BRPI1105202A2 - mÉtodo de fabricaÇço de um pacote de disposito semicondutor e pacote de dispositivo semicondutor - Google Patents

mÉtodo de fabricaÇço de um pacote de disposito semicondutor e pacote de dispositivo semicondutor Download PDF

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Publication number
BRPI1105202A2
BRPI1105202A2 BRPI1105202-3A BRPI1105202A BRPI1105202A2 BR PI1105202 A2 BRPI1105202 A2 BR PI1105202A2 BR PI1105202 A BRPI1105202 A BR PI1105202A BR PI1105202 A2 BRPI1105202 A2 BR PI1105202A2
Authority
BR
Brazil
Prior art keywords
layer
metal layer
pathways
interconnect
semiconductor device
Prior art date
Application number
BRPI1105202-3A
Other languages
English (en)
Portuguese (pt)
Inventor
Alan Mcconnelee Paul
Virupaksha Gowda Arun
Original Assignee
General Electric Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company filed Critical General Electric Company
Publication of BRPI1105202A2 publication Critical patent/BRPI1105202A2/pt

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Classifications

    • H10W70/093—
    • H10W70/095—
    • H10W90/00—
    • H10W70/60—
    • H10W72/01333—
    • H10W72/01336—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07338—
    • H10W72/354—
    • H10W72/853—
    • H10W72/874—
    • H10W72/926—
    • H10W72/9413—
    • H10W72/944—
    • H10W74/142—
    • H10W90/734—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
BRPI1105202-3A 2010-12-22 2011-12-21 mÉtodo de fabricaÇço de um pacote de disposito semicondutor e pacote de dispositivo semicondutor BRPI1105202A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/975,466 US8114712B1 (en) 2010-12-22 2010-12-22 Method for fabricating a semiconductor device package
US12/975,466 2010-12-22

Publications (1)

Publication Number Publication Date
BRPI1105202A2 true BRPI1105202A2 (pt) 2013-04-09

Family

ID=45218549

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1105202-3A BRPI1105202A2 (pt) 2010-12-22 2011-12-21 mÉtodo de fabricaÇço de um pacote de disposito semicondutor e pacote de dispositivo semicondutor

Country Status (6)

Country Link
US (2) US8114712B1 (enExample)
EP (1) EP2469591B1 (enExample)
JP (1) JP5873323B2 (enExample)
CN (1) CN102593046B (enExample)
BR (1) BRPI1105202A2 (enExample)
CA (1) CA2762470C (enExample)

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Also Published As

Publication number Publication date
CA2762470A1 (en) 2012-06-22
US8114712B1 (en) 2012-02-14
US20120161325A1 (en) 2012-06-28
CN102593046A (zh) 2012-07-18
EP2469591A3 (en) 2018-01-31
CN102593046B (zh) 2015-08-26
US8334593B2 (en) 2012-12-18
JP2012134500A (ja) 2012-07-12
JP5873323B2 (ja) 2016-03-01
EP2469591B1 (en) 2021-01-27
EP2469591A2 (en) 2012-06-27
CA2762470C (en) 2019-01-15

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B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time