JP5717961B2 - フレキシブル回路基板の製造方法 - Google Patents

フレキシブル回路基板の製造方法 Download PDF

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Publication number
JP5717961B2
JP5717961B2 JP2009292801A JP2009292801A JP5717961B2 JP 5717961 B2 JP5717961 B2 JP 5717961B2 JP 2009292801 A JP2009292801 A JP 2009292801A JP 2009292801 A JP2009292801 A JP 2009292801A JP 5717961 B2 JP5717961 B2 JP 5717961B2
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JP
Japan
Prior art keywords
circuit board
flexible circuit
bent portion
curvature
radius
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Active
Application number
JP2009292801A
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English (en)
Japanese (ja)
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JP2011134884A (ja
JP2011134884A5 (https=
Inventor
篤 加治屋
篤 加治屋
秀和 吉原
秀和 吉原
徹 井澗
徹 井澗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009292801A priority Critical patent/JP5717961B2/ja
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to HK12110516.0A priority patent/HK1169777B/xx
Priority to CN201080058828.2A priority patent/CN102687598B/zh
Priority to EP10839014.7A priority patent/EP2519083A4/en
Priority to PCT/JP2010/062057 priority patent/WO2011077777A1/ja
Priority to US13/518,470 priority patent/US9024198B2/en
Priority to TW099144732A priority patent/TWI508634B/zh
Publication of JP2011134884A publication Critical patent/JP2011134884A/ja
Publication of JP2011134884A5 publication Critical patent/JP2011134884A5/ja
Application granted granted Critical
Publication of JP5717961B2 publication Critical patent/JP5717961B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
JP2009292801A 2009-12-24 2009-12-24 フレキシブル回路基板の製造方法 Active JP5717961B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2009292801A JP5717961B2 (ja) 2009-12-24 2009-12-24 フレキシブル回路基板の製造方法
CN201080058828.2A CN102687598B (zh) 2009-12-24 2010-07-16 柔性电路基板及其制造方法
EP10839014.7A EP2519083A4 (en) 2009-12-24 2010-07-16 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
PCT/JP2010/062057 WO2011077777A1 (ja) 2009-12-24 2010-07-16 フレキシブル回路基板及びその製造方法
HK12110516.0A HK1169777B (en) 2009-12-24 2010-07-16 Flexible circuit board and manufacturing method thereof
US13/518,470 US9024198B2 (en) 2009-12-24 2010-07-16 Flexible circuit board and method for production thereof
TW099144732A TWI508634B (zh) 2009-12-24 2010-12-20 軟性電路基板之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009292801A JP5717961B2 (ja) 2009-12-24 2009-12-24 フレキシブル回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011134884A JP2011134884A (ja) 2011-07-07
JP2011134884A5 JP2011134884A5 (https=) 2013-02-14
JP5717961B2 true JP5717961B2 (ja) 2015-05-13

Family

ID=44195325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009292801A Active JP5717961B2 (ja) 2009-12-24 2009-12-24 フレキシブル回路基板の製造方法

Country Status (6)

Country Link
US (1) US9024198B2 (https=)
EP (1) EP2519083A4 (https=)
JP (1) JP5717961B2 (https=)
CN (1) CN102687598B (https=)
TW (1) TWI508634B (https=)
WO (1) WO2011077777A1 (https=)

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WO2014046014A1 (ja) * 2012-09-20 2014-03-27 株式会社クラレ 回路基板およびその製造方法
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JP6710053B2 (ja) * 2016-01-26 2020-06-17 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
JP6703450B2 (ja) * 2016-07-12 2020-06-03 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板の製造装置
JP6901244B2 (ja) * 2016-07-13 2021-07-14 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法
JP6851813B2 (ja) * 2016-12-22 2021-03-31 東洋アルミニウム株式会社 配線基板
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CN108650780B (zh) * 2018-05-23 2019-07-16 深圳市爱升精密电路科技有限公司 一种柔性印刷电路板
CN108495488B (zh) * 2018-05-23 2019-06-21 深圳市汇芯线路科技有限公司 一种多层印刷线路板的制作方法
CN108770184B (zh) * 2018-05-29 2019-12-27 广州国显科技有限公司 柔性电路板、柔性电路板制作方法及柔性显示面板
WO2020204002A1 (ja) * 2019-03-29 2020-10-08 富士フイルム株式会社 放射線画像撮影装置
WO2021025055A1 (ja) 2019-08-06 2021-02-11 株式会社村田製作所 樹脂多層基板および樹脂多層基板の製造方法
JP7564995B2 (ja) * 2021-02-22 2024-10-10 株式会社オートネットワーク技術研究所 配線モジュール
CN114698267B (zh) * 2021-08-09 2024-06-04 上海航天电子通讯设备研究所 Lcp多层柔性电路板曲面成型方法
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CN113939080A (zh) * 2021-11-19 2022-01-14 安捷利电子科技（苏州）有限公司 一种电路板网格及其制备方法
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Also Published As

Publication number Publication date
JP2011134884A (ja) 2011-07-07
EP2519083A4 (en) 2013-09-11
CN102687598A (zh) 2012-09-19
EP2519083A1 (en) 2012-10-31
US20140102771A1 (en) 2014-04-17
CN102687598B (zh) 2016-01-20
TW201141323A (en) 2011-11-16
US9024198B2 (en) 2015-05-05
HK1169777A1 (zh) 2013-02-01
WO2011077777A1 (ja) 2011-06-30
TWI508634B (zh) 2015-11-11

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