JP5735484B2 - 熱電対アセンブリおよびこれを用いた冷接点補償 - Google Patents
熱電対アセンブリおよびこれを用いた冷接点補償 Download PDFInfo
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- 238000000034 method Methods 0.000 claims description 41
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 22
- 238000005259 measurement Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910000809 Alumel Inorganic materials 0.000 description 2
- 229910001179 chromel Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/026—Arrangements for signalling failure or disconnection of thermocouples
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Description
(実際のプロセス温度)−(冷接点の温度)=(測定された熱電対の温度差)
また、熱電対での測定図40から明らかなように、反転したTCのライン48は、CJのライン46に対し正の相関を有している。これは以下の式で表すことができる。
−[(実際のプロセス温度)−(冷接点の温度)]
=(反転して測定された熱電対の温度差)
したがって、熱電対が適切に接続されているか否かは、冷接点の温度と測定された熱電対の温度差とを比較することで明らかとなる。
Claims (20)
- 熱電対(12,14)で温度を検出し、前記熱電対(12,14)の温接点(20)の温度および前記熱電対(12,14)の冷接点(16,18)の温度の関数である熱電対信号(44)を生成する工程と、
冷接点温度センサ(28)で温度を検出し、冷接点(16,18)の温度の関数である冷接点センサ信号(46)を生成する工程と、
前記熱電対信号(44)と前記冷接点センサ信号(46)とを相関演算し、前記熱電対(12,14)が正しくトランスミッタ(34)に接続されているか否かを示す信号を生成する工程と、
を備える、トランスミッタ(34)に接続された熱電対(12,14)の動作を監視する方法。 - 前記熱電対がトランスミッタと正しく接続されているか否かを示す信号をユーザに提供する工程をさらに含むことを特徴とする請求項1に記載の方法。
- 前記熱電対がトランスミッタと正しく接続されているか否かを示す信号は、時間の関数である、前記冷接点センサ信号と前記熱電対信号との相関値であることを特徴とする請求項2に記載の方法。
- 正の相関値に対応して第1の信号をユーザに提供し、負の相関値に対応して第2の信号をユーザに提供する工程をさらに備えることを特徴とする請求項1に記載の方法。
- 略ゼロの相関値に対応して第3の信号をユーザに提供する工程をさらに備えることを特徴とする請求項4に記載の方法。
- 前記冷接点温度センサ信号(46)に対する前記熱電対信号(44)の平均の相関値を演算する工程と、
所定の正の値を越える、平均の相関値に対応して、第1の信号をユーザに提供する工程と、
をさらに備えることを特徴とする請求項1に記載の方法。 - 前記第1の信号に対応して、前記トランスミッタ(34)の第1の端子(16)に接続されていた熱電対の冷接点の端部(12,14)が前記トランスミッタの第2の端子(18)に接続され、前記第2の端子(18)に接続されていた熱電対の冷接点の端部(12,14)が前記第1の端子に接続されるように、前記熱電対(12,14)を前記トランスミッタ(34)に接続し直す工程をさらに備えることを特徴とする請求項6に記載の方法。
- 前記平均の相関値は、前記冷接点の温度が変化した場合に所定の期間に渡って演算されることを特徴とする請求項6に記載の方法。
- 前記所定の期間は、概ね10分間を上回ることを特徴とする請求項8に記載の方法。
- 前記所定の正の値は、0〜1であることを特徴とする請求項8に記載の方法。
- 前記第1の信号に対応して、前記トランスミッタ(34)の第1の端子(16)に接続されていた熱電対の冷接点の端部(12,14)が前記トランスミッタ(34)の第2の端子(18)に接続され、前記第2の端子(18)に接続されていた熱電対の冷接点の端部(12,14)が前記第1の端子に接続されるように、前記熱電対(12,14)を前記トランスミッタ(34)に接続し直す工程をさらに備えることを特徴とする請求項8に記載の方法。
- 前記平均の相関値が所定の負の値未満の場合には、第2の信号をユーザに提供する工程をさらに備えることを特徴とする請求項8に記載の方法。
- 前記平均の相関値が、前記所定の正の値と前記所定の負の値の間にある場合には、第3の信号をユーザに提供する工程をさらに備えることを特徴とする請求項12に記載の方法。
- 前記温接点(20)の温度に実質的に等しい温度を表す温度信号をユーザに提供する工程をさらに備えることを特徴とする請求項1に記載の方法。
- 熱電対の第1の冷接点の端部(12)をトランスミッタ(34)の第1の端子(16)に接続し、熱電対の第2の冷接点の端部(14)を、前記トランスミッタ(34)の第2の端子(18)に接続する工程と、
前記熱電対(34)の温接点(20)を、第1の温度を有する第1の環境に暴露し、前記熱電対の前記冷接点の端部(12,14)を、第2の温度を有する第2の環境に暴露する工程と、
前記熱電対(12,14)で温度を検出して、前記第1の温度と前記第2の温度の差の関数である、熱電対信号(44)を生成する工程と、
冷接点温度センサ(28)で温度を検出し、前記第2の温度として冷接点センサ信号(46)を生成する工程と、
前記冷接点センサ信号(46)と前記熱電対信号(44)との間に正の相関がある場合には、前記第1の冷接点の端部が前記第2の端子(18)に接続され、前記第2の冷接点の端部が前記第1の端子に接続されるように、前記熱電対(12,14)と前記トランスミッタとを接続し直す工程と、
を備える、トランスミッタ(34)に熱電対(12,14)を接続する方法。 - 温接点および冷接点の端部(16,18)を有する熱電対(12,14)であって、前記冷接点の端部(16,18)が第1の冷接点の端子(16)および第2の冷接点の端子(18)を有する熱電対と、
前記冷接点の端部(16,18)の近傍で支持され、前記冷接点の端部(16,18)での温度を測定する冷接点温度センサ(28)と、
前記冷接点温度センサ(28)に電気的に接続され、前記第1の冷接点の端子(16)と前記第2の冷接点の端子(18)とに電気的に接続された電気回路(22,30)であって、
前記第1の冷接点の端子(16)と前記第2の冷接点の端子(18)の間の電圧の関数である熱電対信号(44)を生成し、前記冷接点温度センサ(28)で測定される前記冷接点の端部(16,18)の温度の関数である冷接点センサ信号(46)を生成し、前記熱電対信号(44)と前記冷接点センサ信号(46)の相関を演算する電気回路(22,30)と、
を備えるアセンブリ。 - 前記電気回路(22,30)に電気的に接続されたユーザインターフェースをさらに備えることを特徴とする請求項16に記載のアセンブリ。
- 前記電気回路(22,30)は、前記熱電対(12,14)が正しく前記電気回路(22,30)に接続されているか否かを示す信号を生成するようにユーザインターフェース(38)を駆動するよう構成されていることを特徴とする請求項17に記載のアセンブリ。
- 前記電気回路(22,30)は、相関データおよび温度データを前記ユーザインターフェース(38)に送信することを特徴とする請求項17に記載のアセンブリ。
- 前記電気回路(22,30)は、冷接点補償器(22)を備えることを特徴とする請求項17に記載のアセンブリ。
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US12/384,011 | 2009-03-31 | ||
US12/384,011 US8118484B2 (en) | 2009-03-31 | 2009-03-31 | Thermocouple temperature sensor with connection detection circuitry |
PCT/US2010/000968 WO2010117427A1 (en) | 2009-03-31 | 2010-03-31 | Thermocouple temperature sensor with connection detection circuitry |
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JP2012522247A5 JP2012522247A5 (ja) | 2014-02-06 |
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-
2009
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2010
- 2010-03-31 WO PCT/US2010/000968 patent/WO2010117427A1/en active Application Filing
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- 2010-03-31 CN CN2010800143791A patent/CN102369422B/zh active Active
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Also Published As
Publication number | Publication date |
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US8118484B2 (en) | 2012-02-21 |
EP2414797A4 (en) | 2013-11-20 |
EP2414797B1 (en) | 2017-10-04 |
US20100246630A1 (en) | 2010-09-30 |
WO2010117427A1 (en) | 2010-10-14 |
CN102369422B (zh) | 2013-05-22 |
EP2414797A1 (en) | 2012-02-08 |
JP2012522247A (ja) | 2012-09-20 |
BRPI1014789A2 (pt) | 2016-04-19 |
CN102369422A (zh) | 2012-03-07 |
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