JP6059472B2 - 硬化性シリコーン組成物および光半導体装置 - Google Patents

硬化性シリコーン組成物および光半導体装置 Download PDF

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Publication number
JP6059472B2
JP6059472B2 JP2012197421A JP2012197421A JP6059472B2 JP 6059472 B2 JP6059472 B2 JP 6059472B2 JP 2012197421 A JP2012197421 A JP 2012197421A JP 2012197421 A JP2012197421 A JP 2012197421A JP 6059472 B2 JP6059472 B2 JP 6059472B2
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Prior art keywords
curable silicone
group
silicone composition
triazole
component
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JP2012197421A
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Japanese (ja)
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JP2014051606A5 (enExample
JP2014051606A (ja
Inventor
侑典 宮本
侑典 宮本
吉武　誠
誠 吉武
宏明 吉田
宏明 吉田
稔樹 中田
稔樹 中田
和夫 平井
和夫 平井
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2012197421A priority Critical patent/JP6059472B2/ja
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to TW102132341A priority patent/TWI640577B/zh
Priority to KR1020157005777A priority patent/KR101901565B1/ko
Priority to CN201380044230.1A priority patent/CN104583280B/zh
Priority to PCT/JP2013/074780 priority patent/WO2014038727A2/en
Priority to EP13770977.0A priority patent/EP2892945B1/en
Priority to US14/426,524 priority patent/US9464211B2/en
Publication of JP2014051606A publication Critical patent/JP2014051606A/ja
Publication of JP2014051606A5 publication Critical patent/JP2014051606A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dispersion Chemistry (AREA)
JP2012197421A 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置 Active JP6059472B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012197421A JP6059472B2 (ja) 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置
KR1020157005777A KR101901565B1 (ko) 2012-09-07 2013-09-06 경화성 실리콘 조성물 및 광반도체 장치
CN201380044230.1A CN104583280B (zh) 2012-09-07 2013-09-06 固化性硅酮组合物和光学半导体器件
PCT/JP2013/074780 WO2014038727A2 (en) 2012-09-07 2013-09-06 Curable silicone composition and optical semiconductor device
TW102132341A TWI640577B (zh) 2012-09-07 2013-09-06 可硬化性聚矽氧組合物及光半導體裝置
EP13770977.0A EP2892945B1 (en) 2012-09-07 2013-09-06 Curable silicone composition and optical semiconductor device
US14/426,524 US9464211B2 (en) 2012-09-07 2013-09-06 Curable silicone composition and optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012197421A JP6059472B2 (ja) 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置

Publications (3)

Publication Number Publication Date
JP2014051606A JP2014051606A (ja) 2014-03-20
JP2014051606A5 JP2014051606A5 (enExample) 2015-10-01
JP6059472B2 true JP6059472B2 (ja) 2017-01-11

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JP2012197421A Active JP6059472B2 (ja) 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置

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US (1) US9464211B2 (enExample)
EP (1) EP2892945B1 (enExample)
JP (1) JP6059472B2 (enExample)
KR (1) KR101901565B1 (enExample)
CN (1) CN104583280B (enExample)
TW (1) TWI640577B (enExample)
WO (1) WO2014038727A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106029556B (zh) 2014-04-09 2019-06-18 美国陶氏有机硅公司 疏水制品
JP6324206B2 (ja) * 2014-05-16 2018-05-16 アイカ工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
EP3153516A4 (en) * 2014-05-30 2018-03-07 Dow Corning Toray Co., Ltd. Organic silicon compound, curable silicone composition, and semiconductor device
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
JP2016084419A (ja) * 2014-10-27 2016-05-19 信越化学工業株式会社 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ
JP6572634B2 (ja) * 2015-06-09 2019-09-11 信越化学工業株式会社 付加硬化性シリコーンゴム組成物及び硬化物
JP6704189B2 (ja) * 2015-08-03 2020-06-03 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
CN107841141A (zh) * 2016-09-21 2018-03-27 王志明 硬化性混合硅氧烷树脂组合物、其硬化物及其应用
JP6614362B2 (ja) * 2016-10-26 2019-12-04 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2018121706A1 (en) * 2016-12-30 2018-07-05 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物
WO2021213662A1 (en) * 2020-04-23 2021-10-28 Wacker Chemie Ag Optical bonding silicone with uv blocker for outdoor application
WO2022013917A1 (ja) * 2020-07-13 2022-01-20 ダウ・東レ株式会社 シリコーンゲル組成物、その硬化物、およびそれらの用途
TWI861156B (zh) * 2020-07-15 2024-11-11 日商陶氏東麗股份有限公司 矽氧凝膠組成物、其硬化物、及該等之用途
JP2022042170A (ja) 2020-09-02 2022-03-14 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱硬化性シリコーン組成物
KR20230135676A (ko) * 2021-03-08 2023-09-25 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 봉지재 및 광반도체 장치
JP2022178085A (ja) * 2021-05-19 2022-12-02 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
CN117715986A (zh) * 2021-08-05 2024-03-15 美国陶氏有机硅公司 硅氢加成可固化聚有机硅氧烷组合物及其制备方法和其在封装膜中的用途
JP7643372B2 (ja) * 2022-02-17 2025-03-11 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
JP2025521513A (ja) * 2022-07-11 2025-07-10 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物及びその硬化物
CN119403883A (zh) * 2022-07-11 2025-02-07 美国陶氏有机硅公司 可固化有机硅组合物及其固化产物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643349A (en) * 1979-09-14 1981-04-22 Toray Silicone Co Ltd Flame retardant silicone rubber composition
ES2113955T3 (es) * 1992-04-21 1998-05-16 Kabi Pharmacia Ophthalmics Inc Composiciones de silicona con indice de refraccion elevado.
JPH09316335A (ja) * 1996-05-24 1997-12-09 Toray Dow Corning Silicone Co Ltd 液状シリコーンゴム組成物およびその製造方法
DE19631120A1 (de) * 1996-08-01 1998-02-05 Wacker Chemie Gmbh Additionsvernetzte Siliconelastomere mit verringertem Druckverformungsrest
JP3356391B2 (ja) * 1997-08-27 2002-12-16 東レ・ダウコーニング・シリコーン株式会社 電線被覆用難燃性シリコーンゴム組成物
JP3523098B2 (ja) * 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP4676671B2 (ja) * 2002-11-21 2011-04-27 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー組成物
JP3912523B2 (ja) * 2002-11-29 2007-05-09 信越化学工業株式会社 難燃性シリコーン組成物、及びシリコーンゴム硬化物又はシリコーンゲル硬化物の難燃性向上方法
JP4180474B2 (ja) 2003-09-03 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
JP2006182911A (ja) * 2004-12-27 2006-07-13 Dow Corning Toray Co Ltd 難燃性シリコーンゴム用組成物、難燃性シリコーンゴム組成物および難燃性シリコーンゴム
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5219367B2 (ja) * 2006-12-27 2013-06-26 東レ・ダウコーニング株式会社 付加硬化型シリコーンゴム組成物およびその成形体
CN101663372B (zh) * 2007-04-18 2014-05-28 三菱化学株式会社 荧光体及其制造方法、含荧光体组合物、发光装置、照明装置、图像显示装置以及含氮化合物
CA2691521C (en) * 2007-06-21 2015-10-13 Toyota Jidosha Kabushiki Kaisha Adhesive silicone rubber composition and separator seal material for fuel cells
JP5266696B2 (ja) * 2007-09-19 2013-08-21 東レ株式会社 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート
JP4915869B2 (ja) * 2007-10-17 2012-04-11 日東電工株式会社 光半導体装置の製造方法
CN101418123A (zh) * 2008-11-13 2009-04-29 浙江新安化工集团股份有限公司 双组分加成型硅橡胶的液体灌封组合物及制备

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Publication number Publication date
KR20150052847A (ko) 2015-05-14
WO2014038727A3 (en) 2014-05-01
JP2014051606A (ja) 2014-03-20
CN104583280A (zh) 2015-04-29
TW201412883A (zh) 2014-04-01
CN104583280B (zh) 2017-07-25
EP2892945B1 (en) 2017-02-01
US20150218417A1 (en) 2015-08-06
KR101901565B1 (ko) 2018-09-27
WO2014038727A2 (en) 2014-03-13
TWI640577B (zh) 2018-11-11
EP2892945A2 (en) 2015-07-15
US9464211B2 (en) 2016-10-11

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