JP5924852B2 - はんだ継手 - Google Patents
はんだ継手 Download PDFInfo
- Publication number
- JP5924852B2 JP5924852B2 JP2009538190A JP2009538190A JP5924852B2 JP 5924852 B2 JP5924852 B2 JP 5924852B2 JP 2009538190 A JP2009538190 A JP 2009538190A JP 2009538190 A JP2009538190 A JP 2009538190A JP 5924852 B2 JP5924852 B2 JP 5924852B2
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- JP
- Japan
- Prior art keywords
- mass
- solder
- solder joint
- intermetallic compound
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 title claims description 83
- 229910000765 intermetallic Inorganic materials 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 28
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 239000013078 crystal Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000007711 solidification Methods 0.000 claims description 10
- 230000008023 solidification Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 7
- 238000006467 substitution reaction Methods 0.000 claims description 4
- 239000010949 copper Substances 0.000 description 43
- 229910020888 Sn-Cu Inorganic materials 0.000 description 20
- 229910019204 Sn—Cu Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 16
- 238000005259 measurement Methods 0.000 description 14
- 230000009466 transformation Effects 0.000 description 13
- 239000007790 solid phase Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 6
- 238000010587 phase diagram Methods 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000000921 elemental analysis Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000009863 impact test Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000010583 slow cooling Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- -1 cost Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
さらに、発明者はCuの上限値として7質量%を設定した。これは、はんだ付けには融点が一つの重要な事項になるので、高温はんだとして一般的に約400℃前後まで温度を上昇させるため、Sn−Cu系において400℃でCu6Sn5を析出するCuの含有量に相当する量である。また、さらなるCuの上限値の限定として0.92質量%を設定したが、0.92質量%については、最近知られたところであるSn−Cu−Ni三元系の状態図におけるSn-Cuの共晶点を考慮した。
Cuの下限値については、発明者はさらに0.1質量%、及び0.2質量%を設定した。これは、Sn−Cu系の無鉛はんだ合金における接合強度などにおいてCuを添加する実質的な効果を考慮したものである。
金属間化合物層単位長さ当たりのクラック数=測定クラック数/金属間化合物長
金属間化合物層単位長さ当たりのクラック総長=測定クラック長総計/金属間化合物長
Claims (9)
- Cu0.01〜7.6質量%、Ni0.001〜6質量%、残部Snからなる合金を用いたはんだ継手の製造方法であって、はんだ付け直後から凝固が安定するまでの工程において2〜5℃/秒で冷却し、前記はんだ継手中の(Cu,Ni) 6 Sn 5 金属間化合物はCuとNiの組成比が5:1の置換率であると共に、9原子量%のNiを含む六方晶結晶構造の(Cu,Ni) 6 Sn 5 金属間化合物を得たはんだ継手の製造方法。
- Niの下限は、0.01質量%である請求項1記載のはんだ継手の製造方法。
- Niの下限は、0.03質量%である請求項1記載のはんだ継手の製造方法。
- Niの上限は、0.3質量%である請求項1〜3のいずれか記載のはんだ継手の製造方法。
- Niの上限は、0.1質量%である請求項1〜3のいずれか記載のはんだ継手の製造方法。
- Cuの下限は、0.1質量%である請求項1〜5のいずれか記載のはんだ継手の製造方法。
- Cuの下限は、0.2質量%である請求項1〜5のいずれか記載のはんだ継手の製造方法。
- Cuの上限は、7質量%である請求項1〜7のいずれか記載のはんだ継手の製造方法。
- Cuの上限は、0.92質量%である請求項1〜7のいずれか記載のはんだ継手の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007272810 | 2007-10-19 | ||
JP2007272810 | 2007-10-19 | ||
PCT/JP2008/068956 WO2009051255A1 (ja) | 2007-10-19 | 2008-10-20 | はんだ継手 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016003762A Division JP2016106033A (ja) | 2007-10-19 | 2016-01-12 | はんだ継手 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009051255A1 JPWO2009051255A1 (ja) | 2011-03-03 |
JP5924852B2 true JP5924852B2 (ja) | 2016-05-25 |
Family
ID=40567443
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009538190A Active JP5924852B2 (ja) | 2007-10-19 | 2008-10-20 | はんだ継手 |
JP2016003762A Pending JP2016106033A (ja) | 2007-10-19 | 2016-01-12 | はんだ継手 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016003762A Pending JP2016106033A (ja) | 2007-10-19 | 2016-01-12 | はんだ継手 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8999519B2 (ja) |
EP (1) | EP2218540B1 (ja) |
JP (2) | JP5924852B2 (ja) |
CN (1) | CN101896310B (ja) |
TW (1) | TWI457192B (ja) |
WO (2) | WO2009051181A1 (ja) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8013444B2 (en) * | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
US8493746B2 (en) * | 2009-02-12 | 2013-07-23 | International Business Machines Corporation | Additives for grain fragmentation in Pb-free Sn-based solder |
JP2011054892A (ja) * | 2009-09-04 | 2011-03-17 | Nihon Superior Co Ltd | 導電性ペーストを用いたはんだ接合 |
JP2012020331A (ja) * | 2010-07-16 | 2012-02-02 | Nihon Superior Co Ltd | 接合構造 |
JP5018978B1 (ja) | 2010-11-19 | 2012-09-05 | 株式会社村田製作所 | 導電性材料、それを用いた接続方法、および接続構造 |
TWI461252B (zh) * | 2010-12-24 | 2014-11-21 | Murata Manufacturing Co | A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component |
TWI436710B (zh) * | 2011-02-09 | 2014-05-01 | Murata Manufacturing Co | Connection structure |
JP2012182379A (ja) * | 2011-03-02 | 2012-09-20 | Murata Mfg Co Ltd | 多層チップ部品およびその製造方法 |
EP2722911B1 (en) * | 2011-06-17 | 2019-03-13 | LG Chem, Ltd. | Soldering connector, battery module having the same and battery pack comprising the battery module. |
WO2013002112A1 (ja) * | 2011-06-29 | 2013-01-03 | 株式会社日本スペリア社 | 信頼性が向上したはんだ接合部の製造方法 |
WO2014013632A1 (ja) | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
US9642275B2 (en) | 2012-12-25 | 2017-05-02 | Mitsubishi Materials Corporation | Power module |
KR102154369B1 (ko) * | 2012-12-25 | 2020-09-09 | 미쓰비시 마테리알 가부시키가이샤 | 파워 모듈 |
JP6247819B2 (ja) * | 2013-01-15 | 2017-12-13 | 株式会社日本スペリア社 | アルミニウム用はんだ及びはんだ継手 |
CN105189003A (zh) * | 2013-03-13 | 2015-12-23 | 日本斯倍利亚社股份有限公司 | 焊剂接合物及焊剂接合方法 |
CN104995731B (zh) | 2013-03-29 | 2019-11-26 | 三菱综合材料株式会社 | 功率模块 |
CN104395035B (zh) | 2013-05-29 | 2017-10-20 | 新日铁住金高新材料株式会社 | 钎料球以及电子构件 |
JPWO2015053114A1 (ja) * | 2013-10-10 | 2017-03-09 | 株式会社日本スペリア社 | 低融点ろう材 |
JP6172573B2 (ja) | 2013-11-29 | 2017-08-02 | 日立金属株式会社 | はんだ接合材料とその製造方法、及びはんだ接合用部材、並びに太陽電池モジュール |
CN103737193A (zh) * | 2013-12-23 | 2014-04-23 | 苏州宏泉高压电容器有限公司 | 一种铁镍锡焊接材料的制备方法 |
CN104923951A (zh) * | 2014-03-17 | 2015-09-23 | 广西民族大学 | 一种新型抗氧化无铅焊料 |
CN106573343B (zh) * | 2014-09-10 | 2020-11-13 | 株式会社村田制作所 | 金属间化合物的生成方法 |
CN105040106B (zh) * | 2015-06-10 | 2019-02-01 | 哈尔滨工业大学深圳研究生院 | 一种Cu6Sn5金属间化合物单晶种籽的制备方法 |
US20170095891A1 (en) * | 2015-10-01 | 2017-04-06 | Iowa State University Research Foundation, Inc. | Lead-free composite solder |
CN105397328A (zh) * | 2015-12-15 | 2016-03-16 | 瑞声光电科技(常州)有限公司 | Sn-Cu系无铅钎料及其制备方法 |
JP6659950B2 (ja) | 2016-01-15 | 2020-03-04 | 富士通株式会社 | 電子装置及び電子機器 |
DE112017000184T5 (de) * | 2016-06-16 | 2018-08-02 | Fuji Electric Co., Ltd. | Lotverbindung |
JP6621068B2 (ja) | 2016-12-08 | 2019-12-18 | パナソニックIpマネジメント株式会社 | 実装構造体 |
JP7041477B2 (ja) * | 2017-07-05 | 2022-03-24 | 新光電気工業株式会社 | 導電性ボール及び電子装置とそれらの製造方法 |
JP7014535B2 (ja) * | 2017-07-07 | 2022-02-01 | 新光電気工業株式会社 | 導電性ボール及び電子装置とそれらの製造方法 |
CN107538149B (zh) * | 2017-10-25 | 2019-09-24 | 郑州轻工业学院 | 一种Sn-Cu-Co-Ni无铅焊料及其制备方法 |
JP7291320B2 (ja) * | 2018-10-26 | 2023-06-15 | 株式会社日本スペリア社 | はんだ接合部の製造方法 |
TWI820277B (zh) * | 2018-12-27 | 2023-11-01 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
JP6799649B1 (ja) * | 2019-08-27 | 2020-12-16 | 有限会社 ナプラ | 金属粒子 |
JP6744972B1 (ja) | 2019-10-04 | 2020-08-19 | 有限会社 ナプラ | 接合構造部 |
JP6799701B1 (ja) * | 2020-03-12 | 2020-12-16 | 有限会社 ナプラ | 金属粒子 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2005014076A (ja) * | 2003-06-27 | 2005-01-20 | Toshiba Corp | 耐酸化性はんだ、耐酸化性はんだの製造方法およびはんだ付け方法 |
JP2005288544A (ja) * | 2004-03-09 | 2005-10-20 | Toshiba Corp | 無鉛はんだ、はんだ付け方法および電子部品 |
JP2006289434A (ja) * | 2005-04-11 | 2006-10-26 | Nihon Superior Co Ltd | はんだ合金 |
JP2008130697A (ja) * | 2006-11-17 | 2008-06-05 | Sharp Corp | はんだ接合構造、及びはんだ接合構造の製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4643875A (en) * | 1985-07-24 | 1987-02-17 | Gte Products Corporation | Tin based ductile brazing alloys |
US5127969A (en) * | 1990-03-22 | 1992-07-07 | University Of Cincinnati | Reinforced solder, brazing and welding compositions and methods for preparation thereof |
CA2214130C (en) | 1996-09-19 | 2003-12-02 | Northern Telecom Limited | Assemblies of substrates and electronic components |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP2000197988A (ja) * | 1998-03-26 | 2000-07-18 | Nihon Superior Co Ltd | 無鉛はんだ合金 |
JP3152945B2 (ja) * | 1998-03-26 | 2001-04-03 | 株式会社日本スペリア社 | 無鉛はんだ合金 |
JP3036636B1 (ja) * | 1999-02-08 | 2000-04-24 | 日本アルミット株式会社 | 無鉛半田合金 |
AU3193700A (en) * | 2000-03-17 | 2001-10-03 | Tokyo First Trading Company | Lead-free solder alloy |
JP4724650B2 (ja) * | 2000-04-17 | 2011-07-13 | 富士通株式会社 | はんだ接合方法およびはんだ接合部 |
WO2001078931A1 (fr) * | 2000-04-17 | 2001-10-25 | Fujitsu Limited | Assemblage par brasure |
WO2002068146A1 (fr) * | 2001-02-27 | 2002-09-06 | Sumida Corporation | Alliage de brasage sans plomb et composants electriques l'utilisant |
TW592872B (en) | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
JP4391276B2 (ja) * | 2004-03-12 | 2009-12-24 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
JP2005103645A (ja) * | 2004-10-29 | 2005-04-21 | Hitachi Metals Ltd | はんだボールおよびその製造方法 |
US20060263234A1 (en) * | 2005-05-11 | 2006-11-23 | American Iron & Metal Company, Inc. | Tin alloy solder compositions |
US20070062679A1 (en) * | 2005-06-30 | 2007-03-22 | Agee Keith D | Heat exchanger with modified diffuser surface |
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
US7233074B2 (en) * | 2005-08-11 | 2007-06-19 | Texas Instruments Incorporated | Semiconductor device with improved contacts |
JP4618089B2 (ja) * | 2005-10-12 | 2011-01-26 | 千住金属工業株式会社 | Sn−In系はんだ合金 |
JP2007196289A (ja) * | 2005-12-27 | 2007-08-09 | Toshiba Corp | 電子部品用無鉛金属材料 |
JP4979120B2 (ja) * | 2006-08-17 | 2012-07-18 | 日本アルミット株式会社 | 鉛フリー半田合金 |
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2008
- 2008-10-16 WO PCT/JP2008/068756 patent/WO2009051181A1/ja active Application Filing
- 2008-10-20 US US12/738,646 patent/US8999519B2/en active Active
- 2008-10-20 CN CN200880120553.3A patent/CN101896310B/zh active Active
- 2008-10-20 WO PCT/JP2008/068956 patent/WO2009051255A1/ja active Application Filing
- 2008-10-20 JP JP2009538190A patent/JP5924852B2/ja active Active
- 2008-10-20 EP EP08840759.8A patent/EP2218540B1/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2005014076A (ja) * | 2003-06-27 | 2005-01-20 | Toshiba Corp | 耐酸化性はんだ、耐酸化性はんだの製造方法およびはんだ付け方法 |
JP2005288544A (ja) * | 2004-03-09 | 2005-10-20 | Toshiba Corp | 無鉛はんだ、はんだ付け方法および電子部品 |
JP2006289434A (ja) * | 2005-04-11 | 2006-10-26 | Nihon Superior Co Ltd | はんだ合金 |
JP2008130697A (ja) * | 2006-11-17 | 2008-06-05 | Sharp Corp | はんだ接合構造、及びはんだ接合構造の製造方法 |
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JPWO2009051255A1 (ja) | 2011-03-03 |
US8999519B2 (en) | 2015-04-07 |
CN101896310B (zh) | 2014-03-05 |
EP2218540A4 (en) | 2013-02-20 |
JP2016106033A (ja) | 2016-06-16 |
US20100266870A1 (en) | 2010-10-21 |
TW201016374A (en) | 2010-05-01 |
EP2218540A1 (en) | 2010-08-18 |
WO2009051181A1 (ja) | 2009-04-23 |
EP2218540B1 (en) | 2017-12-13 |
CN101896310A (zh) | 2010-11-24 |
WO2009051255A1 (ja) | 2009-04-23 |
TWI457192B (zh) | 2014-10-21 |
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