JP5916334B2 - 異方性導電接着剤及びその製造方法、発光装置及びその製造方法 - Google Patents

異方性導電接着剤及びその製造方法、発光装置及びその製造方法 Download PDF

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Publication number
JP5916334B2
JP5916334B2 JP2011222498A JP2011222498A JP5916334B2 JP 5916334 B2 JP5916334 B2 JP 5916334B2 JP 2011222498 A JP2011222498 A JP 2011222498A JP 2011222498 A JP2011222498 A JP 2011222498A JP 5916334 B2 JP5916334 B2 JP 5916334B2
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Japan
Prior art keywords
light
anisotropic conductive
conductive adhesive
light emitting
emitting element
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Active
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JP2011222498A
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English (en)
Japanese (ja)
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JP2013082784A (ja
JP2013082784A5 (enExample
Inventor
明 石神
明 石神
士行 蟹澤
士行 蟹澤
秀次 波木
秀次 波木
英明 馬越
英明 馬越
青木　正治
正治 青木
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Dexerials Corp
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Dexerials Corp
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Priority to JP2011222498A priority Critical patent/JP5916334B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2012/076011 priority patent/WO2013051708A1/ja
Priority to KR1020147011209A priority patent/KR102010103B1/ko
Priority to TW101136830A priority patent/TWI559334B/zh
Priority to CN201280060251.8A priority patent/CN104039914B/zh
Priority to EP12838614.1A priority patent/EP2765173A4/en
Publication of JP2013082784A publication Critical patent/JP2013082784A/ja
Priority to US14/246,618 priority patent/US20140217450A1/en
Publication of JP2013082784A5 publication Critical patent/JP2013082784A5/ja
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Publication of JP5916334B2 publication Critical patent/JP5916334B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2011222498A 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法 Active JP5916334B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
KR1020147011209A KR102010103B1 (ko) 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법
TW101136830A TWI559334B (zh) 2011-10-07 2012-10-05 異向性導電接著劑及其製造方法、發光裝置及其製造方法
CN201280060251.8A CN104039914B (zh) 2011-10-07 2012-10-05 各向异性导电粘接剂及其制造方法、发光装置及其制造方法
PCT/JP2012/076011 WO2013051708A1 (ja) 2011-10-07 2012-10-05 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
EP12838614.1A EP2765173A4 (en) 2011-10-07 2012-10-05 ANISOTROPER CONDUCTIVE ADHESIVE AND PRODUCTION PROCESS THEREFOR AND LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF
US14/246,618 US20140217450A1 (en) 2011-10-07 2014-04-07 Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013082784A JP2013082784A (ja) 2013-05-09
JP2013082784A5 JP2013082784A5 (enExample) 2014-11-20
JP5916334B2 true JP5916334B2 (ja) 2016-05-11

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Country Status (7)

Country Link
US (1) US20140217450A1 (enExample)
EP (1) EP2765173A4 (enExample)
JP (1) JP5916334B2 (enExample)
KR (1) KR102010103B1 (enExample)
CN (1) CN104039914B (enExample)
TW (1) TWI559334B (enExample)
WO (1) WO2013051708A1 (enExample)

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US9269681B2 (en) * 2012-11-16 2016-02-23 Qualcomm Incorporated Surface finish on trace for a thermal compression flip chip (TCFC)
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WO2015046326A1 (ja) * 2013-09-26 2015-04-02 デクセリアルズ株式会社 発光装置、異方性導電接着剤、発光装置製造方法
TWI707484B (zh) * 2013-11-14 2020-10-11 晶元光電股份有限公司 發光裝置
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JP7348478B2 (ja) * 2018-07-09 2023-09-21 日亜化学工業株式会社 発光装置及びその製造方法
TWI671921B (zh) * 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片
JP7366337B2 (ja) * 2018-12-25 2023-10-23 日亜化学工業株式会社 光源装置の製造方法および光源装置
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TWI690102B (zh) * 2019-01-04 2020-04-01 友達光電股份有限公司 發光裝置及其製造方法
JP7292669B2 (ja) * 2019-04-11 2023-06-19 株式会社レゾナック 導電粒子の製造方法
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Publication number Publication date
JP2013082784A (ja) 2013-05-09
WO2013051708A1 (ja) 2013-04-11
KR102010103B1 (ko) 2019-08-12
US20140217450A1 (en) 2014-08-07
KR20140084076A (ko) 2014-07-04
CN104039914B (zh) 2016-08-24
CN104039914A (zh) 2014-09-10
TW201331955A (zh) 2013-08-01
TWI559334B (zh) 2016-11-21
EP2765173A4 (en) 2015-04-29
EP2765173A1 (en) 2014-08-13

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