JP5763705B2 - 積層セラミック部品 - Google Patents
積層セラミック部品 Download PDFInfo
- Publication number
- JP5763705B2 JP5763705B2 JP2013102820A JP2013102820A JP5763705B2 JP 5763705 B2 JP5763705 B2 JP 5763705B2 JP 2013102820 A JP2013102820 A JP 2013102820A JP 2013102820 A JP2013102820 A JP 2013102820A JP 5763705 B2 JP5763705 B2 JP 5763705B2
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- internal electrode
- electrode layer
- common material
- metal powder
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/346—Titania or titanates
Description
表1のように各組成、粒径及び含量を変化させながら、積層型電子部品(MLCC)を製造した。内部電極層の金属粉末はニッケル金属を使用し、共材はチタン酸バリウムを主成分とし、金属酸化物を副成分として含み、超高容量MLCC(誘電体厚さ0.5μm以下、内部電極0.3μm)を製造した。
110a、110b、110 誘電体層
122 金属粉末(Ni)
121 共材
C 内部電極層の中央
A(Center) 内部電極層の中央Cから上下+20%以内の領域に残存する共材の分率
A(Interface) 前記A(Center)領域以外の内部電極層領域に残存する共材の分率
Claims (6)
- 内部電極層と誘電体層が交互に積層された構造を有し、
前記内部電極層は金属粉末の重量に対して0.01〜12重量%の共材を含み、前記共材の平均粒径は前記金属粉末の平均粒径に対して30%以内の大きさを有し、
焼結後、全体の共材の含量に対する前記内部電極層に残存する共材の含量比は0.006〜0.1である積層セラミック部品。 - 内部電極層と誘電体層が交互に積層された構造を有し、
前記内部電極層は金属粉末の重量に対して0.01〜12重量%の共材を含み、前記共材の平均粒径は前記金属粉末の平均粒径に対して30%以内の大きさを有し、
焼結後、全体の共材の含量に対する前記内部電極層に残存する共材の含量比は0.006〜0.1であり、
前記内部電極層に残存する共材は、内部電極層の厚さ方向を基準として中央から上下+20%以内の領域に残存する共材の分率をA(Center)とし、前記領域以外の内部電極層領域に残存する共材の分率をA(Interface)とすると、前記A(Center)/A(Interface)は10〜2を満足する積層セラミック部品。 - 前記内部電極層は0.1〜0.5μmの厚さを有する請求項1または2に記載の積層セラミック部品。
- 前記内部電極層はニッケル(Ni)または銅(Cu)からなる請求項1または2に記載の積層セラミック部品。
- 前記共材はチタン酸バリウム(BaTiO3)と金属酸化物を含む請求項1または2に記載の積層セラミック部品。
- 前記金属酸化物の金属は、Y3+、La3+、Ce3+、Pr3+、Nd3+、Sm3+、Eu3+、Gd3+、Tb3+、Dy3+、Ho3+、Er3+、Tm3+、Yb3+、及びLu3+からなる群から選択される1種以上のランタン族希土類元素である請求項5に記載の積層セラミック部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120059916A KR101580350B1 (ko) | 2012-06-04 | 2012-06-04 | 적층 세라믹 부품 |
KR10-2012-0059916 | 2012-06-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013251538A JP2013251538A (ja) | 2013-12-12 |
JP5763705B2 true JP5763705B2 (ja) | 2015-08-12 |
Family
ID=49669975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013102820A Active JP5763705B2 (ja) | 2012-06-04 | 2013-05-15 | 積層セラミック部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130321977A1 (ja) |
JP (1) | JP5763705B2 (ja) |
KR (1) | KR101580350B1 (ja) |
CN (1) | CN103456498B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101843190B1 (ko) * | 2011-08-31 | 2018-03-28 | 삼성전기주식회사 | 세라믹 전자부품 및 이의 제조방법 |
KR102189801B1 (ko) * | 2015-12-28 | 2020-12-11 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
CN109074956B (zh) * | 2016-04-28 | 2020-07-10 | 株式会社村田制作所 | 陶瓷电子部件及陶瓷电子部件的制造方法 |
KR101825696B1 (ko) * | 2016-07-01 | 2018-02-05 | 주식회사 모다이노칩 | 칩 부품 및 그 제조 방법 |
JP6986361B2 (ja) * | 2017-04-05 | 2021-12-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
JP6986360B2 (ja) * | 2017-04-05 | 2021-12-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
US10483038B2 (en) * | 2017-05-16 | 2019-11-19 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor |
JP7131955B2 (ja) * | 2017-08-08 | 2022-09-06 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
KR102089704B1 (ko) | 2018-05-28 | 2020-03-16 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
KR102518140B1 (ko) | 2020-04-13 | 2023-04-05 | 한국전기연구원 | 동시 소성이 가능한 적층형 세라믹 소자의 제조방법 및 이로부터 제조되는 적층형 세라믹 소자 |
KR102438839B1 (ko) * | 2020-05-19 | 2022-09-01 | 삼화콘덴서공업주식회사 | 적층형 커패시터 및 이의 제조방법 |
US11776744B2 (en) * | 2020-05-19 | 2023-10-03 | Samhwa Capacitor Co., Ltd. | Multilayer ceramic capacitor and manufacturing method thereof |
KR20220064828A (ko) | 2020-11-12 | 2022-05-19 | 한국전기연구원 | 세라믹 소자용 저확산 구리/니켈 합금 분말, 구리/니켈 합금 분말 제조방법, 구리/니켈 합금 분말을 포함하는 페이스트 및 구리/니켈 합금 분말을 포함하는 세라믹 소자 |
KR20220083295A (ko) | 2020-12-11 | 2022-06-20 | 삼성전기주식회사 | 적층형 전자 부품 |
KR20220131609A (ko) * | 2021-03-22 | 2022-09-29 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR20230066859A (ko) | 2021-11-08 | 2023-05-16 | 한국전기연구원 | 구리 복합 화합물의 제조방법 |
KR20240030032A (ko) | 2022-08-29 | 2024-03-07 | 정연학 | 동시 소성이 가능한 적층형 세라믹 소자용 구리-아연 합금 분말의 제조방법 및 이로부터 제조되는 구리-아연 합금 분말, 이를 포함하는 전극 페이스트 및 적층형 세라믹 소자 |
Family Cites Families (16)
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US5016137A (en) * | 1988-12-05 | 1991-05-14 | Matsushita Electric Industrial Co., Ltd. | Multi-layer ceramic capacitor |
JPH04299588A (ja) * | 1991-03-28 | 1992-10-22 | Nec Corp | 電歪効果素子 |
JP2000269073A (ja) * | 1999-03-19 | 2000-09-29 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサとその製造方法 |
JP3743406B2 (ja) * | 2001-10-05 | 2006-02-08 | 株式会社村田製作所 | 導電性ペースト、積層セラミック電子部品の製造方法および積層セラミック電子部品 |
JP4295179B2 (ja) * | 2004-08-31 | 2009-07-15 | Tdk株式会社 | 電子部品およびその製造方法 |
US7158364B2 (en) * | 2005-03-01 | 2007-01-02 | Tdk Corporation | Multilayer ceramic capacitor and method of producing the same |
JP4947418B2 (ja) | 2007-04-27 | 2012-06-06 | 住友金属鉱山株式会社 | 導電性ペースト、導電性ペースト乾燥膜及びそれを用いた積層セラミックコンデンサ |
JP4861946B2 (ja) * | 2007-09-26 | 2012-01-25 | 株式会社ノリタケカンパニーリミテド | 高速焼成による膜状導体の製造方法 |
WO2010013414A1 (ja) * | 2008-07-29 | 2010-02-04 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2010067418A (ja) | 2008-09-09 | 2010-03-25 | Noritake Co Ltd | 導体ペーストおよびその製造方法 |
JP5293951B2 (ja) | 2008-12-24 | 2013-09-18 | Tdk株式会社 | 電子部品 |
KR20120043501A (ko) * | 2010-10-26 | 2012-05-04 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
KR101730184B1 (ko) * | 2010-11-08 | 2017-05-12 | 삼성전기주식회사 | 도전성 페이스트 조성물 및 이를 이용한 적층 세라믹 콘덴서의 제조방법 |
KR20130005518A (ko) * | 2011-07-06 | 2013-01-16 | 삼성전기주식회사 | 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품 |
KR101823160B1 (ko) * | 2012-04-26 | 2018-01-29 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
KR101761939B1 (ko) * | 2012-04-26 | 2017-07-26 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
-
2012
- 2012-06-04 KR KR1020120059916A patent/KR101580350B1/ko active IP Right Grant
-
2013
- 2013-05-15 JP JP2013102820A patent/JP5763705B2/ja active Active
- 2013-05-23 US US13/900,533 patent/US20130321977A1/en not_active Abandoned
- 2013-06-04 CN CN201310219260.3A patent/CN103456498B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103456498A (zh) | 2013-12-18 |
CN103456498B (zh) | 2018-06-29 |
KR20130136247A (ko) | 2013-12-12 |
US20130321977A1 (en) | 2013-12-05 |
JP2013251538A (ja) | 2013-12-12 |
KR101580350B1 (ko) | 2015-12-23 |
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