CN113458975B - Sapphire dielectrophoresis burnishing machine waste liquid treatment device - Google Patents
Sapphire dielectrophoresis burnishing machine waste liquid treatment device Download PDFInfo
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- CN113458975B CN113458975B CN202110765328.2A CN202110765328A CN113458975B CN 113458975 B CN113458975 B CN 113458975B CN 202110765328 A CN202110765328 A CN 202110765328A CN 113458975 B CN113458975 B CN 113458975B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention discloses a waste liquid treatment device of a sapphire dielectrophoresis polishing machine, which comprises a lower support and a lower polishing disk, wherein the lower polishing disk can be movably arranged on the lower support up and down, the lower polishing disk is externally connected with a driving mechanism through a lower rotating shaft to drive the lower polishing disk to rotate, the lower part of the lower polishing disk is provided with a collecting disk which does not rotate along with the lower polishing disk, the outer periphery of the lower polishing disk is provided with a liquid collecting tank, the liquid collecting tank is uniformly provided with a plurality of first liquid discharging holes and second liquid discharging holes in the circumferential direction, the first liquid discharging holes and the second liquid discharging holes are arranged at intervals in the circumferential direction, a grid plate is arranged between every two adjacent liquid discharging holes to separate the areas in liquid, the lower parts of the first liquid discharging holes are connected with a circulating liquid cavity, a pump body is arranged in the circulating liquid cavity, the outlet end of the circulating liquid cavity is connected with a circulating liquid pipe, and the lower parts of the second liquid discharging holes are externally connected with a waste liquid pipe. The polishing solution is collected and recycled and discharged, so that the polishing quality is ensured, and the polishing cost and the resource waste are reduced.
Description
Technical Field
The invention relates to the field of polishing machinery, in particular to a waste liquid treatment device of a sapphire dielectrophoresis polishing machine.
Background
In the prior art, electrodes are additionally arranged in an upper disc and a lower disc of a sapphire polishing machine, and dielectrophoresis force (electric field force) is generated by electrifying to adsorb polishing liquid and abrasive particles, so that the throwing-out effect of centrifugal force on the polishing liquid and the abrasive particles can be slowed down, the effective retention time of the polishing liquid and the abrasive particles is prolonged, and the grinding and polishing quality is improved. However, the polishing solution and the abrasive particles still can not stay for too long time, and the polishing solution and the abrasive particles which are not fully utilized are wasted as raw materials if directly discharged, thereby invisibly increasing the polishing cost and wasting resources.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a waste liquid treatment device of a sapphire dielectrophoresis polishing machine, which circularly and repeatedly utilizes polishing liquid through the structural design, effectively improves the utilization rate of the polishing liquid and improves the utilization and control cost of resources on the basis of the dielectrophoresis polishing machine.
The invention adopts the following technical scheme: a waste liquid treatment device of a sapphire dielectrophoresis polishing machine comprises a lower support and a lower polishing disk which is movably arranged on the lower support up and down, wherein the lower polishing disk is externally connected with a driving mechanism through a lower rotating shaft which is connected with the lower part of the lower polishing disk to drive the lower polishing disk to rotate, the lower part of the lower polishing disk is provided with a collecting disk which does not rotate along with the lower polishing disk, the collecting disk is provided with a liquid collecting tank at the outer periphery of the lower polishing disk, the liquid collecting tank is uniformly provided with a plurality of first liquid discharge holes and second liquid discharge holes in the circumferential direction, the first liquid discharge holes and the second liquid discharge holes are arranged at intervals in the circumferential direction, and a grid plate is arranged between the adjacent first liquid discharge holes and the second liquid discharge holes to separate the areas in the liquid collecting tank, the lower parts of the first liquid discharge holes are connected with a circulating liquid cavity, the pump body is arranged in the circulating liquid cavity, the outlet end of the circulating liquid cavity is connected with the circulating liquid pipe, and the lower part of the second liquid discharge hole is externally connected with the waste liquid pipe.
As a modification, the first drain holes and the second drain holes form an S-shaped cooling flow passage in the collecting tray, and the outlet end of the cooling flow passage extends out of the lower portion of the collecting tray.
As an improvement, the outlet end of the first liquid discharging hole is connected with a first connecting pipe, the outlet end of the second liquid discharging hole is connected with a second connecting pipe, the inlet end of the circulating liquid cavity is connected with a third connecting pipe, the first connecting pipe, the second connecting pipe, the third connecting pipe and the waste liquid pipe are connected with a switching mechanism, the switching mechanism comprises four interfaces connected with the first connecting pipe, the second connecting pipe, the third connecting pipe and the waste liquid pipe and a switching piece for adjusting the connection mode of the four interfaces, the number of the switching pieces is at least two, one switching piece is arranged into a parallel flow channel, the first connecting pipe is communicated with the third connecting pipe, and the second connecting pipe is communicated with the waste liquid pipe; one of the switching pieces is set as a second Y-shaped flow channel, so that the first connecting pipe, the second connecting pipe and the waste liquid pipe are communicated, and the third connecting pipe is closed.
As an improvement, the switching piece is also provided with a first Y-shaped flow channel, so that the first connecting pipe, the second connecting pipe and the third connecting pipe are communicated, and the waste liquid pipe is closed;
as an improvement, the switching piece is also provided with an X-shaped flow channel, the second connecting pipe is communicated with the third connecting pipe, and the first connecting pipe is communicated with the waste liquid pipe.
As an improvement, the switching mechanism comprises a pipe body, two interfaces are respectively arranged on the upper side and the lower side of the pipe body, the plurality of switching pieces are arranged in the pipe body in a sliding manner through a driving cylinder, and a certain switching piece is made to move to correspond to the interfaces through the extension and retraction of the driving cylinder.
As an improvement, a lower sliding rail is arranged on the lower support, a lower sliding frame is arranged on the lower sliding rail and can slide up and down, a lower polishing disc is rotatably arranged on the lower sliding frame, and a collecting disc is fixedly arranged on the lower sliding frame.
As an improvement, the polishing machine also comprises an upper bracket and an upper polishing disk which can be movably arranged on the upper bracket up and down, the upper polishing disk is externally connected with a driving mechanism through an upper rotating shaft connected with the upper part to drive the upper polishing disk to rotate, the upper part of the upper polishing disk is also provided with a main liquid inlet disk, the main liquid inlet disk is arranged at the upper bracket and can synchronously move up and down on the upper bracket together with the upper polishing disk,
the polishing machine is characterized by further comprising a clamp, wherein the clamp is fixedly arranged on the middle support, the upper polishing disk, the clamp and the lower polishing disk are sequentially arranged from top to bottom, and when the upper polishing disk and the lower polishing disk move oppositely to contact with a material to be polished at the clamp, the polishing work is carried out;
the main liquid inlet disc is positioned in the middle of the upper polishing disc and sleeved outside the upper rotating shaft, a main caulking groove is arranged on the upper polishing disc, the lower part of the main liquid inlet disc is embedded in the main caulking groove, the upper part of the main liquid inlet disc is externally connected with a main liquid inlet pipe and a circulating liquid pipe, an annular main liquid cavity and an annular auxiliary liquid cavity are formed in the main liquid inlet disc, the lower part of the main liquid inlet disc is externally provided with a circle of uniformly arranged main liquid outlet holes and a circle of uniformly arranged auxiliary liquid outlet holes respectively, the main liquid inlet pipe, the main liquid cavity and the main liquid outlet holes are sequentially communicated, and the circulating liquid pipe, the auxiliary liquid cavity and the auxiliary liquid outlet holes are sequentially communicated,
the bottom of the main caulking groove is divided into an inner ring and an outer ring by a convex ring, the bottom of the inner ring is provided with a circle of uniformly arranged inlet ends of main liquid inlet holes, the main liquid outlet holes are positioned at the inner ring and correspond to the inlet ends of the main liquid inlet holes, the main liquid inlet holes are communicated with the polishing surface of the upper polishing disk, and uniformly arranged outlet ends of the main liquid inlet holes are formed in the circumferential direction close to the inner side of the polishing surface of the upper polishing disk; the groove bottom of the outer ring is provided with a circle of uniformly arranged inlet ends of the auxiliary liquid inlet holes, the auxiliary liquid outlet holes are positioned at the inner ring and correspond to the inlet ends of the main liquid inlet holes, the auxiliary liquid inlet holes are communicated with the polishing surface of the upper polishing disk, and uniformly arranged outlet ends of the auxiliary liquid inlet holes are formed in the circumferential direction, close to the outer side, of the polishing surface of the upper polishing disk.
As an improvement, the middle parts of a plurality of main liquid inlet holes and/or auxiliary liquid inlet holes are communicated with each other in the upper polishing disc to form a cooling water cavity.
As an improvement, an upper slide rail is arranged on the upper support, an upper sliding frame is arranged on the upper slide rail and can slide up and down, an upper polishing disc is rotatably arranged on the upper sliding frame, and a main liquid inlet disc is fixedly arranged on the upper sliding frame.
The invention has the beneficial effects that: the lower part of the lower polishing disk is provided with a collecting disk, a liquid collecting tank at the outer side collects the centrifugally thrown polishing liquid, the polishing liquid on the whole circumferential position is divided into two groups for conveying through two groups of liquid discharging holes arranged at intervals on the circumferential position, one group of the liquid discharging holes is guided to a circulating liquid cavity and used for circularly recovering the polishing liquid, and the two groups of the liquid discharging holes are pressurized by a pump body and can be supplied to the upper polishing disk for polishing through a circulating liquid pipe; the second set of drain holes leads to the waste pipe for draining the portion of the polishing slurry. The polishing solution of liquid collecting groove is shunted to become two parts at the circumferential position that is good on the whole, makes two parts liquid impurity concentration keep unanimous, avoids retrieving to mix and is used for polishing again polishing solution impurity too much, can guarantee polishing quality in the time, better realization is used the circulation input of polishing solution, reduces polishing cost and reduces the wasting of resources.
Drawings
FIG. 1 is a schematic cross-sectional front view of a lower polishing pad according to the present invention.
Figure 2 is a schematic cross-sectional front view of the lower polishing pad and the switching mechanism of the present invention in an engaged state.
Fig. 3 is a schematic sectional view of the switching mechanism of the present invention.
Fig. 4 is a schematic top view of the collecting tray of the present invention.
Fig. 5 is a cross-sectional schematic view at the collection tray of the present invention.
FIG. 6 is a schematic sectional view of the front structure of the upper polishing disk, the clamp and the lower polishing disk in the matching state.
Figure 7 is a schematic cross-sectional front view of the upper polishing pad of the present invention.
Figure 8 is a cross-sectional schematic view of the upper polishing pad of the present invention in transverse cross-section.
Fig. 9 is a cross-sectional schematic view at the main intake tray of the present invention.
Detailed Description
The following detailed description of specific embodiments of the invention refers to the accompanying drawings.
As shown in fig. 1, 2, 3, 4, 5, 6, 7, 8 and 9, a specific embodiment of the waste liquid treatment device of the sapphire dielectrophoresis polisher according to the invention is shown. The embodiment comprises a lower bracket 02 and a lower polishing disk 2 which is movably arranged on the lower bracket 02 up and down, wherein the lower polishing disk 2 is externally connected with a driving mechanism through a lower rotating shaft 21 which is connected with the lower part to drive the lower polishing disk 2 to rotate, the lower part is provided with a collecting disk 4 which does not rotate along with the lower polishing disk 2, the collecting disk 4 is provided with a liquid collecting tank 41 at the outer periphery of the lower polishing disk 2, the liquid collecting tank 41 is uniformly provided with a plurality of first liquid discharging holes 411 and second liquid discharging holes 412 in the circumferential direction, the first liquid discharging holes 411 and the second liquid discharging holes 412 are arranged at intervals in the circumferential direction, and a grid plate 40 is arranged between the adjacent first liquid discharge holes 411 and the second liquid discharge holes 412 to space the areas in the liquid collecting grooves 41, the lower parts of the first liquid discharge holes 411 are connected with a circulating liquid cavity 413, a pump 414 is arranged in the circulating liquid cavity 413, the outlet end of the circulating liquid cavity 413 is connected with the circulating liquid pipe 131, and the lower part of the second liquid discharging hole 412 is externally connected with a waste liquid pipe 415.
When the sapphire polishing machine is used, the upper polishing disc 1, the clamp 3 and the lower polishing disc 2 are sequentially arranged from top to bottom, sapphire to be polished is clamped at the clamp 3, the upper polishing disc 1 and the lower polishing disc 2 are in up-and-down movable contact with the sapphire at the clamp 3, and the upper polishing disc 1 and the lower polishing disc 2 are driven to rotate through an external drive such as a motor to polish the sapphire. Electrodes are arranged in the upper polishing disk 1 and the lower polishing disk 2 through the prior art, the electrodes are externally connected with a power supply, and dielectrophoresis force is formed by electrifying to assist polishing liquid in polishing. During polishing, the pipe for feeding polishing liquid is opened, so that new polishing liquid is fed, and the circulating liquid pipe 131 feeds recycled polishing liquid. The invention is provided with a collecting tray 4 which is arranged at the lower part of a lower polishing disk 2 and forms a liquid collecting tank 41 at the periphery, the thrown-off polishing liquid falls into the liquid collecting tank 41 for collection, a plurality of first liquid discharging holes 411 and second liquid discharging holes 412 which are arranged at intervals at the circumferential position are matched with a grid plate 40 to separate the circumferential area into sectors, the polishing liquid at the whole circumferential position is divided into two groups for conveying, wherein the first liquid discharging holes 411 are guided to a circulating liquid cavity 413 for circularly recovering the polishing liquid, and the two groups are pressurized by a pump body 414 and are supplied to the upper polishing disk 1 for polishing through a circulating liquid pipe 131; and the second drain hole 412 leads to a waste pipe 415 for draining the part of the polishing liquid. The first drain holes 411 and the second drain holes 412 are uniformly arranged at the circumferential position, and preferably 8-2 first drain holes 411 and second drain holes 412 are distributed at intervals one by one, so that the polishing liquid in the liquid collecting tank 41 is well divided into two parts at the circumferential position, the impurity concentration of the two parts of liquid is kept consistent, and excessive impurities in the polishing liquid which is recycled, mixed and reused for polishing are avoided. The technical scheme of the invention can better realize the cyclic input of the polishing solution to use while ensuring the polishing quality on the whole, reduce the polishing cost and reduce the resource waste caused by insufficient use of the polishing solution.
As a modified embodiment, the first drain holes 411 and the second drain holes 412 form an S-shaped cooling flow passage 410 in the collecting tray 4, and the outlet end is passed out from the lower portion of the collecting tray 4.
As shown in fig. 5, the S-shaped cooling channel 410 can relieve the heating condition caused by the sapphire polishing of the lower polishing disk 2, and achieves a certain effect of cooling the upper lower polishing disk 2 by the flow of the polishing liquid from the outside to the inside of the collecting disk 4, so that the heat of the whole lower polishing disk 2 is uniformly dissipated, and the service life of the mechanism is prolonged; on the other hand, the flow of the polishing liquid is guided from outside to inside, so that outlets of the first liquid discharge hole 411 and the second liquid discharge hole 412 can be concentrated towards the middle part, the concentrated arrangement and collection of pipelines are facilitated, and then the polishing liquid is led out from a main pipeline, and the optimized layout of the structure is facilitated.
As a modified embodiment, the outlet end of the first drain hole 411 is connected to the first connecting pipe 51, the outlet end of the second drain hole 412 is connected to the second connecting pipe 52, the inlet end of the circulating liquid chamber 413 is connected to the third connecting pipe 53, the first connecting pipe 51, the second connecting pipe 52, the third connecting pipe 53 and the waste liquid pipe 415 are connected to a switching mechanism 6, the switching mechanism 6 comprises four ports 61 connected to the first connecting pipe 51, the second connecting pipe 52, the third connecting pipe 53 and the waste liquid pipe 415, and a switching member 62 for adjusting the connection mode of the four ports 61, the number of the switching members 62 is at least two, one of the switching members 62 is provided as a parallel flow passage 621, so that the first connecting pipe 51 is communicated with the third connecting pipe 53, and the second connecting pipe 52 is communicated with the waste liquid pipe 415; one of the switching pieces 62 is provided as a second Y-shaped flow passage 623 for allowing the first connection pipe 51, the second connection pipe 52 and the waste liquid pipe 415 to communicate, and the third connection pipe 53 to be closed.
As shown in fig. 2 and 3, in order to further improve the functionality of polishing liquid circulation or waste liquid discharge, a switching mechanism 6 is further provided, and the switching mechanism 6 is connected with the input and output two pipelines, namely, the input first connecting pipe 51 and second connecting pipe 52, and the output third connecting pipe 53 and waste liquid pipe 415 through four connectors 61; then, by means of the plurality of switching pieces 62, after the switching pieces 62 are replaced, the butt joint mode of the input and output pipelines is changed, and different function usages are achieved. First, the basic switching member 62, i.e., the parallel flow path 621, connects the first connection pipe 51 to the third connection pipe 53, and connects the second connection pipe 52 to the waste liquid pipe 415, so that the polishing liquid in the first drain hole 411 flows to the circulation chamber 413 for circulation, and the polishing liquid in the second drain hole 412 flows to the waste liquid pipe 415 for waste liquid drainage. Then, the first functional switching element 62, i.e., the second Y-shaped flow channel 623, connects the first connecting pipe 51, the second connecting pipe 52 and the waste liquid pipe 415, and the third connecting pipe 53 is closed, at this time, all input pipelines guide the polishing liquid to the waste liquid pipe 415 for the waste liquid to be discharged, and the switching element 62 can be switched to use after the whole polishing liquid is subjected to a plurality of polishing cycles, so that all polishing liquid is discharged at a single time, thereby cleaning the whole flow channel, allowing new polishing liquid to enter a machine for polishing and recycling, facilitating the guarantee of polishing quality, and fully utilizing the polishing liquid as a whole.
As a modified embodiment, the switching member 62 is further provided with a first Y-shaped flow passage 622 for communicating the first connection pipe 51, the second connection pipe 52 and the third connection pipe 53, and the waste liquid pipe 415 is closed.
As shown in fig. 3, on the basis of the above-mentioned switching element 62, a second functional switching element 62, i.e. a first Y-shaped flow channel 622 is further provided, which connects the first connecting pipe 51, the second connecting pipe 52 and the third connecting pipe 53, and seals the waste liquid pipe 415, at this time, all input pipelines guide the polishing liquid to the circulating liquid cavity 413 for circulation, and the device can be used for guiding the polishing liquid to the whole for circulation when the impurity concentration of the new polishing liquid is low at the beginning of the machine operation, and switching to the parallel flow channel 621 after one or two circulations, and performing the polishing liquid using condition of half of the conventional half circulation and half of the removal, thereby improving the utilization rate of the polishing liquid.
As a modified embodiment, the switching member 62 is further provided with an X-shaped flow passage 624 for communicating the second connection pipe 52 with the third connection pipe 53 and communicating the first connection pipe 51 with the waste liquid pipe 415.
As shown in fig. 3, on the basis of the three switching members 62, a third functional switching member 62, i.e. an X-shaped flow channel 624 is further provided, which corresponds to the parallel flow channel 621 in function, and only the connection relationship between the two input pipelines and the two output pipelines is exchanged, so that the effect achieved is that one input pipeline, for example, the pipeline formed by the first drainage holes 411 and the first connecting pipe 51, is avoided, and a plurality of first drainage holes 411 are located at the fixed fan-shaped position of the whole collecting tray 4 for a long time, and impurities falling to the fan-shaped position after polishing tend to be consistent, so that after long-term use, the impurity concentration conditions possibly existing in the input pipeline tend to be consistent, and the input pipeline is correspondingly supplied to the output circulation pipeline for a long time; through the switching between the X-shaped flow passage 624 and the parallel flow passage 621, the two sets of output pipes supplied by the fan-shaped positions on the two sets of collecting trays 4 are switched, so that the concentrations of the polishing solutions participating in circulation or discharge tend to be consistent, and the control of the polishing solutions is more accurate. Here, it is preferable that the impurity concentration of the polishing liquid is detected by connecting a detection means to the waste liquid pipe 415, and when the impurity concentration is too high, the pipe is switched to drain all the polishing liquid, and a new polishing liquid is supplied to perform the polishing process.
As an improved specific embodiment, the switching mechanism 6 includes a tube 63, two connectors 61 are respectively disposed on the upper and lower sides of the tube 63, a plurality of switching members 62 are slidably disposed in the tube 63 through a driving cylinder 64, and one of the switching members 62 is moved to correspond to the connector 61 by extending and retracting the driving cylinder 64.
As shown in fig. 2 and 3, the pipe 63 forms a linear channel, a plurality of switching members 62 slide in the linear channel, and when corresponding to the interface 61, the pipes are conducted normally or functionally, and the switching members 62 can be isolated from each other by isolating the pipe 63 by rubber members, without interfering with each other; the two side interfaces 61 can also be staggered in position, so that no correspondence can be generated when the corresponding flow channel is adjusted, and liquid cannot flow randomly before the flow channels are aligned. The driving cylinder 64 can be provided with a plurality of magnetic control switches on the stroke, the tube body 63 is provided with sensors corresponding to the number of the magnetic control switches, one position of the integral plurality of switching pieces 62 is used as a reference point, for example, an integral far end, when the sensor senses that the far end reaches the position of the sensor, a feedback signal is sent to the electromagnetic valve, the electromagnetic valve feeds back to the position of the magnetic control switch stopping cylinder at the corresponding position, and a certain switching piece 62 is accurately stopped at the position of the interface 61, so that the switching and the accurate butt joint of the switching piece 62 are realized.
As a modified embodiment, the lower rack 02 is provided with a lower slide rail 021, the lower slide rail 021 is provided with a lower sliding rack 022 capable of sliding up and down, the lower polishing disc 2 is rotatably arranged on the lower sliding rack 022, and the collecting disc 4 is fixedly arranged on the lower sliding rack 022.
As shown in fig. 1, 2, and 6, by arranging a lower slide rail 021 on the lower bracket 02, the lower slide rail 021 is slidably arranged at the lower slide rail 021 in cooperation with the structure of the lower slide frame 022, the lower slide frame 022 is controlled to ascend and descend by the structure of the motor or the cylinder, the lower rotating shaft 21 of the lower polishing disc 2 is rotatably arranged on the lower slide frame 022 through a bearing structure, and the collection disc 4 is fixedly mounted on the lower slide frame 022; when the lower sliding frame 022 is lifted, the collecting tray 4 and the lower polishing tray 2 can be lifted synchronously, the positions of the collecting tray 4 and the lower polishing tray 2 are kept relatively stable, so that the positions of the collecting tray 4 and the lower polishing tray 2 can be stably matched, and polishing liquid to be collected can be better received; when the lower polishing disc 2 rotates, the collecting disc 4 keeps static, so that the collecting disc 4 can convey polishing liquid to the external connecting pipeline conveniently.
As an improved specific implementation mode, the polishing machine further comprises an upper support 01 and an upper polishing disk 1 which is arranged on the upper support 01 in a vertically movable manner, the upper polishing disk 1 is externally connected with a driving mechanism through an upper rotating shaft 11 connected with the upper portion of the upper polishing disk 1 to drive the upper polishing disk 1 to rotate, a main liquid inlet disk 12 is further arranged on the upper portion of the upper polishing disk 1, the main liquid inlet disk 12 is arranged at the upper support 01 and can be synchronously vertically moved on the upper support 01 together with the upper polishing disk 1,
the polishing machine further comprises a clamp 3, the clamp 3 is fixedly arranged on the middle support 03, the upper polishing disc 1, the clamp 3 and the lower polishing disc 2 are sequentially arranged from top to bottom, and polishing work is carried out when the upper polishing disc 1 and the lower polishing disc 2 move oppositely to contact with a material to be polished at the clamp 3;
the main liquid inlet disc 12 is positioned in the middle of the upper polishing disc 1 and sleeved outside the upper rotating shaft 11, the upper polishing disc 1 is provided with a main caulking groove 14, the lower part of the main liquid inlet disc 12 is embedded in the main caulking groove 14, the upper part of the main liquid inlet disc 12 is externally connected with a main liquid inlet pipe 121 and a circulating liquid pipe 131, an annular main liquid cavity 122 and an annular auxiliary liquid cavity 132 are formed in the main liquid inlet disc 12, the lower part of the main liquid inlet disc 12 is externally provided with a circle of uniformly arranged main liquid outlet holes 123 and a circle of uniformly arranged auxiliary liquid outlet holes 133 respectively, the main liquid inlet pipe 121, the main liquid cavity 122 and the main liquid outlet holes 123 are communicated in sequence, the circulating liquid pipe 131, the auxiliary liquid cavity 132 and the auxiliary liquid outlet holes 133 are communicated in sequence,
the bottom of the main caulking groove 14 is divided into an inner ring and an outer ring by a convex ring 140, the bottom of the inner ring is provided with a circle of inlet ends of main liquid inlet holes 141 which are uniformly arranged, the main liquid outlet hole 123 is positioned at the inner ring and corresponds to the inlet end of the main liquid inlet hole 141, the main liquid inlet hole 141 is communicated with the polishing surface of the upper polishing disk 1, and the outlet ends of the main liquid inlet holes 141 which are uniformly arranged are formed in the circumferential direction close to the inner side of the polishing surface of the upper polishing disk 1; the groove bottom of the outer ring is provided with a circle of uniformly arranged inlet ends of the auxiliary liquid inlet holes 151, the auxiliary liquid outlet holes 133 are positioned at the inner ring and correspond to the inlet ends of the main liquid inlet holes 141, the auxiliary liquid inlet holes 151 are communicated with the polishing surface of the upper polishing disk 1, and uniformly arranged outlet ends of the auxiliary liquid inlet holes 151 are formed in the circumferential direction close to the outer side of the polishing surface of the upper polishing disk 1.
As shown in fig. 6 and 7, the positional relationship and the operating state of the upper polishing disk 1, the jig 3, and the lower polishing disk 2 have been previously described; further, the clamps 3 may preferably be arranged in four uniform groups arranged circumferentially for clamping four sapphire materials to be polished, and the outer sides of the clamps 3 are mounted on the middle support 03.
For the upper polishing disk 1 and the main liquid inlet disk 12, wherein the main liquid inlet pipe 121 is a single pipe and is connected to the inner side of the main liquid inlet disk 12, the main liquid cavity 122 forms a ring shape, so that the polishing liquid entering from the main liquid inlet pipe 121 flows through the whole circumferential position, the main liquid outlet holes 123 are uniformly arranged at the circumferential position, the arrangement mode of 6-10 main liquid outlet holes 123 can be optimized, and the liquid outlet positions are well distributed; the lower part of the main liquid inlet disc 12 is embedded in the inner ring position of the main caulking groove 14, the inner ring and the outer ring are separated by the convex ring 140 and are not mutually interfered, the polishing liquid can not overflow from the inner ring of the main caulking groove 14 through the control of the liquid flow rate, or the liquid can not overflow by depending on the reasonable gap size arranged at the bottom of the main liquid inlet disc 12 and the groove, and the polishing liquid can be uniformly distributed on the periphery and enter the main liquid inlet hole 141; the number of the main liquid inlet holes 141 corresponding to the main liquid outlet holes 123 is preferably 6-10, and the main liquid inlet holes are uniformly arranged at the circumferential position of the upper polishing disk 1, and the outlet end of the main liquid inlet holes is used for uniformly discharging liquid on the polishing surface of the upper polishing disk 1 for polishing.
The circulation liquid pipe 131 is a single pipe and is connected to the outer side of the main liquid inlet disc 12, the auxiliary liquid cavity 132 forms an annular shape, polishing liquid entering the circulation liquid pipe 131 flows through the whole circumferential position, the auxiliary liquid outlet holes 133 are uniformly arranged at the circumferential position, the arrangement mode of 6-10 auxiliary liquid outlet holes 133 can be preferably selected, and the liquid outlet positions are well distributed; the lower part of the circulating liquid inlet disc 13 is embedded in the outer ring position of the main caulking groove 14, the polishing liquid can not overflow from the outer ring of the main caulking groove 14 through the control of the liquid flow rate, or the liquid can not overflow depending on the reasonable gap size arranged between the main liquid inlet disc 12 and the groove bottom, and the polishing liquid can be uniformly distributed on the periphery and enter the auxiliary liquid inlet holes 151; the number of the auxiliary liquid inlet holes 151 corresponding to the auxiliary liquid outlet holes 133 is preferably 6-10, and the auxiliary liquid inlet holes are uniformly arranged at the circumferential position of the upper polishing disk 1, and the outlet end of the auxiliary liquid inlet holes is used for uniformly discharging liquid on the polishing surface of the upper polishing disk 1 for polishing.
The outlet end of the main liquid inlet hole 141 is close to the inner side, and after the new polishing liquid reaches the polishing position close to the inner side, the process of outward centrifugal throwing out along with the polishing process is long in use, so that the new polishing liquid can participate in polishing more fully; the outlet end of the auxiliary liquid inlet hole 151 is close to the outer side, the time of the recycled polishing liquid participating in the polishing process is slightly short, the polishing quality of the polishing liquid is ensured in the time of participating in the polishing, the polishing liquid can be mixed with the new polishing liquid on the inner side in the polishing process, and the mixed polishing liquid provides stable polishing quality. On the whole, the polishing quality is ensured, meanwhile, the cyclic input of the polishing solution is better realized, the polishing cost is reduced, and the resource waste caused by insufficient use of the polishing solution is reduced.
As a modified embodiment, the middle portions of the plurality of main liquid inlet holes 141 and/or the plurality of sub liquid inlet holes 151 are communicated with the upper polishing pad 1 to form the cooling water chamber 16.
As shown in fig. 6, 7 and 8, the arrangement of the annular cooling water cavity 16 can relieve the heating condition caused by the sapphire polishing of the upper polishing disk 1, achieve the cooling effect by the flow of the polishing liquid in the whole circumferential area, ensure the uniform heat dissipation of the whole body and prolong the service life of the mechanism; on the other hand, the flow of the polishing liquid ensures that the polishing liquid flows out uniformly from the main liquid inlet holes 141 and the auxiliary liquid inlet holes 151 in the whole circumferential area, so that the polishing uniformity in the whole area is ensured, and the quality of the polished sapphire finished product is ensured.
As a modified specific embodiment, the upper bracket 01 is provided with an upper slide rail 011, the upper slide rail 011 is provided with an upper slide frame 012 capable of sliding up and down, the upper polishing disc 1 is rotatably provided on the upper slide frame 012, and the main liquid inlet disc 12 is fixedly mounted on the upper slide frame 012.
As shown in fig. 6 and 7, the upper rack 01 is provided with the upper slide rails 011, the upper slide frame 012 is slidably provided at the upper slide rails 011 in cooperation with the structure of the upper slide frame 012, the upper slide frame 012 is controlled to be lifted by the structure of the motor or the cylinder, the upper rotary shaft 11 of the upper polishing disc 1 can be rotatably provided on the upper slide frame 012 through a bearing structure, and the main liquid inlet disc 12 can be fixedly mounted on the upper slide frame 012; when the upper sliding frame 012 is lifted, the upper polishing disc 1 and the main liquid inlet disc 12 can be lifted synchronously, and the positions of the upper polishing disc 1 and the main liquid inlet disc 12 are kept relatively stable, so that the main liquid inlet disc 12 is matched in the main caulking groove 14; when the upper polishing disc 1 rotates, the main liquid inlet disc 12 remains static, so that the main liquid inlet pipe 121 and the circulating liquid pipe 131 are stably connected to the outside to convey polishing liquid.
As a modified embodiment, a bearing piece is arranged between the main liquid inlet disc 12 and the upper polishing disc 1; a bearing member is provided between the collection tray 4 and the lower polishing tray 2.
As shown in fig. 1, 2, 6 and 7, it is preferable to provide an upper bearing element at the matching position, so that a good matching relationship between the rotating element and the fixing element is realized, and the structural stability and the position correspondence between the rotating element and the fixing element are ensured.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (9)
1. The utility model provides a sapphire dielectrophoresis burnishing machine waste liquid treatment device, includes lower carriage (02) and can move about from top to bottom and set up lower polishing dish (2) on lower carriage (02), lower polishing dish (2) are through the external actuating mechanism of lower slewing shaft (21) of sub-unit connection carry out the drive rotation to lower polishing dish (2), its characterized in that: the lower part is provided with a collecting disc (4) which does not rotate along with the lower polishing disc (2), the collecting disc (4) is provided with a liquid collecting tank (41) at the outer periphery of the lower polishing disc (2), the liquid collecting tank (41) is uniformly provided with a plurality of first liquid discharging holes (411) and second liquid discharging holes (412) in the circumferential direction, the first liquid discharging holes (411) and the second liquid discharging holes (412) are arranged at intervals in the circumferential direction, a grid plate (40) is arranged between the adjacent first liquid discharge holes (411) and the second liquid discharge holes (412) to space the areas in the liquid collecting tank (41), the lower parts of the first liquid discharge holes (411) are connected with a circulating liquid cavity (413), a pump body (414) is arranged in the circulating liquid cavity (413), the outlet end of the circulating liquid cavity (413) is connected with a circulating liquid pipe (131), and the lower part of the second liquid discharge hole (412) is externally connected with a waste liquid pipe (415);
the polishing machine also comprises an upper bracket (01) and an upper polishing disk (1) which is movably arranged on the upper bracket (01) up and down, the upper polishing disk (1) is externally connected with a driving mechanism through an upper rotating shaft (11) connected with the upper part to drive the upper polishing disk (1) to rotate, the upper part of the upper polishing disk (1) is also provided with a main liquid inlet disk (12), the main liquid inlet disk (12) is arranged at the upper bracket (01) and can synchronously move up and down on the upper bracket (01) together with the upper polishing disk (1),
the polishing machine is characterized by further comprising a clamp (3), wherein the clamp (3) is fixedly arranged on the middle support (03), the upper polishing disc (1), the clamp (3) and the lower polishing disc (2) are sequentially arranged from top to bottom, and when the upper polishing disc (1) and the lower polishing disc (2) oppositely move to contact with a material to be polished at the clamp (3), polishing work is carried out;
the main liquid inlet disc (12) is positioned in the middle of the upper polishing disc (1) and sleeved on the outer side of the upper rotating shaft (11), a main caulking groove (14) is arranged on the upper polishing disc (1), the lower part of the main liquid inlet disc (12) is embedded in the main caulking groove (14), the upper part of the main liquid inlet disc (12) is externally connected with a main liquid inlet pipe (121) and a circulating liquid pipe (131), an annular main liquid cavity (122) and an auxiliary liquid cavity (132) are formed in the main liquid inlet disc (12), the lower part of the main liquid inlet disc (12) is externally provided with a circle of uniformly-arranged main liquid outlet holes (123) and a circle of uniformly-arranged auxiliary liquid outlet holes (133), the main liquid inlet pipe (121), the main liquid cavity (122) and the main liquid outlet holes (123) are sequentially communicated, and the circulating liquid pipe (131), the auxiliary liquid cavity (132) and the auxiliary liquid outlet holes (133) are sequentially communicated,
the groove bottom of the main caulking groove (14) is divided into an inner ring and an outer ring by a convex ring (140), the groove bottom of the inner ring is provided with a circle of inlet ends of main liquid inlet holes (141) which are uniformly arranged, the main liquid outlet holes (123) are positioned at the inner ring and correspond to the inlet ends of the main liquid inlet holes (141), the main liquid inlet holes (141) are communicated with the polishing surface of the upper polishing disk (1), and the periphery of the inner side of the polishing surface of the upper polishing disk (1) forms the outlet ends of the main liquid inlet holes (141) which are uniformly arranged; the inlet ends of a circle of uniformly arranged auxiliary liquid inlet holes (151) are formed in the bottom of the outer ring groove, the auxiliary liquid outlet holes (133) are located at the inner ring and correspond to the inlet ends of the main liquid inlet holes (141), the auxiliary liquid inlet holes (151) are communicated with the polishing surface of the upper polishing disk (1), and the outlet ends of the uniformly arranged auxiliary liquid inlet holes (151) are formed in the circumferential direction, close to the outer side, of the polishing surface of the upper polishing disk (1).
2. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 1, wherein: the first liquid discharge hole (411) and the second liquid discharge hole (412) form an S-shaped cooling flow channel (410) in the collecting tray (4), and the outlet ends of the S-shaped cooling flow channel penetrate out of the lower portion of the collecting tray (4).
3. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 1, wherein: the outlet end of the first liquid drainage hole (411) is connected with a first connecting pipe (51), the outlet end of the second liquid drainage hole (412) is connected with a second connecting pipe (52), the inlet end of the circulating liquid cavity (413) is connected with a third connecting pipe (53), the first connecting pipe (51), the second connecting pipe (52), the third connecting pipe (53) and the waste liquid pipe (415) are connected with a switching mechanism (6), the switching mechanism (6) comprises four interfaces (61) connected with the first connecting pipe (51), the second connecting pipe (52), the third connecting pipe (53) and the waste liquid pipe (415), and a switching piece (62) used for adjusting the connection mode of the four interfaces (61), the number of the switching pieces (62) is at least two, one switching piece (62) is arranged to be a parallel flow passage (621), and the first connecting pipe (51) is communicated with the third connecting pipe (53), the second connecting pipe (52) is communicated with the waste liquid pipe (415); one of the switching pieces (62) is provided as a second Y-shaped flow passage (623) for communicating the first connection pipe (51), the second connection pipe (52) and the waste pipe (415), and the third connection pipe (53) is closed.
4. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 3, wherein: the switching piece (62) is also provided with a first Y-shaped flow passage (622) which enables the first connecting pipe (51), the second connecting pipe (52) and the third connecting pipe (53) to be communicated, and the waste liquid pipe (415) is closed.
5. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 3, wherein: the switching member (62) is further provided with an X-shaped flow passage (624) which communicates the second connecting pipe (52) with the third connecting pipe (53) and communicates the first connecting pipe (51) with the waste pipe (415).
6. A sapphire dielectrophoresis polisher waste liquid treatment apparatus according to claim 3 or 4 or 5 characterised in that: the switching mechanism (6) comprises a pipe body (63), two connectors (61) are respectively arranged on the upper side and the lower side of the pipe body (63), the switching pieces (62) are arranged in the pipe body (63) in a sliding mode through a driving air cylinder (64), and one switching piece (62) is made to move to correspond to the connector (61) through the stretching of the driving air cylinder (64).
7. A sapphire dielectrophoresis polisher waste liquid treatment apparatus according to any one of claims 1 to 5 characterised in that: be provided with down slide rail (021) on lower carriage (02), this down slide rail (021) go up can be gliding setting down shift frame (022) from top to bottom, lower polishing dish (2) rotatable setting is on lower shift frame (022), catch tray (4) fixed mounting is on lower shift frame (022).
8. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 1, wherein: the middle parts of the main liquid inlet holes (141) and/or the auxiliary liquid inlet holes (151) are communicated with the upper polishing disc (1) to form a cooling water cavity (16).
9. The waste liquid treatment device of the sapphire dielectrophoresis polishing machine according to claim 1, wherein: the polishing device is characterized in that an upper sliding rail (011) is arranged on the upper support (01), a sliding frame (012) is arranged on the upper sliding rail (011) and can slide up and down, the upper polishing disc (1) is rotatably arranged on the upper sliding frame (012), and a main liquid inlet disc (12) is fixedly arranged on the upper sliding frame (012).
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| CN202110765328.2A CN113458975B (en) | 2021-07-06 | 2021-07-06 | Sapphire dielectrophoresis burnishing machine waste liquid treatment device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110765328.2A CN113458975B (en) | 2021-07-06 | 2021-07-06 | Sapphire dielectrophoresis burnishing machine waste liquid treatment device |
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| CN113458975B true CN113458975B (en) | 2022-07-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029130A (en) * | 2014-06-06 | 2014-09-10 | 中国科学院长春光学精密机械与物理研究所 | Intelligent polishing agent supply circulating device |
| CN105033833A (en) * | 2015-08-11 | 2015-11-11 | 浙江工业大学 | Inner hole wall polishing device based on non-Newtonian fluid shear thickening mechanism |
| CN206393432U (en) * | 2016-11-30 | 2017-08-11 | 德米特（苏州）电子环保材料有限公司 | Workpiece surface treatment equipment |
| JP2019029562A (en) * | 2017-08-01 | 2019-02-21 | 株式会社荏原製作所 | Substrate processing apparatus |
| CN109877658A (en) * | 2019-03-26 | 2019-06-14 | 湖南科技大学 | A kind of shear thickening-electrophoresis composite polishing device |
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2021
- 2021-07-06 CN CN202110765328.2A patent/CN113458975B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029130A (en) * | 2014-06-06 | 2014-09-10 | 中国科学院长春光学精密机械与物理研究所 | Intelligent polishing agent supply circulating device |
| CN105033833A (en) * | 2015-08-11 | 2015-11-11 | 浙江工业大学 | Inner hole wall polishing device based on non-Newtonian fluid shear thickening mechanism |
| CN206393432U (en) * | 2016-11-30 | 2017-08-11 | 德米特（苏州）电子环保材料有限公司 | Workpiece surface treatment equipment |
| JP2019029562A (en) * | 2017-08-01 | 2019-02-21 | 株式会社荏原製作所 | Substrate processing apparatus |
| CN109877658A (en) * | 2019-03-26 | 2019-06-14 | 湖南科技大学 | A kind of shear thickening-electrophoresis composite polishing device |
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