JP5873323B2 - 半導体デバイスパッケージを製作するための方法 - Google Patents

半導体デバイスパッケージを製作するための方法 Download PDF

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Publication number
JP5873323B2
JP5873323B2 JP2011277812A JP2011277812A JP5873323B2 JP 5873323 B2 JP5873323 B2 JP 5873323B2 JP 2011277812 A JP2011277812 A JP 2011277812A JP 2011277812 A JP2011277812 A JP 2011277812A JP 5873323 B2 JP5873323 B2 JP 5873323B2
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Prior art keywords
metal layer
patterned
layer
vias
interconnect
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JP2011277812A
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Japanese (ja)
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JP2012134500A5 (enExample
JP2012134500A (ja
Inventor
ポール・アラン・マックコネリー
アルン・ヴィルパクシャ・ゴウダ
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General Electric Co
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General Electric Co
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    • H10W70/093—
    • H10W70/095—
    • H10W90/00—
    • H10W70/60—
    • H10W72/01333—
    • H10W72/01336—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07338—
    • H10W72/354—
    • H10W72/853—
    • H10W72/874—
    • H10W72/926—
    • H10W72/9413—
    • H10W72/944—
    • H10W74/142—
    • H10W90/734—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2011277812A 2010-12-22 2011-12-20 半導体デバイスパッケージを製作するための方法 Expired - Fee Related JP5873323B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/975,466 US8114712B1 (en) 2010-12-22 2010-12-22 Method for fabricating a semiconductor device package
US12/975,466 2010-12-22

Publications (3)

Publication Number Publication Date
JP2012134500A JP2012134500A (ja) 2012-07-12
JP2012134500A5 JP2012134500A5 (enExample) 2015-02-12
JP5873323B2 true JP5873323B2 (ja) 2016-03-01

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JP2011277812A Expired - Fee Related JP5873323B2 (ja) 2010-12-22 2011-12-20 半導体デバイスパッケージを製作するための方法

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US (2) US8114712B1 (enExample)
EP (1) EP2469591B1 (enExample)
JP (1) JP5873323B2 (enExample)
CN (1) CN102593046B (enExample)
BR (1) BRPI1105202A2 (enExample)
CA (1) CA2762470C (enExample)

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JP2017126688A (ja) * 2016-01-15 2017-07-20 株式会社ジェイデバイス 半導体パッケージの製造方法及び半導体パッケージ
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Also Published As

Publication number Publication date
CA2762470A1 (en) 2012-06-22
US8114712B1 (en) 2012-02-14
US20120161325A1 (en) 2012-06-28
CN102593046A (zh) 2012-07-18
EP2469591A3 (en) 2018-01-31
CN102593046B (zh) 2015-08-26
US8334593B2 (en) 2012-12-18
JP2012134500A (ja) 2012-07-12
EP2469591B1 (en) 2021-01-27
EP2469591A2 (en) 2012-06-27
BRPI1105202A2 (pt) 2013-04-09
CA2762470C (en) 2019-01-15

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