SG10201807288PA - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
SG10201807288PA
SG10201807288PA SG10201807288PA SG10201807288PA SG10201807288PA SG 10201807288P A SG10201807288P A SG 10201807288PA SG 10201807288P A SG10201807288P A SG 10201807288PA SG 10201807288P A SG10201807288P A SG 10201807288PA SG 10201807288P A SG10201807288P A SG 10201807288PA
Authority
SG
Singapore
Prior art keywords
polishing
polishing table
processing apparatus
substrate processing
slurry
Prior art date
Application number
SG10201807288PA
Inventor
Toriyabe Toyonaga
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201807288PA publication Critical patent/SG10201807288PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

SUBSTRATE PROCESSING APPARATUS A substrate processing apparatus has a polishing table configured to have a polishing surface, a polishing liquid supply nozzle that supplies slurry to a slurry supply position set on the polishing table, a top ring that presses a substrate against the polishing surface of the polishing table at a polishing position set on the polishing table on a downstream side from the slurry supply position in a rotation direction of the polishing table, and a slurry returning bar 28 that is disposed at a predetermined gap from the polishing surface and extends from an outer peripheral portion of the polishing table to a central portion at a specified position on the polishing table on a downstream side from the polishing position in the rotation direction of the polishing table Figure 3
SG10201807288PA 2017-08-01 2018-08-27 Substrate processing apparatus SG10201807288PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017149187A JP2019029562A (en) 2017-08-01 2017-08-01 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
SG10201807288PA true SG10201807288PA (en) 2019-03-28

Family

ID=65231942

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807288PA SG10201807288PA (en) 2017-08-01 2018-08-27 Substrate processing apparatus

Country Status (3)

Country Link
US (1) US20190039203A1 (en)
JP (1) JP2019029562A (en)
SG (1) SG10201807288PA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7160725B2 (en) 2019-03-06 2022-10-25 株式会社荏原製作所 Substrate processing equipment
EP3919192B1 (en) * 2020-06-04 2023-11-29 Sugino Machine Limited Cleaning apparatus
CN113458975B (en) * 2021-07-06 2022-07-05 浙江工业大学 Sapphire dielectrophoresis burnishing machine waste liquid treatment device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903980B2 (en) * 1993-11-30 1999-06-14 信越半導体株式会社 Wafer polishing method and apparatus
JPH07237120A (en) * 1994-02-22 1995-09-12 Nec Corp Wafer grinding device
JP3594357B2 (en) * 1995-04-10 2004-11-24 株式会社荏原製作所 Polishing method and apparatus
JP2983905B2 (en) * 1995-09-08 1999-11-29 松下電器産業株式会社 Method and apparatus for polishing semiconductor substrate
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
JPH10217114A (en) * 1997-02-07 1998-08-18 Sony Corp Wafer polishing method and its device
JP2001260007A (en) * 2000-03-14 2001-09-25 Matsushita Electric Ind Co Ltd Polishing device and polishing method in manufacturing thin film magnetic head
US6887132B2 (en) * 2001-09-10 2005-05-03 Multi Planar Technologies Incorporated Slurry distributor for chemical mechanical polishing apparatus and method of using the same
JP2003324085A (en) * 2002-05-01 2003-11-14 Mitsubishi Electric Corp Device and method for polishing semiconductor wafer
JP2005271151A (en) * 2004-03-25 2005-10-06 Toshiba Corp Polishing apparatus and polishing method
JP2006088292A (en) * 2004-09-27 2006-04-06 Toshiba Corp Polishing device, polishing method, and manufacturing method for semiconductor device
JP4902433B2 (en) * 2007-06-13 2012-03-21 株式会社荏原製作所 Polishing surface heating and cooling device for polishing equipment
JP6139188B2 (en) * 2013-03-12 2017-05-31 株式会社荏原製作所 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
JP2019029562A (en) 2019-02-21
US20190039203A1 (en) 2019-02-07

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