KR101901565B1 - 경화성 실리콘 조성물 및 광반도체 장치 - Google Patents

경화성 실리콘 조성물 및 광반도체 장치 Download PDF

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KR101901565B1
KR101901565B1 KR1020157005777A KR20157005777A KR101901565B1 KR 101901565 B1 KR101901565 B1 KR 101901565B1 KR 1020157005777 A KR1020157005777 A KR 1020157005777A KR 20157005777 A KR20157005777 A KR 20157005777A KR 101901565 B1 KR101901565 B1 KR 101901565B1
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curable silicone
silicone composition
triazole
optical semiconductor
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KR20150052847A (ko
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유스케 미야모토
마코토 요시타케
히로아키 요시다
도시키 나카타
가즈오 히라이
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H01L23/24—
    • H01L23/296—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020157005777A 2012-09-07 2013-09-06 경화성 실리콘 조성물 및 광반도체 장치 Active KR101901565B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012197421A JP6059472B2 (ja) 2012-09-07 2012-09-07 硬化性シリコーン組成物および光半導体装置
JPJP-P-2012-197421 2012-09-07
PCT/JP2013/074780 WO2014038727A2 (en) 2012-09-07 2013-09-06 Curable silicone composition and optical semiconductor device

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Publication Number Publication Date
KR20150052847A KR20150052847A (ko) 2015-05-14
KR101901565B1 true KR101901565B1 (ko) 2018-09-27

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US (1) US9464211B2 (enExample)
EP (1) EP2892945B1 (enExample)
JP (1) JP6059472B2 (enExample)
KR (1) KR101901565B1 (enExample)
CN (1) CN104583280B (enExample)
TW (1) TWI640577B (enExample)
WO (1) WO2014038727A2 (enExample)

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CN106029556B (zh) 2014-04-09 2019-06-18 美国陶氏有机硅公司 疏水制品
JP6324206B2 (ja) * 2014-05-16 2018-05-16 アイカ工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
EP3153516A4 (en) * 2014-05-30 2018-03-07 Dow Corning Toray Co., Ltd. Organic silicon compound, curable silicone composition, and semiconductor device
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
JP2016084419A (ja) * 2014-10-27 2016-05-19 信越化学工業株式会社 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ
JP6572634B2 (ja) * 2015-06-09 2019-09-11 信越化学工業株式会社 付加硬化性シリコーンゴム組成物及び硬化物
JP6704189B2 (ja) * 2015-08-03 2020-06-03 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
CN107841141A (zh) * 2016-09-21 2018-03-27 王志明 硬化性混合硅氧烷树脂组合物、其硬化物及其应用
JP6614362B2 (ja) * 2016-10-26 2019-12-04 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2018121706A1 (en) * 2016-12-30 2018-07-05 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物
WO2021213662A1 (en) * 2020-04-23 2021-10-28 Wacker Chemie Ag Optical bonding silicone with uv blocker for outdoor application
WO2022013917A1 (ja) * 2020-07-13 2022-01-20 ダウ・東レ株式会社 シリコーンゲル組成物、その硬化物、およびそれらの用途
TWI861156B (zh) * 2020-07-15 2024-11-11 日商陶氏東麗股份有限公司 矽氧凝膠組成物、其硬化物、及該等之用途
JP2022042170A (ja) 2020-09-02 2022-03-14 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱硬化性シリコーン組成物
KR20230135676A (ko) * 2021-03-08 2023-09-25 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 봉지재 및 광반도체 장치
JP2022178085A (ja) * 2021-05-19 2022-12-02 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
CN117715986A (zh) * 2021-08-05 2024-03-15 美国陶氏有机硅公司 硅氢加成可固化聚有机硅氧烷组合物及其制备方法和其在封装膜中的用途
JP7643372B2 (ja) * 2022-02-17 2025-03-11 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
JP2025521513A (ja) * 2022-07-11 2025-07-10 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物及びその硬化物
CN119403883A (zh) * 2022-07-11 2025-02-07 美国陶氏有机硅公司 可固化有机硅组合物及其固化产物

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JP6059472B2 (ja) 2017-01-11
KR20150052847A (ko) 2015-05-14
WO2014038727A3 (en) 2014-05-01
JP2014051606A (ja) 2014-03-20
CN104583280A (zh) 2015-04-29
TW201412883A (zh) 2014-04-01
CN104583280B (zh) 2017-07-25
EP2892945B1 (en) 2017-02-01
US20150218417A1 (en) 2015-08-06
WO2014038727A2 (en) 2014-03-13
TWI640577B (zh) 2018-11-11
EP2892945A2 (en) 2015-07-15
US9464211B2 (en) 2016-10-11

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