WO2009051255A1 - はんだ継手 - Google Patents

はんだ継手 Download PDF

Info

Publication number
WO2009051255A1
WO2009051255A1 PCT/JP2008/068956 JP2008068956W WO2009051255A1 WO 2009051255 A1 WO2009051255 A1 WO 2009051255A1 JP 2008068956 W JP2008068956 W JP 2008068956W WO 2009051255 A1 WO2009051255 A1 WO 2009051255A1
Authority
WO
WIPO (PCT)
Prior art keywords
content
solder joint
solder
disclosed
joint
Prior art date
Application number
PCT/JP2008/068956
Other languages
English (en)
French (fr)
Inventor
Tetsuro Nishimura
Original Assignee
Nihon Superior Sha Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co., Ltd. filed Critical Nihon Superior Sha Co., Ltd.
Priority to US12/738,646 priority Critical patent/US8999519B2/en
Priority to JP2009538190A priority patent/JP5924852B2/ja
Priority to EP08840759.8A priority patent/EP2218540B1/en
Priority to CN200880120553.3A priority patent/CN101896310B/zh
Priority to TW097145347A priority patent/TWI457192B/zh
Publication of WO2009051255A1 publication Critical patent/WO2009051255A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

クラックの発生を抑制したはんだ継手を提供する。 Ｃｕ０．０１～７．６重量％、Ｎｉ０．００１～６重量％、残部Ｓｎからなるはんだ合金によって継手を製造した。ＣｕとＮｉの含有量はそれぞれ最大限の幅を持たせているが、Ｎｉの下限値として、０．０１重量％、さらに好ましくは０．０３重量％に特定した。Ｎｉの上限値としては、０．３重量％、さらに好ましくは０．１重量％に特定した。Ｃｕの下限値としては、０．１重量％、さらに好ましくは０．２重量％に特定した。Ｃｕの上限値としては、７重量％、さらに好ましくは０．９２重量％に特定した。発明には、この組成のはんだ継手を含む。
PCT/JP2008/068956 2007-10-19 2008-10-20 はんだ継手 WO2009051255A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/738,646 US8999519B2 (en) 2007-10-19 2008-10-20 Solder joint
JP2009538190A JP5924852B2 (ja) 2007-10-19 2008-10-20 はんだ継手
EP08840759.8A EP2218540B1 (en) 2007-10-19 2008-10-20 Solder joint
CN200880120553.3A CN101896310B (zh) 2007-10-19 2008-10-20 钎焊接头
TW097145347A TWI457192B (zh) 2007-10-19 2008-11-24 Solder connector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-272810 2007-10-19
JP2007272810 2007-10-19

Publications (1)

Publication Number Publication Date
WO2009051255A1 true WO2009051255A1 (ja) 2009-04-23

Family

ID=40567443

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/068756 WO2009051181A1 (ja) 2007-10-19 2008-10-16 無鉛はんだ合金
PCT/JP2008/068956 WO2009051255A1 (ja) 2007-10-19 2008-10-20 はんだ継手

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068756 WO2009051181A1 (ja) 2007-10-19 2008-10-16 無鉛はんだ合金

Country Status (6)

Country Link
US (1) US8999519B2 (ja)
EP (1) EP2218540B1 (ja)
JP (2) JP5924852B2 (ja)
CN (1) CN101896310B (ja)
TW (1) TWI457192B (ja)
WO (2) WO2009051181A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054892A (ja) * 2009-09-04 2011-03-17 Nihon Superior Co Ltd 導電性ペーストを用いたはんだ接合
WO2012108395A1 (ja) * 2011-02-09 2012-08-16 株式会社村田製作所 接続構造
JP2012182379A (ja) * 2011-03-02 2012-09-20 Murata Mfg Co Ltd 多層チップ部品およびその製造方法
JP2014136219A (ja) * 2013-01-15 2014-07-28 Nihon Superior Co Ltd アルミニウム用はんだ及びはんだ継手
JP2014523064A (ja) * 2011-06-17 2014-09-08 エルジー・ケム・リミテッド ソルダリングコネクター、これを含むバッテリーモジュール、及びバッテリーパック
JP2014209608A (ja) * 2013-03-29 2014-11-06 三菱マテリアル株式会社 パワーモジュール
WO2014192521A1 (ja) * 2013-05-29 2014-12-04 新日鉄住金マテリアルズ株式会社 半田ボールおよび電子部材
JPWO2013002112A1 (ja) * 2011-06-29 2015-02-23 株式会社日本スペリア社 信頼性が向上したはんだ接合部の製造方法
KR20150099754A (ko) * 2012-12-25 2015-09-01 미쓰비시 마테리알 가부시키가이샤 파워 모듈
US9642275B2 (en) 2012-12-25 2017-05-02 Mitsubishi Materials Corporation Power module
US9831210B2 (en) 2016-01-15 2017-11-28 Fujitsu Limited Electronic device and electronic apparatus
US10170442B2 (en) 2016-12-08 2019-01-01 Panasonic Intellectual Property Management Co., Ltd. Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer
JP2020066041A (ja) * 2018-10-26 2020-04-30 株式会社日本スペリア社 はんだ接合部の製造方法
US10906136B1 (en) 2019-10-04 2021-02-02 Napra Co., Ltd. Joint structure
JP2022515254A (ja) * 2018-12-27 2022-02-17 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 鉛フリーはんだ組成物

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US8013444B2 (en) * 2008-12-24 2011-09-06 Intel Corporation Solder joints with enhanced electromigration resistance
US8493746B2 (en) * 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
JP2012020331A (ja) * 2010-07-16 2012-02-02 Nihon Superior Co Ltd 接合構造
WO2012066795A1 (ja) * 2010-11-19 2012-05-24 株式会社村田製作所 導電性材料、それを用いた接続方法、および接続構造
TWI461252B (zh) 2010-12-24 2014-11-21 Murata Manufacturing Co A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
WO2014013632A1 (ja) 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US10329642B2 (en) * 2013-03-13 2019-06-25 Nihon Superior Co., Ltd. Solder alloy and joint thereof
WO2015053114A1 (ja) * 2013-10-10 2015-04-16 株式会社日本スペリア社 低融点ろう材
JP6172573B2 (ja) 2013-11-29 2017-08-02 日立金属株式会社 はんだ接合材料とその製造方法、及びはんだ接合用部材、並びに太陽電池モジュール
CN103737193A (zh) * 2013-12-23 2014-04-23 苏州宏泉高压电容器有限公司 一种铁镍锡焊接材料的制备方法
CN104923951A (zh) * 2014-03-17 2015-09-23 广西民族大学 一种新型抗氧化无铅焊料
JP6288284B2 (ja) * 2014-09-10 2018-03-07 株式会社村田製作所 金属間化合物の生成方法
CN105040106B (zh) * 2015-06-10 2019-02-01 哈尔滨工业大学深圳研究生院 一种Cu6Sn5金属间化合物单晶种籽的制备方法
US20170095891A1 (en) * 2015-10-01 2017-04-06 Iowa State University Research Foundation, Inc. Lead-free composite solder
CN105397328A (zh) * 2015-12-15 2016-03-16 瑞声光电科技(常州)有限公司 Sn-Cu系无铅钎料及其制备方法
CN108290250B (zh) * 2016-06-16 2020-07-07 富士电机株式会社 软钎焊接合部
JP7041477B2 (ja) * 2017-07-05 2022-03-24 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法
JP7014535B2 (ja) * 2017-07-07 2022-02-01 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法
CN107538149B (zh) * 2017-10-25 2019-09-24 郑州轻工业学院 一种Sn-Cu-Co-Ni无铅焊料及其制备方法
JP6799649B1 (ja) * 2019-08-27 2020-12-16 有限会社 ナプラ 金属粒子
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

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JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
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Publication number Priority date Publication date Assignee Title
JPH10107420A (ja) 1996-09-19 1998-04-24 Northern Telecom Ltd 基板と電子部品との組立体および半田付け方法
WO1999048639A1 (fr) 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2007175776A (ja) * 2000-04-17 2007-07-12 Fujitsu Ltd はんだ接合方法およびはんだ接合部
JP2007260779A (ja) * 2001-06-28 2007-10-11 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP2005014076A (ja) * 2003-06-27 2005-01-20 Toshiba Corp 耐酸化性はんだ、耐酸化性はんだの製造方法およびはんだ付け方法
JP2005254298A (ja) * 2004-03-12 2005-09-22 Nippon Steel Corp 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
JP2005103645A (ja) * 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
WO2007010927A1 (ja) * 2005-07-19 2007-01-25 Nihon Superior Sha Co., Ltd. 追加供給用鉛フリーはんだ及びはんだ浴中のＣｕ濃度及びＮｉ濃度調整方法
JP2007105750A (ja) * 2005-10-12 2007-04-26 Senju Metal Ind Co Ltd Ｓｎ−Ｉｎ系はんだ合金
JP2007196289A (ja) * 2005-12-27 2007-08-09 Toshiba Corp 電子部品用無鉛金属材料
JP2008043978A (ja) * 2006-08-17 2008-02-28 Nihon Almit Co Ltd 鉛フリー半田合金

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054892A (ja) * 2009-09-04 2011-03-17 Nihon Superior Co Ltd 導電性ペーストを用いたはんだ接合
WO2012108395A1 (ja) * 2011-02-09 2012-08-16 株式会社村田製作所 接続構造
JP5626373B2 (ja) * 2011-02-09 2014-11-19 株式会社村田製作所 接続構造
US9105987B2 (en) 2011-02-09 2015-08-11 Murata Manufacturing Co., Ltd. Connection structure
JP2012182379A (ja) * 2011-03-02 2012-09-20 Murata Mfg Co Ltd 多層チップ部品およびその製造方法
JP2014523064A (ja) * 2011-06-17 2014-09-08 エルジー・ケム・リミテッド ソルダリングコネクター、これを含むバッテリーモジュール、及びバッテリーパック
JPWO2013002112A1 (ja) * 2011-06-29 2015-02-23 株式会社日本スペリア社 信頼性が向上したはんだ接合部の製造方法
US9426915B2 (en) 2012-12-25 2016-08-23 Mitsubishi Materials Corporation Power module
KR102154369B1 (ko) 2012-12-25 2020-09-09 미쓰비시 마테리알 가부시키가이샤 파워 모듈
KR20150099754A (ko) * 2012-12-25 2015-09-01 미쓰비시 마테리알 가부시키가이샤 파워 모듈
US9642275B2 (en) 2012-12-25 2017-05-02 Mitsubishi Materials Corporation Power module
JP2014136219A (ja) * 2013-01-15 2014-07-28 Nihon Superior Co Ltd アルミニウム用はんだ及びはんだ継手
JP2014209608A (ja) * 2013-03-29 2014-11-06 三菱マテリアル株式会社 パワーモジュール
US9953944B2 (en) 2013-03-29 2018-04-24 Mitsubishi Materials Corporation Power module
US9320152B2 (en) 2013-05-29 2016-04-19 Nippon Steel & Sumikin Materials Co., Ltd. Solder ball and electronic member
WO2014192521A1 (ja) * 2013-05-29 2014-12-04 新日鉄住金マテリアルズ株式会社 半田ボールおよび電子部材
US9831210B2 (en) 2016-01-15 2017-11-28 Fujitsu Limited Electronic device and electronic apparatus
US10170442B2 (en) 2016-12-08 2019-01-01 Panasonic Intellectual Property Management Co., Ltd. Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer
JP2020066041A (ja) * 2018-10-26 2020-04-30 株式会社日本スペリア社 はんだ接合部の製造方法
JP7291320B2 (ja) 2018-10-26 2023-06-15 株式会社日本スペリア社 はんだ接合部の製造方法
JP2022515254A (ja) * 2018-12-27 2022-02-17 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 鉛フリーはんだ組成物
US10906136B1 (en) 2019-10-04 2021-02-02 Napra Co., Ltd. Joint structure
JP2021058900A (ja) * 2019-10-04 2021-04-15 有限会社 ナプラ 接合構造部

Also Published As

Publication number Publication date
JPWO2009051255A1 (ja) 2011-03-03
EP2218540B1 (en) 2017-12-13
US20100266870A1 (en) 2010-10-21
CN101896310A (zh) 2010-11-24
JP2016106033A (ja) 2016-06-16
JP5924852B2 (ja) 2016-05-25
EP2218540A4 (en) 2013-02-20
WO2009051181A1 (ja) 2009-04-23
US8999519B2 (en) 2015-04-07
CN101896310B (zh) 2014-03-05
TWI457192B (zh) 2014-10-21
EP2218540A1 (en) 2010-08-18
TW201016374A (en) 2010-05-01

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