JP6116456B2 - 描画方法および描画装置 - Google Patents

描画方法および描画装置 Download PDF

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Publication number
JP6116456B2
JP6116456B2 JP2013197992A JP2013197992A JP6116456B2 JP 6116456 B2 JP6116456 B2 JP 6116456B2 JP 2013197992 A JP2013197992 A JP 2013197992A JP 2013197992 A JP2013197992 A JP 2013197992A JP 6116456 B2 JP6116456 B2 JP 6116456B2
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Japan
Prior art keywords
positional deviation
detection target
deviation amount
adjustment process
substrate
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Active
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JP2013197992A
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English (en)
Japanese (ja)
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JP2015065275A (ja
Inventor
中井　一博
一博 中井
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2013197992A priority Critical patent/JP6116456B2/ja
Priority to KR1020140094643A priority patent/KR101574898B1/ko
Priority to CN201410449209.6A priority patent/CN104465335B/zh
Priority to TW103131464A priority patent/TWI547973B/zh
Publication of JP2015065275A publication Critical patent/JP2015065275A/ja
Application granted granted Critical
Publication of JP6116456B2 publication Critical patent/JP6116456B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013197992A 2013-09-25 2013-09-25 描画方法および描画装置 Active JP6116456B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013197992A JP6116456B2 (ja) 2013-09-25 2013-09-25 描画方法および描画装置
KR1020140094643A KR101574898B1 (ko) 2013-09-25 2014-07-25 묘화 방법 및 묘화 장치
CN201410449209.6A CN104465335B (zh) 2013-09-25 2014-09-04 描绘方法以及描绘装置
TW103131464A TWI547973B (zh) 2013-09-25 2014-09-12 描繪方法以及描繪裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013197992A JP6116456B2 (ja) 2013-09-25 2013-09-25 描画方法および描画装置

Publications (2)

Publication Number Publication Date
JP2015065275A JP2015065275A (ja) 2015-04-09
JP6116456B2 true JP6116456B2 (ja) 2017-04-19

Family

ID=52832925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013197992A Active JP6116456B2 (ja) 2013-09-25 2013-09-25 描画方法および描画装置

Country Status (4)

Country Link
JP (1) JP6116456B2 (ko)
KR (1) KR101574898B1 (ko)
CN (1) CN104465335B (ko)
TW (1) TWI547973B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106019851B (zh) * 2015-03-30 2018-05-25 株式会社思可林集团 基准位置获取方法、基准位置获取装置、图案描绘方法、图案描绘装置、以及记录程序的记录媒体
CN108181478B (zh) * 2017-12-19 2021-01-05 西北工业大学 一种阵列式微流控芯片的荧光采集分析方法
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP7463154B2 (ja) * 2020-03-24 2024-04-08 株式会社Ｓｃｒｅｅｎホールディングス 描画装置、データ処理装置、描画方法、および描画データ生成方法
CN112864037A (zh) * 2021-01-14 2021-05-28 长鑫存储技术有限公司 晶圆量测方法、装置、介质和电子设备
JP7359899B1 (ja) 2022-04-27 2023-10-11 華邦電子股▲ふん▼有限公司 半導体製造装置及びその半導体製造方法
CN114999931A (zh) * 2022-06-02 2022-09-02 上海美维科技有限公司 一种提高芯片对位精度的板级扇出型封装方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168590B2 (ja) * 1991-03-07 2001-05-21 日本電気株式会社 縮小投影露光方法
JP4109736B2 (ja) * 1997-11-14 2008-07-02 キヤノン株式会社 位置ずれ検出方法
JP2000122303A (ja) * 1998-10-20 2000-04-28 Asahi Optical Co Ltd 描画装置
CN1285112C (zh) * 2002-11-26 2006-11-15 松下电器产业株式会社 掩模图形的检验方法和检验装置
CN1766738A (zh) * 2004-09-30 2006-05-03 富士胶片株式会社 描绘方法及装置
JP4588581B2 (ja) * 2004-09-30 2010-12-01 富士フイルム株式会社 描画方法および装置
JP2006309022A (ja) * 2005-04-28 2006-11-09 Fuji Photo Film Co Ltd 描画装置および描画方法
JP2007199225A (ja) * 2006-01-25 2007-08-09 Cmk Corp 露光システム及び部品内蔵型プリント配線板の製造方法
TW200817846A (en) * 2006-08-22 2008-04-16 Dainippon Screen Mfg Drawing device and alignment method
EP2539776A1 (en) * 2010-02-26 2013-01-02 Micronic Mydata AB Method and apparatus for performing pattern alignment
JP5637771B2 (ja) * 2010-08-17 2014-12-10 株式会社Ｓｃｒｅｅｎホールディングス 直接描画方法および直接描画装置
JP5622507B2 (ja) * 2010-09-29 2014-11-12 大日本スクリーン製造株式会社 パターン描画方法、パターン描画装置、データ処理装置およびデータ処理方法
JP5890139B2 (ja) * 2011-09-30 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 描画装置およびその焦点調整方法

Also Published As

Publication number Publication date
TWI547973B (zh) 2016-09-01
CN104465335B (zh) 2017-04-05
JP2015065275A (ja) 2015-04-09
CN104465335A (zh) 2015-03-25
KR101574898B1 (ko) 2015-12-04
TW201513171A (zh) 2015-04-01
KR20150034079A (ko) 2015-04-02

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