (en) * 1999-03-05 2007-04-26 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US20020071756A1 (en) * 2000-12-13 2002-06-13 Gonzalez Jose R. Dual wafer edge gripping end effector and method therefor
JP2003163181A (en) * 2001-11-28 2003-06-06 Disco Abrasive Syst Ltd Machining apparatus
JP4197103B2 (en) 2002-04-15 2008-12-17 株式会社荏原製作所 Polishing equipment
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
JP2004106084A (en) * 2002-09-17 2004-04-08 Ebara Corp Polishing device and substrate machining device
JP4464113B2 (en) * 2003-11-27 2010-05-19 株式会社ディスコ Wafer processing equipment
JP4757580B2 (en) * 2005-09-16 2011-08-24 株式会社荏原製作所 Polishing method, polishing apparatus, and program for controlling polishing apparatus
US7198548B1 (en) 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
US7335092B1 (en) * 2006-10-27 2008-02-26 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
KR101958874B1 (en) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5406676B2 (en) * 2009-11-10 2014-02-05 株式会社ディスコ Wafer processing equipment
KR101188540B1 (en) * 2010-04-30 2012-10-05 주식회사 케이씨텍 Chemical mechanical polishing apparatus and substrate transfer system thereof
KR20150047442A (en) * 2013-10-24 2015-05-04 주식회사 케이씨텍 Wafer treatment system and wafer multi-step cleaning apparatus used therein
JP6239417B2 (en) * 2014-03-24 2017-11-29 株式会社荏原製作所 Substrate processing equipment
JP6259366B2 (en) * 2014-07-09 2018-01-10 株式会社荏原製作所 Polishing equipment
CN105870045B (en) * 2016-05-04 2018-05-18 中国电子科技集团公司第四十五研究所 Wafer conveying device and using method
CN206105604U (en) * 2016-09-14 2017-04-19 天津华海清科机电科技有限公司 Chemical mechanical polishing system
TWM540388U (en) * 2017-01-17 2017-04-21 Phoenix Silicon Int Corp Wafer loading and unloading device
CN109015314A (en) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 A kind of based CMP apparatus
CN109262444A (en) * 2018-12-03 2019-01-25 杭州众硅电子科技有限公司 Wafer planarization unit
JP7339858B2 (en) * 2019-11-08 2023-09-06 株式会社ディスコ Processing device and loading/unloading method for plate-shaped work
CN112207655B (en) * 2020-10-12 2022-07-15 华海清科股份有限公司 Wafer grinding equipment with mobile manipulator

Also Published As

Publication number Publication date
KR102533567B1 (en) 2023-05-17
US20210260716A1 (en) 2021-08-26
KR20210054566A (en) 2021-05-13
WO2020048311A1 (en) 2020-03-12

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