WO2009051240A1 - 鉛フリーはんだ - Google Patents
鉛フリーはんだ Download PDFInfo
- Publication number
- WO2009051240A1 WO2009051240A1 PCT/JP2008/068895 JP2008068895W WO2009051240A1 WO 2009051240 A1 WO2009051240 A1 WO 2009051240A1 JP 2008068895 W JP2008068895 W JP 2008068895W WO 2009051240 A1 WO2009051240 A1 WO 2009051240A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- soft solder
- lead
- free soft
- strength
- reliability
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
鉛フリーはんだとして、Sn-3Ag-0.5Cu組成のはんだが、有力視されているが、斯かる組成のはんだは、高温環境に曝されるとAg3Sn粒子の粗大化が起こるので、強度信頼性に課題がある。 本発明の鉛フリーはんだは、Ag含有量の低減により強度信頼性の向上を図り、且つ、Ag含有量の低減による強度低下をZnの添加によって補償したものであり、Ag0.01から1.5質量%と、Cu0.01から1.0質量%と、Zn0.1から1.0質量%と、残部がSnからなる鉛フリーはんだである。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009538176A JPWO2009051240A1 (ja) | 2007-10-17 | 2008-10-17 | 鉛フリーはんだ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007270570 | 2007-10-17 | ||
JP2007-270570 | 2007-10-17 | ||
JP2008-243037 | 2008-09-22 | ||
JP2008243037 | 2008-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009051240A1 true WO2009051240A1 (ja) | 2009-04-23 |
Family
ID=40567501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068895 WO2009051240A1 (ja) | 2007-10-17 | 2008-10-17 | 鉛フリーはんだ |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2009051240A1 (ja) |
TW (1) | TW200927357A (ja) |
WO (1) | WO2009051240A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101780607A (zh) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
WO2012023440A1 (ja) * | 2010-08-18 | 2012-02-23 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102806429A (zh) * | 2011-05-30 | 2012-12-05 | 日立电线株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
CN104070299A (zh) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | 一种抗老化光伏焊带之焊锡料 |
KR20150050440A (ko) | 2013-10-30 | 2015-05-08 | 가부시키가이샤 다무라 세이사쿠쇼 | 솔더 페이스트용 플럭스 및 솔더 페이스트 |
US9520347B2 (en) | 2013-05-03 | 2016-12-13 | Honeywell International Inc. | Lead frame construct for lead-free solder connections |
CN106624430A (zh) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | 焊锡膏 |
US10046417B2 (en) | 2011-08-17 | 2018-08-14 | Honeywell International Inc. | Lead-free solder compositions |
CN113399859A (zh) * | 2021-05-27 | 2021-09-17 | 西安理工大学 | 一种Sn-Zn-Cu系无铅钎料及其制备方法 |
CN115383344A (zh) * | 2022-06-06 | 2022-11-25 | 桂林航天工业学院 | In-48Sn-xCuZnAl复合钎料及其制备方法与应用 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014057261A1 (en) * | 2012-10-09 | 2014-04-17 | Alpha Metals, Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
CN106181109B (zh) * | 2016-08-16 | 2018-12-28 | 镇江市锶达合金材料有限公司 | 一种高性能绿色钎焊材料 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002239780A (ja) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2003094195A (ja) * | 2001-06-28 | 2003-04-02 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
JP2005254298A (ja) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
WO2006011204A1 (ja) * | 2004-07-29 | 2006-02-02 | Senju Metal Industry Co., Ltd | 鉛フリーはんだ合金 |
JP2006289493A (ja) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn−Zn系はんだ、鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板 |
-
2008
- 2008-10-16 TW TW097139693A patent/TW200927357A/zh unknown
- 2008-10-17 WO PCT/JP2008/068895 patent/WO2009051240A1/ja active Application Filing
- 2008-10-17 JP JP2009538176A patent/JPWO2009051240A1/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002239780A (ja) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2003094195A (ja) * | 2001-06-28 | 2003-04-02 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
JP2005254298A (ja) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
WO2006011204A1 (ja) * | 2004-07-29 | 2006-02-02 | Senju Metal Industry Co., Ltd | 鉛フリーはんだ合金 |
JP2006289493A (ja) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn−Zn系はんだ、鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101780607A (zh) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
WO2012023440A1 (ja) * | 2010-08-18 | 2012-02-23 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102666002A (zh) * | 2010-08-18 | 2012-09-12 | 新日铁高新材料株式会社 | 半导体安装用钎料球和电子部件 |
KR101355694B1 (ko) * | 2010-08-18 | 2014-01-28 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 실장용 땜납 볼 및 전자 부재 |
JP5413926B2 (ja) * | 2010-08-18 | 2014-02-12 | 新日鉄住金マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102666002B (zh) * | 2010-08-18 | 2014-09-10 | 新日铁住金高新材料株式会社 | 半导体安装用钎料球和电子部件 |
US9024442B2 (en) | 2010-08-18 | 2015-05-05 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball for semiconductor packaging and electronic member using the same |
CN102806429A (zh) * | 2011-05-30 | 2012-12-05 | 日立电线株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
JP2012245554A (ja) * | 2011-05-30 | 2012-12-13 | Hitachi Cable Ltd | Pbフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 |
CN102806429B (zh) * | 2011-05-30 | 2016-01-20 | 日立金属株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
US10046417B2 (en) | 2011-08-17 | 2018-08-14 | Honeywell International Inc. | Lead-free solder compositions |
US10661393B2 (en) | 2011-08-17 | 2020-05-26 | Honeywell International Inc. | Lead-free solder compositions |
CN104070299A (zh) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | 一种抗老化光伏焊带之焊锡料 |
US9520347B2 (en) | 2013-05-03 | 2016-12-13 | Honeywell International Inc. | Lead frame construct for lead-free solder connections |
KR20150050440A (ko) | 2013-10-30 | 2015-05-08 | 가부시키가이샤 다무라 세이사쿠쇼 | 솔더 페이스트용 플럭스 및 솔더 페이스트 |
CN106624430A (zh) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | 焊锡膏 |
CN113399859A (zh) * | 2021-05-27 | 2021-09-17 | 西安理工大学 | 一种Sn-Zn-Cu系无铅钎料及其制备方法 |
CN115383344A (zh) * | 2022-06-06 | 2022-11-25 | 桂林航天工业学院 | In-48Sn-xCuZnAl复合钎料及其制备方法与应用 |
CN115383344B (zh) * | 2022-06-06 | 2024-02-06 | 桂林航天工业学院 | In-48Sn-xCuZnAl复合钎料及其制备方法与应用 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009051240A1 (ja) | 2011-03-03 |
TW200927357A (en) | 2009-07-01 |
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