JP6189042B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6189042B2 JP6189042B2 JP2013022797A JP2013022797A JP6189042B2 JP 6189042 B2 JP6189042 B2 JP 6189042B2 JP 2013022797 A JP2013022797 A JP 2013022797A JP 2013022797 A JP2013022797 A JP 2013022797A JP 6189042 B2 JP6189042 B2 JP 6189042B2
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- Prior art keywords
- layer
- oxide semiconductor
- insulating layer
- film
- transistor
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- 238000007254 oxidation reaction Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/66409—Unipolar field-effect transistors
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
- H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02244—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02252—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by plasma treatment, e.g. plasma oxidation of the substrate
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
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- H01L21/02551—Group 12/16 materials
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Description
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図1乃至図4を用いて説明する。本実施の形態では、半導体装置の一例として酸化物半導体層を有するトランジスタを示す。
本実施の形態では、実施の形態1と異なる構造を有する半導体装置について図5乃至図7を用いて説明する。
本実施の形態では、本明細書に示すトランジスタを使用し、電力が供給されない状況でも記憶内容の保持が可能で、かつ、書き込み回数にも制限が無い半導体装置(記憶装置)の一例を、図面を用いて説明する。
本実施の形態では、実施の形態3とは異なる記憶装置の構造の一形態について説明する。
本実施の形態では、半導体装置の一例として、上記実施の形態1又は2に開示したトランジスタを少なくとも一部に用いたCPU(Central Processing Unit)について説明する。
本明細書に開示する半導体装置は、さまざまな電子機器(遊技機も含む)に適用することができる。電子機器としては、テレビ、モニタ等の表示装置、照明装置、デスクトップ型或いはノート型のパーソナルコンピュータ、ワードプロセッサ、DVD(Digital Versatile Disc)などの記録媒体に記憶された静止画又は動画を再生する画像再生装置、ポータブルCDプレーヤ、ラジオ、テープレコーダ、ヘッドホンステレオ、ステレオ、コードレス電話子機、トランシーバ、携帯無線機、携帯電話、自動車電話、携帯型ゲーム機、電卓、携帯情報端末、電子手帳、電子書籍、電子翻訳機、音声入力機器、ビデオカメラ、デジタルスチルカメラ、電気シェーバ、電子レンジ等の高周波加熱装置、電気炊飯器、電気洗濯機、電気掃除機、エアコンディショナーなどの空調設備、食器洗い器、食器乾燥器、衣類乾燥器、布団乾燥器、電気冷蔵庫、電気冷凍庫、電気冷凍冷蔵庫、DNA保存用冷凍庫、煙感知器、放射線測定器、透析装置等の医療機器、などが挙げられる。さらに、誘導灯、信号機、ベルトコンベア、エレベータ、エスカレータ、産業用ロボット、電力貯蔵システム等の産業機器も挙げられる。また、石油を用いたエンジンや、非水系二次電池からの電力を用いて電動機により推進する移動体なども、電気機器の範疇に含まれるものとする。上記移動体として、例えば、電気自動車(EV)、内燃機関と電動機を併せ持ったハイブリッド車(HEV)、プラグインハイブリッド車(PHEV)、これらのタイヤ車輪を無限軌道に変えた装軌車両、電動アシスト自転車を含む原動機付自転車、自動二輪車、電動車椅子、ゴルフ用カート、小型又は大型船舶、潜水艦、ヘリコプター、航空機、ロケット、人工衛星、宇宙探査機や惑星探査機、宇宙船が挙げられる。これらの電子機器の具体例を図12に示す。
108 ゲート絶縁層
110 ゲート電極層
116 チャネル形成領域
120 不純物領域
124 金属間化合物領域
128 絶縁層
130 絶縁層
140 ゲート絶縁層
142a 電極層
142b 電極層
144 酸化物半導体層
145 絶縁層
146 側壁絶縁層
148a ゲート電極層
148b 導電層
150 絶縁層
152 絶縁層
156 配線
160 トランジスタ
162 トランジスタ
164 容量素子
185 基板
400 基板
401 ゲート電極層
402 ゲート絶縁層
402a ゲート絶縁膜
403 酸化物半導体層
403a 領域
403b 領域
405 導電膜
405a ソース電極層
405b ドレイン電極層
407 絶縁層
410 金属膜
411 絶縁層
411a 絶縁膜
412 側壁絶縁層
412a 絶縁膜
412b 絶縁膜
414 絶縁層
415a ソース配線層
415b ドレイン配線層
416 絶縁層
420 トランジスタ
422 トランジスタ
424 トランジスタ
426 トランジスタ
428 トランジスタ
430 トランジスタ
431 酸素
432 トランジスタ
434 トランジスタ
435 レジストマスク
436 下地絶縁層
445a 非晶質領域
445b 非晶質領域
1141 スイッチング素子
1142 メモリセル
1143 メモリセル群
1189 ROMインターフェース
1190 基板
1191 ALU
1192 ALUコントローラ
1193 インストラクションデコーダ
1194 インタラプトコントローラ
1195 タイミングコントローラ
1196 レジスタ
1197 レジスタコントローラ
1198 バスインターフェース
1199 ROM
3000 基板
3001 トランジスタ
3003a 電極層
3003b 電極層
3003c 電極層
3004 論理回路
3021 本体
3022 固定部
3023 表示部
3024 操作ボタン
3025 外部メモリスロット
3100a 配線
3100b 配線
3100c 配線
3100d 配線
3106 素子分離絶縁層
3140a 絶縁層
3140b 絶縁層
3141a 絶縁層
3141b 絶縁層
3142a 絶縁層
3142b 絶縁層
3170a メモリセル
3170b メモリセル
3171a トランジスタ
3171b トランジスタ
3303 電極層
3400 メモリセルアレイ
3501a 電極層
3501b 電極層
3501c 電極層
3502a 電極層
3502b 電極層
3502c 電極層
3503a 電極層
3503b 電極層
3505 電極層
8000 テレビジョン装置
8001 筐体
8002 表示部
8003 スピーカ部
8200 室内機
8201 筐体
8202 送風口
8203 CPU
8204 室外機
8300 電気冷凍冷蔵庫
8301 筐体
8302 冷蔵室用扉
8303 冷凍室用扉
8304 CPU
9000 テーブル
9001 筐体
9002 脚部
9003 表示部
9004 表示ボタン
9005 電源コード
9033 留め具
9034 スイッチ
9035 電源スイッチ
9036 スイッチ
9038 操作スイッチ
9201 本体
9202 筐体
9203 表示部
9204 キーボード
9205 外部接続ポート
9206 ポインティングデバイス
9630 筐体
9631 表示部
9631a 表示部
9631b 表示部
9632a 領域
9632b 領域
9633 太陽電池
9634 充放電制御回路
9635 バッテリー
9636 DCDCコンバータ
9637 コンバータ
9638 操作キー
9639 ボタン
9700 電気自動車
9701 二次電池
9702 制御回路
9703 駆動装置
9704 処理装置
Claims (5)
- 酸化物半導体層と、
前記酸化物半導体層上のゲート絶縁層と、
前記ゲート絶縁層を介して前記酸化物半導体層と重畳するゲート電極層と、
前記ゲート絶縁層の側面、並びに、前記ゲート電極層の側面及び上面を覆う第1の絶縁層と、
前記第1の絶縁層を介して前記ゲート電極層の側面を覆う第2の絶縁層と、
前記酸化物半導体層と電気的に接続するソース電極層及びドレイン電極層と、有し、
前記第1の絶縁層は、前記ゲート絶縁層よりも酸素に対する透過性が低く、
前記第2の絶縁層は、酸化シリコン、窒化シリコン、酸化窒化シリコン、又は窒化酸化シリコンを有する半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層上のゲート絶縁層と、
前記ゲート絶縁層を介して前記酸化物半導体層と重畳するゲート電極層と、
前記ゲート絶縁層の側面、並びに、前記ゲート電極層の側面及び上面を覆う第1の絶縁層と、
前記第1の絶縁層を介して前記ゲート電極層の側面を覆う第2の絶縁層と、
前記酸化物半導体層と電気的に接続するソース電極層及びドレイン電極層と、有し、
前記第1の絶縁層は、前記ゲート絶縁層よりも酸素に対する透過性が低く、
前記第1の絶縁層は、アルミニウムの酸化物膜を有し、
前記第2の絶縁層は、酸化シリコン、窒化シリコン、酸化窒化シリコン、又は窒化酸化シリコンを有する半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層上のゲート絶縁層と、
前記ゲート絶縁層を介して前記酸化物半導体層と重畳するゲート電極層と、
前記ゲート絶縁層の側面、並びに、前記ゲート電極層の側面及び上面を覆う第1の絶縁層と、
前記第1の絶縁層を介して前記ゲート電極層の側面を覆う第2の絶縁層と、
前記酸化物半導体層と接するソース電極層及びドレイン電極層と、を有し、
前記酸化物半導体層は、非単結晶であって、結晶成分を含み、
前記酸化物半導体層において、前記ソース電極層及び前記ドレイン電極層と接する領域では、前記結晶成分の占める割合が、前記ゲート電極層と重畳する領域よりも低い半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層上のゲート絶縁層と、
前記ゲート絶縁層を介して前記酸化物半導体層と重畳するゲート電極層と、
前記ゲート絶縁層の側面、並びに、前記ゲート電極層の側面及び上面を覆う第1の絶縁層と、
前記第1の絶縁層を介して前記ゲート電極層の側面を覆う第2の絶縁層と、
前記酸化物半導体層と接するソース電極層及びドレイン電極層と、を有し、
前記酸化物半導体層は、非単結晶であって、結晶成分を含み、
前記酸化物半導体層において、前記ソース電極層及び前記ドレイン電極層と接する領域では、前記結晶成分の占める割合が、前記ゲート電極層と重畳する領域よりも低く、
前記第1の絶縁層は、アルミニウムの酸化物膜を有する半導体装置。 - 請求項3又は請求項4において、
前記第2の絶縁層は、酸化シリコン、窒化シリコン、酸化窒化シリコン、又は窒化酸化シリコンを有する半導体装置。
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2013
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- 2013-02-08 JP JP2013022797A patent/JP6189042B2/ja not_active Expired - Fee Related
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- 2017-12-27 US US15/855,047 patent/US20180122629A1/en not_active Abandoned
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US9859114B2 (en) | 2018-01-02 |
US20130200375A1 (en) | 2013-08-08 |
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US20180122629A1 (en) | 2018-05-03 |
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