JP2016016491A5 - - Google Patents

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Publication number
JP2016016491A5
JP2016016491A5 JP2014141732A JP2014141732A JP2016016491A5 JP 2016016491 A5 JP2016016491 A5 JP 2016016491A5 JP 2014141732 A JP2014141732 A JP 2014141732A JP 2014141732 A JP2014141732 A JP 2014141732A JP 2016016491 A5 JP2016016491 A5 JP 2016016491A5
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JP
Japan
Prior art keywords
polishing
rotary joint
ring
polishing apparatus
link mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014141732A
Other languages
English (en)
Japanese (ja)
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JP2016016491A (ja
JP6259366B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014141732A priority Critical patent/JP6259366B2/ja
Priority claimed from JP2014141732A external-priority patent/JP6259366B2/ja
Priority to SG10201505284QA priority patent/SG10201505284QA/en
Priority to KR1020150095813A priority patent/KR102314416B1/ko
Priority to US14/792,062 priority patent/US9522453B2/en
Publication of JP2016016491A publication Critical patent/JP2016016491A/ja
Publication of JP2016016491A5 publication Critical patent/JP2016016491A5/ja
Application granted granted Critical
Publication of JP6259366B2 publication Critical patent/JP6259366B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014141732A 2014-07-09 2014-07-09 研磨装置 Active JP6259366B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置
SG10201505284QA SG10201505284QA (en) 2014-07-09 2015-07-03 Polishing apparatus
KR1020150095813A KR102314416B1 (ko) 2014-07-09 2015-07-06 연마 장치
US14/792,062 US9522453B2 (en) 2014-07-09 2015-07-06 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置

Publications (3)

Publication Number Publication Date
JP2016016491A JP2016016491A (ja) 2016-02-01
JP2016016491A5 true JP2016016491A5 (enExample) 2017-08-03
JP6259366B2 JP6259366B2 (ja) 2018-01-10

Family

ID=55066894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014141732A Active JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置

Country Status (4)

Country Link
US (1) US9522453B2 (enExample)
JP (1) JP6259366B2 (enExample)
KR (1) KR102314416B1 (enExample)
SG (1) SG10201505284QA (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP7050560B2 (ja) * 2018-04-18 2022-04-08 株式会社荏原製作所 研磨装置及び基板処理装置
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
SG11202103477TA (en) * 2018-09-07 2021-05-28 Hangzhou Zhonggui Electronic Technology Co Ltd Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
CN119368489A (zh) * 2024-11-28 2025-01-28 江苏科沛达半导体科技有限公司 一种晶圆底面清洗装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3002300B2 (ja) * 1991-07-12 2000-01-24 日本トムソン株式会社 球面滑り軸受及びその製造方法
US5303959A (en) * 1993-02-01 1994-04-19 The Johnson Corporation High speed rotary joint
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
US6021695A (en) * 1996-11-11 2000-02-08 Hitachi Seiki Co., Ltd. Lathe and a machining system of a lathe
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
JP3192396B2 (ja) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 流体用ロータリジョイント
GB9726981D0 (en) * 1997-12-22 1998-02-18 Rolls Royce Plc Method and apparatus for grinding
JP2000000730A (ja) * 1998-06-12 2000-01-07 Yamato Kikai Kigu Kk 冷凍チャック
JP2000177984A (ja) * 1998-12-16 2000-06-27 Tadano Ltd 油圧作業機のロータリージョイント取付構造
JP2000205469A (ja) * 1999-01-13 2000-07-25 Surpass Kogyo Kk ロ―タリ―ジョイント
US6126207A (en) * 1999-03-08 2000-10-03 The Johnson Corporation Rotary joint with shear pins
JP2000254356A (ja) * 1999-03-12 2000-09-19 Kinki Sharyo Co Ltd 揺動装置
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6402602B1 (en) * 2001-01-04 2002-06-11 Speedfam-Ipec Corporation Rotary union for semiconductor wafer applications
JP2004042163A (ja) * 2002-07-09 2004-02-12 Ebara Corp 研磨装置及びその消耗・交換部品の貼付け剥がし方法
JP2004181586A (ja) * 2002-12-04 2004-07-02 Koyo Seiko Co Ltd 油圧ロータリージョイント及びこれを用いた超仕上機
JP2007222965A (ja) 2006-02-21 2007-09-06 Ebara Corp 研磨テーブルの定盤製造方法、研磨テーブル、及び研磨装置
KR101358645B1 (ko) * 2007-09-04 2014-02-05 삼성전자주식회사 웨이퍼 연마 캐리어 장치 및 그가 채용되는 화학적 기계적연마 설비
JP2009079652A (ja) * 2007-09-26 2009-04-16 Minebea Co Ltd 樹脂ライナ付き球面すべり軸受およびロッドエンド軸受
US20150118944A1 (en) * 2013-01-31 2015-04-30 Ebara Corporation Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
US20150017889A1 (en) * 2013-07-12 2015-01-15 Ebara Corporation Polishing apparatus
JP6362390B2 (ja) * 2014-04-10 2018-07-25 株式会社荏原製作所 ロータリージョイント、及び、研磨装置

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