JP6177342B2 - 部品装着機 - Google Patents

部品装着機 Download PDF

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Publication number
JP6177342B2
JP6177342B2 JP2015544730A JP2015544730A JP6177342B2 JP 6177342 B2 JP6177342 B2 JP 6177342B2 JP 2015544730 A JP2015544730 A JP 2015544730A JP 2015544730 A JP2015544730 A JP 2015544730A JP 6177342 B2 JP6177342 B2 JP 6177342B2
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JP
Japan
Prior art keywords
component
holder
holders
mounting machine
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015544730A
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English (en)
Japanese (ja)
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JPWO2015063934A1 (ja
Inventor
伊藤　秀俊
秀俊 伊藤
安井　義博
義博 安井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of JPWO2015063934A1 publication Critical patent/JPWO2015063934A1/ja
Application granted granted Critical
Publication of JP6177342B2 publication Critical patent/JP6177342B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2015544730A 2013-10-31 2013-10-31 部品装着機 Active JP6177342B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/079601 WO2015063934A1 (ja) 2013-10-31 2013-10-31 部品装着機

Publications (2)

Publication Number Publication Date
JPWO2015063934A1 JPWO2015063934A1 (ja) 2017-03-09
JP6177342B2 true JP6177342B2 (ja) 2017-08-09

Family

ID=53003577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015544730A Active JP6177342B2 (ja) 2013-10-31 2013-10-31 部品装着機

Country Status (5)

Country Link
US (1) US10462947B2 (de)
EP (1) EP3065522B1 (de)
JP (1) JP6177342B2 (de)
CN (1) CN105706543B (de)
WO (1) WO2015063934A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11419251B2 (en) 2017-02-23 2022-08-16 Fuji Corporation Component mounting device
US11553633B2 (en) 2017-12-13 2023-01-10 Fuji Corporation Mounting device, information processing device, mounting method, and information processing method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6484804B2 (ja) * 2015-05-28 2019-03-20 パナソニックＩｐマネジメント株式会社 部品実装ラインにおける部品補給支援方法および部品補給支援システム
CN107950086B (zh) * 2015-06-25 2019-12-03 株式会社富士 元件安装装置
JP6546664B2 (ja) * 2015-10-01 2019-07-17 ヤマハ発動機株式会社 ロータリーヘッド、及び、表面実装機
CN108029239B (zh) * 2015-10-01 2019-12-20 雅马哈发动机株式会社 旋转头以及表面安装机
WO2017081809A1 (ja) 2015-11-13 2017-05-18 ヤマハ発動機株式会社 部品実装装置、部品実装方法、及び、表面実装機
JP6529442B2 (ja) * 2016-01-08 2019-06-12 ヤマハ発動機株式会社 保持部駆動ユニット設定方法、制御装置、部品実装装置、及び、表面実装機
WO2018100737A1 (ja) * 2016-12-02 2018-06-07 株式会社Ｆｕｊｉ 対基板作業機
JP6543816B2 (ja) * 2017-02-15 2019-07-17 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
US11129315B2 (en) 2017-03-28 2021-09-21 Fuji Corporation Component mounter
US11210764B2 (en) * 2017-06-21 2021-12-28 Fuji Corporation Apparatus for performing work on substrate
EP3806614B1 (de) * 2018-05-30 2023-06-14 Fuji Corporation Komponentenmontagesystem
EP3914059B1 (de) * 2019-01-18 2024-05-15 Fuji Corporation Montagekopf, verfahren zum speichern von betriebsdaten für montagekopf und komponentenmontagevorrichtung

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JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
JPH01205500A (ja) 1988-02-10 1989-08-17 Sony Corp 部品マウント装置
US4979286A (en) * 1988-05-13 1990-12-25 Hitachi, Ltd. Electric parts mounting apparatus and electric parts mounting method
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
DE69300850T2 (de) * 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JP3313224B2 (ja) * 1994-01-25 2002-08-12 松下電器産業株式会社 電子部品実装装置
JP3554615B2 (ja) * 1995-07-19 2004-08-18 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP3549073B2 (ja) * 1995-09-11 2004-08-04 松下電器産業株式会社 電子部品実装方法および電子部品実装装置
JP3552810B2 (ja) * 1995-09-27 2004-08-11 松下電器産業株式会社 部品供給部の部品一括交換方法と装置
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
US6073342A (en) * 1996-11-27 2000-06-13 Fuji Machine Mfg., Co., Ltd. Circuit-substrate-related-operation performing system
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
JP4145489B2 (ja) * 1997-08-29 2008-09-03 松下電器産業株式会社 部品装着方法及び部品装着装置
EP1771059A3 (de) * 1997-11-10 2007-04-11 Matsushita Electric Industrial Co., Ltd. Verfahren für Installation von Komponenten und Komponentenzulieferungsanlage
JP2001135995A (ja) * 1999-11-05 2001-05-18 Matsushita Electric Ind Co Ltd 部品実装装置及び方法
JP4963766B2 (ja) * 1999-11-08 2012-06-27 パナソニック株式会社 電子部品実装装置及びその方法
JP2002298132A (ja) * 2001-04-02 2002-10-11 Fuji Mach Mfg Co Ltd 撮像システム，撮像システム制御プログラムおよび電気部品装着システム
US7527629B2 (en) * 2002-03-12 2009-05-05 Cervitech, Inc. Instrument set for fitting an intervertebral joint prosthesis
JP4033705B2 (ja) * 2002-05-08 2008-01-16 富士機械製造株式会社 プリント配線板位置誤差取得方法，プログラムおよび電子回路部品装着システム
JP4365883B2 (ja) 2002-07-19 2009-11-18 富士機械製造株式会社 対基板作業システム
US20060053624A1 (en) * 2002-08-06 2006-03-16 Takashi Maeda Method and equipment for mounting part
KR101051498B1 (ko) * 2002-09-30 2011-07-22 소니 주식회사 전자 부품 위치 맞춤 방법 및 그 장치
JP2004265886A (ja) * 2003-01-15 2004-09-24 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
CN100566534C (zh) * 2003-01-17 2009-12-02 富士机械制造株式会社 对电路基板作业机及其构成要件的提供方法
JP4044017B2 (ja) * 2003-04-22 2008-02-06 松下電器産業株式会社 部品実装装置及びその方法
WO2005039268A1 (ja) * 2003-10-15 2005-04-28 Matsushita Electric Industrial Co., Ltd. 部品装着装置
JP3981834B2 (ja) * 2003-11-19 2007-09-26 ソニー株式会社 部品実装装置
WO2006064680A1 (ja) * 2004-12-15 2006-06-22 Matsushita Electric Industrial Co., Ltd. 動作時間短縮方法、動作時間短縮装置、プログラムおよび部品実装機
US7591068B2 (en) * 2005-02-25 2009-09-22 Panasonic Corporation Board positioning method
JP4733499B2 (ja) * 2005-10-31 2011-07-27 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP2009038147A (ja) 2007-07-31 2009-02-19 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP4545822B2 (ja) * 2009-08-18 2010-09-15 パナソニック株式会社 ロータリー型部品実装装置
JP5206654B2 (ja) * 2009-12-01 2013-06-12 パナソニック株式会社 部品実装装置および部品実装装置における基板搬送方法
JP5875038B2 (ja) * 2011-09-21 2016-03-02 富士機械製造株式会社 電子回路部品装着機
JP5812783B2 (ja) * 2011-09-21 2015-11-17 富士機械製造株式会社 電子回路部品装着機
EP2822373B1 (de) * 2012-02-28 2019-01-09 FUJI Corporation Maschine zur montage von komponenten
US10104819B2 (en) * 2013-07-12 2018-10-16 Fuji Corporation Component mounting machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11419251B2 (en) 2017-02-23 2022-08-16 Fuji Corporation Component mounting device
US11553633B2 (en) 2017-12-13 2023-01-10 Fuji Corporation Mounting device, information processing device, mounting method, and information processing method

Also Published As

Publication number Publication date
US20160249497A1 (en) 2016-08-25
EP3065522B1 (de) 2017-11-22
US10462947B2 (en) 2019-10-29
EP3065522A1 (de) 2016-09-07
JPWO2015063934A1 (ja) 2017-03-09
CN105706543B (zh) 2018-09-28
EP3065522A4 (de) 2016-10-19
WO2015063934A1 (ja) 2015-05-07
CN105706543A (zh) 2016-06-22

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