SG10201804390SA - Grinding apparatus - Google Patents

Grinding apparatus

Info

Publication number
SG10201804390SA
SG10201804390SA SG10201804390SA SG10201804390SA SG10201804390SA SG 10201804390S A SG10201804390S A SG 10201804390SA SG 10201804390S A SG10201804390S A SG 10201804390SA SG 10201804390S A SG10201804390S A SG 10201804390SA SG 10201804390S A SG10201804390S A SG 10201804390SA
Authority
SG
Singapore
Prior art keywords
grinding
holding table
workpiece held
stone
workpiece
Prior art date
Application number
SG10201804390SA
Inventor
Takenouchi Kenji
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201804390SA publication Critical patent/SG10201804390SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

GRINDING APPARATUS OF THE DISCLOSURE A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground. Figure 1
SG10201804390SA 2017-06-23 2018-05-23 Grinding apparatus SG10201804390SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017123036A JP6912284B2 (en) 2017-06-23 2017-06-23 Grinding device

Publications (1)

Publication Number Publication Date
SG10201804390SA true SG10201804390SA (en) 2019-01-30

Family

ID=64691844

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201804390SA SG10201804390SA (en) 2017-06-23 2018-05-23 Grinding apparatus

Country Status (4)

Country Link
US (1) US10953516B2 (en)
JP (1) JP6912284B2 (en)
CN (1) CN109108811B (en)
SG (1) SG10201804390SA (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6974979B2 (en) * 2017-08-22 2021-12-01 株式会社ディスコ Grinding device
CN109483418B (en) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 Metal-based micro-lubrication grinding wheel and manufacturing method thereof
JP2020124753A (en) * 2019-02-01 2020-08-20 株式会社ディスコ Measuring tool
JP7181818B2 (en) * 2019-03-08 2022-12-01 株式会社荏原製作所 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING PHOTOCATALYST
CN110640572A (en) * 2019-09-17 2020-01-03 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Profile grinding and chamfering actuating mechanism for special-shaped wafer with good waterproof performance
CN110744386A (en) * 2019-09-17 2020-02-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Profile grinding chamfering machine for special-shaped wafer
JP7391470B2 (en) * 2019-12-20 2023-12-05 株式会社ディスコ Workpiece grinding method
JP2022168925A (en) * 2021-04-27 2022-11-09 株式会社ディスコ Grinding method
CN115194664B (en) * 2022-07-05 2023-06-20 湖南锐健科技有限公司 Precise grinding wheel for silicon carbide linear slide rail based on rheological property of non-Newtonian fluid

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219377A (en) * 1985-07-18 1987-01-28 F S K:Kk Superfine-sand grindstone
JPH0947947A (en) * 1994-08-30 1997-02-18 Seiko Seiki Co Ltd Grinding device, and grinding method, and semiconductor device, and manufacture of semiconductor substrate
US6050876A (en) * 1997-08-08 2000-04-18 Cabot Corporation Automated abrader
JP2001284303A (en) 2000-03-29 2001-10-12 Disco Abrasive Syst Ltd Polishing apparatus
US6533641B1 (en) * 2000-09-21 2003-03-18 Advanced Micro Devices, Inc. Grinding arrangement and method for real-time viewing of samples during cross-sectioning
JP5507294B2 (en) * 2010-03-05 2014-05-28 東芝機械株式会社 Grinding machine with distance measuring function
JP6016301B2 (en) * 2013-02-13 2016-10-26 昭和電工株式会社 Surface processing method of single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface processing of single crystal SiC substrate
JP6125867B2 (en) * 2013-03-26 2017-05-10 株式会社ディスコ Cutting method
CN104669075B (en) * 2014-12-08 2017-08-04 沈阳工业大学 Diamond cutter photocatalysis aids in grinding method and device
JP6417227B2 (en) * 2015-01-27 2018-10-31 株式会社ディスコ Cutting blade, cutting apparatus, and wafer processing method
JP6475518B2 (en) * 2015-03-03 2019-02-27 株式会社ディスコ Wafer processing method
CN105773399A (en) * 2016-03-29 2016-07-20 清华大学 Polishing solution, polishing machine and polishing method
CN106189872A (en) * 2016-07-13 2016-12-07 清华大学 A kind of polishing composition and preparation, finishing method

Also Published As

Publication number Publication date
US20180369990A1 (en) 2018-12-27
CN109108811A (en) 2019-01-01
CN109108811B (en) 2022-04-05
JP2019005841A (en) 2019-01-17
JP6912284B2 (en) 2021-08-04
US10953516B2 (en) 2021-03-23

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