SG10201802896WA - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
SG10201802896WA
SG10201802896WA SG10201802896WA SG10201802896WA SG10201802896WA SG 10201802896W A SG10201802896W A SG 10201802896WA SG 10201802896W A SG10201802896W A SG 10201802896WA SG 10201802896W A SG10201802896W A SG 10201802896WA SG 10201802896W A SG10201802896W A SG 10201802896WA
Authority
SG
Singapore
Prior art keywords
polishing
polished
temperature
liquid
pad
Prior art date
Application number
SG10201802896WA
Inventor
Sotozaki Hiroshi
Sone Tadakazu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201802896WA publication Critical patent/SG10201802896WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Disintegrating Or Milling (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

POLISHING APPARATUS AND POLISHING METHOD Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order. Selected Drawings: Fig. 2
SG10201802896WA 2017-04-11 2018-04-06 Polishing apparatus and polishing method SG10201802896WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017078060A JP6923342B2 (en) 2017-04-11 2017-04-11 Polishing equipment and polishing method

Publications (1)

Publication Number Publication Date
SG10201802896WA true SG10201802896WA (en) 2018-11-29

Family

ID=63710618

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802896WA SG10201802896WA (en) 2017-04-11 2018-04-06 Polishing apparatus and polishing method

Country Status (5)

Country Link
US (2) US11007621B2 (en)
JP (2) JP6923342B2 (en)
KR (2) KR102545500B1 (en)
SG (1) SG10201802896WA (en)
TW (1) TWI771404B (en)

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KR102591901B1 (en) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 Heat exchanger for regulating temperature of polishing surface of polishing pad, polishing apparatus having such heat exchanger, polishing method for substrate using such heat exchanger, and computer-readable storage medium storing a program for regulating temperature of polishing surface of polishing pad
JP6975078B2 (en) * 2018-03-15 2021-12-01 キオクシア株式会社 Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment
US11305397B2 (en) * 2018-06-18 2022-04-19 Seagate Technology Llc Lapping system that includes a lapping plate temperature control system, and related methods
CN109159020B (en) * 2018-10-26 2021-05-11 长江存储科技有限责任公司 Grinding device
EP3887093A4 (en) * 2018-11-27 2022-08-17 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
JP7152279B2 (en) * 2018-11-30 2022-10-12 株式会社荏原製作所 Polishing equipment
TWI771668B (en) * 2019-04-18 2022-07-21 美商應用材料股份有限公司 Temperature-based in-situ edge assymetry correction during cmp
US11897079B2 (en) * 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
JP7397617B2 (en) * 2019-10-16 2023-12-13 株式会社荏原製作所 polishing equipment
TWI826280B (en) 2019-11-22 2023-12-11 美商應用材料股份有限公司 Wafer edge asymmetry correction using groove in polishing pad
US11298798B2 (en) * 2020-02-14 2022-04-12 Nanya Technology Corporation Polishing delivery apparatus
CN112792711B (en) * 2020-12-31 2022-05-17 武汉风帆电化科技股份有限公司 Crystal silicon wafer alkali polishing device and polishing process
CN113510600B (en) * 2021-09-09 2021-11-30 南通兴胜灯具制造有限公司 Mirror polishing device for lamp manufacturing
CN114833725B (en) * 2022-05-18 2023-04-07 北京晶亦精微科技股份有限公司 Grinding fluid supply device and grinding machine

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Also Published As

Publication number Publication date
KR20180114834A (en) 2018-10-19
KR20230098505A (en) 2023-07-04
JP6923342B2 (en) 2021-08-18
JP7176059B2 (en) 2022-11-21
KR102545500B1 (en) 2023-06-21
TW201836764A (en) 2018-10-16
JP2018176339A (en) 2018-11-15
US20180290263A1 (en) 2018-10-11
TW202233354A (en) 2022-09-01
US11007621B2 (en) 2021-05-18
US11612983B2 (en) 2023-03-28
TWI771404B (en) 2022-07-21
US20210229240A1 (en) 2021-07-29
JP2021181154A (en) 2021-11-25

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