JP5855605B2 - 積層セラミック部品 - Google Patents
積層セラミック部品 Download PDFInfo
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- JP5855605B2 JP5855605B2 JP2013111746A JP2013111746A JP5855605B2 JP 5855605 B2 JP5855605 B2 JP 5855605B2 JP 2013111746 A JP2013111746 A JP 2013111746A JP 2013111746 A JP2013111746 A JP 2013111746A JP 5855605 B2 JP5855605 B2 JP 5855605B2
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- 239000000919 ceramic Substances 0.000 title claims description 40
- 239000000463 material Substances 0.000 claims description 96
- 239000002245 particle Substances 0.000 claims description 75
- 239000010419 fine particle Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 239000000843 powder Substances 0.000 claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 11
- 229910002113 barium titanate Inorganic materials 0.000 claims description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052765 Lutetium Inorganic materials 0.000 claims description 5
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical group [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 238000005245 sintering Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3227—Lanthanum oxide or oxide-forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
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- C04B2235/75—Products with a concentration gradient
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
- C04B2235/781—Nanograined materials, i.e. having grain sizes below 100 nm
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
- C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
Description
前記内部電極層は金属粉末の重量に対して6〜8重量%の共材を含み、
前記共材の平均粒径は前記誘電体層に含まれる誘電体母材の平均粒径に対して35〜40%の大きさを有し、
前記誘電体層は、複数の誘電体微粒子で構成された3〜7層の層状構造を有し、
前記誘電体微粒子は、空の空間がない緻密な形態の前記層状構造を形成して、
前記層状構造を有する誘電体微粒子において、前記内部電極層と隣接する界面に位置した前記誘電体微粒子の平均粒径D(interface)は内部電極層と隣接せず誘電体微粒子同士が隣接する誘電体層の内部に位置した前記誘電体微粒子の平均粒径D(inner)より小さく、前記D(interface)/D(inner)は0.711〜0.739を満たすことを特徴とする。
本発明の第1形態による積層セラミック部品は、内部電極層と誘電体層が交互に積層された構造を有し、前記内部電極層は金属粉末の重量に対して0.01〜12重量%の共材を含み、前記共材の平均粒径は前記誘電体層に含まれる誘電体母材の平均粒径に対して30〜50%の大きさを有することを特徴とする。
表1のように各組成、粒径及び含量を変化させながら、積層型電子部品(MLCC)を製造した。内部電極層の金属粉末はニッケル金属を使用し、共材はチタン酸バリウムを主成分とし、金属酸化物を副成分として含み、超高容量MLCC(誘電体厚さ0.6μm以下、内部電極0.6μm)を製造した。また、前記製造された超高容量MLCCの容量及び信頼性をBDV(breakdown voltage)の加速寿命で測定し、その結果を以下の表1に示す。
110a、110b、110 誘電体層
122 金属粉末(Ni)
121 共材
111 誘電体微粒子
D(inner) 誘電体層の内部に位置して誘電体微粒子同士が隣接する誘電体微粒子
D(interface) 誘電体層と内部電極層の界面に位置する誘電体微粒子
Claims (8)
- 内部電極層と誘電体層が交互に積層された構造を有し、
前記内部電極層は金属粉末の重量に対して6〜8重量%の共材を含み、
前記共材の平均粒径は前記誘電体層に含まれる誘電体母材の平均粒径に対して35〜40%の大きさを有し、
前記誘電体層は、複数の誘電体微粒子で構成された3〜7層の層状構造を有し、
前記誘電体微粒子は、空の空間がない緻密な形態の前記層状構造を形成して、
前記層状構造を有する誘電体微粒子において、前記内部電極層と隣接する界面に位置した前記誘電体微粒子の平均粒径D(interface)は内部電極層と隣接せず誘電体微粒子同士が隣接する誘電体層の内部に位置した前記誘電体微粒子の平均粒径D(inner)より小さく、前記D(interface)/D(inner)は0.711〜0.739を満たす、積層セラミック部品。 - 前記誘電体層の厚さは0.6μm以下である請求項1に記載の積層セラミック部品。
- 前記誘電体微粒子の平均粒径は0.15μm以下である請求項1に記載の積層セラミック部品。
- 前記内部電極層は0.6μm以下の厚さを有する請求項1に記載の積層セラミック部品。
- 前記内部電極層はニッケル(Ni)または銅(Cu)からなる請求項1に記載の積層セラミック部品。
- 前記共材はチタン酸バリウム(BaTiO3)と金属酸化物を含む請求項1に記載の積層セラミック部品。
- 前記金属酸化物の金属はY3+、La3+、Ce3+、Pr3+、Nd3+、Sm3+、Eu3+、Gd3+、Tb3+、Dy3+、Ho3+、Er3+、Tm3+、Yb3+、及びLu3+からなる群から選択される1種以上のランタン族希土類元素である請求項6に記載の積層セラミック部品。
- 前記誘電体微粒子は球形以外の他の形状で互いに隣接している請求項1に記載の積層セラミック部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020120060430A KR101548787B1 (ko) | 2012-06-05 | 2012-06-05 | 적층 세라믹 부품 |
KR10-2012-0060430 | 2012-06-05 |
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JP2013254954A JP2013254954A (ja) | 2013-12-19 |
JP5855605B2 true JP5855605B2 (ja) | 2016-02-09 |
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US (1) | US9183987B2 (ja) |
JP (1) | JP5855605B2 (ja) |
KR (1) | KR101548787B1 (ja) |
CN (1) | CN103474237B (ja) |
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JP6281502B2 (ja) * | 2014-06-12 | 2018-02-21 | 株式会社村田製作所 | 積層セラミックコンデンサ |
KR102183425B1 (ko) | 2015-07-22 | 2020-11-27 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
CN110171971A (zh) * | 2019-06-24 | 2019-08-27 | 深圳市森世泰科技有限公司 | 陶瓷粘合浆料及多层陶瓷及其制作方法及电子器件 |
JP2021077828A (ja) * | 2019-11-13 | 2021-05-20 | 株式会社村田製作所 | 積層セラミックコンデンサ |
US11776744B2 (en) * | 2020-05-19 | 2023-10-03 | Samhwa Capacitor Co., Ltd. | Multilayer ceramic capacitor and manufacturing method thereof |
KR20230068721A (ko) * | 2021-11-11 | 2023-05-18 | 삼성전기주식회사 | 커패시터 부품 및 커패시터 부품의 제조 방법 |
KR20230078084A (ko) * | 2021-11-26 | 2023-06-02 | 삼성전기주식회사 | 적층 세라믹 캐패시터 |
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JPH0423309A (ja) * | 1990-05-14 | 1992-01-27 | Hitachi Aic Inc | 積層セラミックコンデンサ |
JP2001015375A (ja) | 1999-06-30 | 2001-01-19 | Kyocera Corp | 積層セラミックコンデンサの製造方法 |
JP3793697B2 (ja) * | 2000-02-03 | 2006-07-05 | 太陽誘電株式会社 | 積層セラミックコンデンサ及びその製造方法 |
JP4557472B2 (ja) * | 2001-08-29 | 2010-10-06 | 京セラ株式会社 | 積層セラミックコンデンサ及びその製法 |
JP2004063912A (ja) * | 2002-07-30 | 2004-02-26 | Kyocera Corp | 積層型電子部品およびその製法 |
JP2005159224A (ja) | 2003-11-28 | 2005-06-16 | Tdk Corp | 積層セラミックコンデンサ |
JP4407299B2 (ja) | 2004-01-30 | 2010-02-03 | Tdk株式会社 | 積層セラミックコンデンサ |
US7158364B2 (en) * | 2005-03-01 | 2007-01-02 | Tdk Corporation | Multilayer ceramic capacitor and method of producing the same |
JP2007214244A (ja) | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 電極インク、およびそれを用いた積層セラミックコンデンサ |
JP2008251739A (ja) * | 2007-03-29 | 2008-10-16 | Tdk Corp | 積層型電子部品 |
JP4947418B2 (ja) | 2007-04-27 | 2012-06-06 | 住友金属鉱山株式会社 | 導電性ペースト、導電性ペースト乾燥膜及びそれを用いた積層セラミックコンデンサ |
JP2010010157A (ja) * | 2008-06-24 | 2010-01-14 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ及び、その製造方法 |
JP2010153485A (ja) * | 2008-12-24 | 2010-07-08 | Tdk Corp | 電子部品 |
JP4888572B2 (ja) | 2010-01-25 | 2012-02-29 | Tdk株式会社 | 導電性ペーストおよび電子部品の製造方法 |
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2012
- 2012-06-05 KR KR1020120060430A patent/KR101548787B1/ko active IP Right Grant
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2013
- 2013-05-28 JP JP2013111746A patent/JP5855605B2/ja active Active
- 2013-06-03 CN CN201310217831.XA patent/CN103474237B/zh active Active
- 2013-06-05 US US13/910,932 patent/US9183987B2/en active Active
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Publication number | Publication date |
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US9183987B2 (en) | 2015-11-10 |
US20130321978A1 (en) | 2013-12-05 |
KR101548787B1 (ko) | 2015-08-31 |
JP2013254954A (ja) | 2013-12-19 |
CN103474237A (zh) | 2013-12-25 |
CN103474237B (zh) | 2016-06-08 |
KR20130136760A (ko) | 2013-12-13 |
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