CN104583280B - 固化性硅酮组合物和光学半导体器件 - Google Patents

固化性硅酮组合物和光学半导体器件 Download PDF

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Publication number
CN104583280B
CN104583280B CN201380044230.1A CN201380044230A CN104583280B CN 104583280 B CN104583280 B CN 104583280B CN 201380044230 A CN201380044230 A CN 201380044230A CN 104583280 B CN104583280 B CN 104583280B
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curable silicone
silicone composition
groups
triazole
optical semiconductor
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CN104583280A (zh
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宫本侑典
吉武诚
吉田宏明
中田稔树
平井和夫
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Duropco Materials Co ltd
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201380044230.1A 2012-09-07 2013-09-06 固化性硅酮组合物和光学半导体器件 Active CN104583280B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-197421 2012-09-07
JP2012197421A JP6059472B2 (ja) 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置
PCT/JP2013/074780 WO2014038727A2 (en) 2012-09-07 2013-09-06 Curable silicone composition and optical semiconductor device

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CN104583280A CN104583280A (zh) 2015-04-29
CN104583280B true CN104583280B (zh) 2017-07-25

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US (1) US9464211B2 (enExample)
EP (1) EP2892945B1 (enExample)
JP (1) JP6059472B2 (enExample)
KR (1) KR101901565B1 (enExample)
CN (1) CN104583280B (enExample)
TW (1) TWI640577B (enExample)
WO (1) WO2014038727A2 (enExample)

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TWI664077B (zh) 2014-04-09 2019-07-01 美商陶氏有機矽公司 疏水物件
JP6324206B2 (ja) * 2014-05-16 2018-05-16 アイカ工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP6628366B2 (ja) * 2014-05-30 2020-01-08 ダウ・東レ株式会社 有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
JP2016084419A (ja) * 2014-10-27 2016-05-19 信越化学工業株式会社 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ
JP6572634B2 (ja) * 2015-06-09 2019-09-11 信越化学工業株式会社 付加硬化性シリコーンゴム組成物及び硬化物
JP6704189B2 (ja) * 2015-08-03 2020-06-03 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
CN107841141A (zh) * 2016-09-21 2018-03-27 王志明 硬化性混合硅氧烷树脂组合物、其硬化物及其应用
US10844196B2 (en) 2016-10-26 2020-11-24 Shin-Etsu Chemical Co., Ltd. Thermally-conductive silicone composition
EP3562889A4 (en) * 2016-12-30 2020-12-09 Elkem Silicones Shanghai Co., Ltd. CURING SILICONE COMPOSITIONS
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物
WO2021213662A1 (en) * 2020-04-23 2021-10-28 Wacker Chemie Ag Optical bonding silicone with uv blocker for outdoor application
KR102987427B1 (ko) * 2020-07-13 2026-07-08 다우 도레이 캄파니 리미티드 실리콘 겔 조성물, 이의 경화물 및 이들의 용도
TWI861156B (zh) * 2020-07-15 2024-11-11 日商陶氏東麗股份有限公司 矽氧凝膠組成物、其硬化物、及該等之用途
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
JP2022042170A (ja) * 2020-09-02 2022-03-14 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱硬化性シリコーン組成物
CN116940637A (zh) * 2021-03-08 2023-10-24 杜邦东丽特殊材料株式会社 可固化硅酮组合物、封装剂以及光学半导体装置
JP2022178085A (ja) * 2021-05-19 2022-12-02 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP2024531081A (ja) * 2021-08-05 2024-08-29 ダウ シリコーンズ コーポレーション ヒドロシリル化硬化性ポリオルガノシロキサン組成物並びにその調製方法及び封止フィルムにおけるその使用
JP7643372B2 (ja) * 2022-02-17 2025-03-11 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
KR20250034136A (ko) * 2022-07-11 2025-03-10 다우 실리콘즈 코포레이션 경화성 실리콘 조성물 및 이의 경화물
EP4540320A4 (en) * 2022-07-11 2026-03-18 Dow Silicones Corp Composition of hardenable silicone and hardened product based thereon

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WO1993021245A1 (en) * 1992-04-21 1993-10-28 Kabi Pharmacia Ophthalmics, Inc. High refractive index silicone compositions
EP0899305A2 (en) * 1997-08-27 1999-03-03 Dow Corning Toray Silicone Company, Ltd. Flame-retardant silicone rubber composition for coating electrical wire and cable
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WO1993021245A1 (en) * 1992-04-21 1993-10-28 Kabi Pharmacia Ophthalmics, Inc. High refractive index silicone compositions
EP0899305A2 (en) * 1997-08-27 1999-03-03 Dow Corning Toray Silicone Company, Ltd. Flame-retardant silicone rubber composition for coating electrical wire and cable
CN101616996A (zh) * 2006-12-27 2009-12-30 道康宁东丽株式会社 可加成反应固化的硅橡胶组合物和由其制备的模塑制品
CN101679833A (zh) * 2007-06-21 2010-03-24 丰田自动车株式会社 粘性硅橡胶组合物和用于燃料电池的隔板密封材料
CN101418123A (zh) * 2008-11-13 2009-04-29 浙江新安化工集团股份有限公司 双组分加成型硅橡胶的液体灌封组合物及制备

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KR20150052847A (ko) 2015-05-14
TWI640577B (zh) 2018-11-11
EP2892945A2 (en) 2015-07-15
KR101901565B1 (ko) 2018-09-27
WO2014038727A3 (en) 2014-05-01
US9464211B2 (en) 2016-10-11
TW201412883A (zh) 2014-04-01
WO2014038727A2 (en) 2014-03-13
EP2892945B1 (en) 2017-02-01
US20150218417A1 (en) 2015-08-06
JP2014051606A (ja) 2014-03-20
CN104583280A (zh) 2015-04-29
JP6059472B2 (ja) 2017-01-11

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