KR102314416B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR102314416B1
KR102314416B1 KR1020150095813A KR20150095813A KR102314416B1 KR 102314416 B1 KR102314416 B1 KR 102314416B1 KR 1020150095813 A KR1020150095813 A KR 1020150095813A KR 20150095813 A KR20150095813 A KR 20150095813A KR 102314416 B1 KR102314416 B1 KR 102314416B1
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KR
South Korea
Prior art keywords
polishing
rotary joint
ring
rotation stop
spherical sliding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150095813A
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English (en)
Korean (ko)
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KR20160006611A (ko
Inventor
히데오 아이자와
마사오 우메모토
다다카즈 소네
류이치 고스게
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20160006611A publication Critical patent/KR20160006611A/ko
Application granted granted Critical
Publication of KR102314416B1 publication Critical patent/KR102314416B1/ko
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Classifications

    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • H01L21/02024—
    • H01L21/67092—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020150095813A 2014-07-09 2015-07-06 연마 장치 Active KR102314416B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置
JPJP-P-2014-141732 2014-07-09

Publications (2)

Publication Number Publication Date
KR20160006611A KR20160006611A (ko) 2016-01-19
KR102314416B1 true KR102314416B1 (ko) 2021-10-19

Family

ID=55066894

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150095813A Active KR102314416B1 (ko) 2014-07-09 2015-07-06 연마 장치

Country Status (4)

Country Link
US (1) US9522453B2 (enExample)
JP (1) JP6259366B2 (enExample)
KR (1) KR102314416B1 (enExample)
SG (1) SG10201505284QA (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP7050560B2 (ja) * 2018-04-18 2022-04-08 株式会社荏原製作所 研磨装置及び基板処理装置
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
SG11202103477TA (en) * 2018-09-07 2021-05-28 Hangzhou Zhonggui Electronic Technology Co Ltd Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
CN119368489A (zh) * 2024-11-28 2025-01-28 江苏科沛达半导体科技有限公司 一种晶圆底面清洗装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000254356A (ja) * 1999-03-12 2000-09-19 Kinki Sharyo Co Ltd 揺動装置
JP2009079652A (ja) * 2007-09-26 2009-04-16 Minebea Co Ltd 樹脂ライナ付き球面すべり軸受およびロッドエンド軸受

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Publication number Priority date Publication date Assignee Title
JP3002300B2 (ja) * 1991-07-12 2000-01-24 日本トムソン株式会社 球面滑り軸受及びその製造方法
US5303959A (en) * 1993-02-01 1994-04-19 The Johnson Corporation High speed rotary joint
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
US6021695A (en) * 1996-11-11 2000-02-08 Hitachi Seiki Co., Ltd. Lathe and a machining system of a lathe
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
JP3192396B2 (ja) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 流体用ロータリジョイント
GB9726981D0 (en) * 1997-12-22 1998-02-18 Rolls Royce Plc Method and apparatus for grinding
JP2000000730A (ja) * 1998-06-12 2000-01-07 Yamato Kikai Kigu Kk 冷凍チャック
JP2000177984A (ja) * 1998-12-16 2000-06-27 Tadano Ltd 油圧作業機のロータリージョイント取付構造
JP2000205469A (ja) * 1999-01-13 2000-07-25 Surpass Kogyo Kk ロ―タリ―ジョイント
US6126207A (en) * 1999-03-08 2000-10-03 The Johnson Corporation Rotary joint with shear pins
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6402602B1 (en) * 2001-01-04 2002-06-11 Speedfam-Ipec Corporation Rotary union for semiconductor wafer applications
JP2004042163A (ja) * 2002-07-09 2004-02-12 Ebara Corp 研磨装置及びその消耗・交換部品の貼付け剥がし方法
JP2004181586A (ja) * 2002-12-04 2004-07-02 Koyo Seiko Co Ltd 油圧ロータリージョイント及びこれを用いた超仕上機
JP2007222965A (ja) 2006-02-21 2007-09-06 Ebara Corp 研磨テーブルの定盤製造方法、研磨テーブル、及び研磨装置
KR101358645B1 (ko) * 2007-09-04 2014-02-05 삼성전자주식회사 웨이퍼 연마 캐리어 장치 및 그가 채용되는 화학적 기계적연마 설비
US20150118944A1 (en) * 2013-01-31 2015-04-30 Ebara Corporation Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
US20150017889A1 (en) * 2013-07-12 2015-01-15 Ebara Corporation Polishing apparatus
JP6362390B2 (ja) * 2014-04-10 2018-07-25 株式会社荏原製作所 ロータリージョイント、及び、研磨装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000254356A (ja) * 1999-03-12 2000-09-19 Kinki Sharyo Co Ltd 揺動装置
JP2009079652A (ja) * 2007-09-26 2009-04-16 Minebea Co Ltd 樹脂ライナ付き球面すべり軸受およびロッドエンド軸受

Also Published As

Publication number Publication date
KR20160006611A (ko) 2016-01-19
SG10201505284QA (en) 2016-02-26
JP2016016491A (ja) 2016-02-01
JP6259366B2 (ja) 2018-01-10
US9522453B2 (en) 2016-12-20
US20160008948A1 (en) 2016-01-14

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