TWI508634B - 軟性電路基板之製造方法 - Google Patents
軟性電路基板之製造方法 Download PDFInfo
- Publication number
- TWI508634B TWI508634B TW099144732A TW99144732A TWI508634B TW I508634 B TWI508634 B TW I508634B TW 099144732 A TW099144732 A TW 099144732A TW 99144732 A TW99144732 A TW 99144732A TW I508634 B TWI508634 B TW I508634B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible circuit
- circuit board
- bent portion
- curvature
- radius
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 30
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 85
- 238000012360 testing method Methods 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- UJMDYLWCYJJYMO-UHFFFAOYSA-N benzene-1,2,3-tricarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1C(O)=O UJMDYLWCYJJYMO-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene naphthalate Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000544 Gore-Tex Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009292801A JP5717961B2 (ja) | 2009-12-24 | 2009-12-24 | フレキシブル回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201141323A TW201141323A (en) | 2011-11-16 |
| TWI508634B true TWI508634B (zh) | 2015-11-11 |
Family
ID=44195325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099144732A TWI508634B (zh) | 2009-12-24 | 2010-12-20 | 軟性電路基板之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9024198B2 (https=) |
| EP (1) | EP2519083A4 (https=) |
| JP (1) | JP5717961B2 (https=) |
| CN (1) | CN102687598B (https=) |
| TW (1) | TWI508634B (https=) |
| WO (1) | WO2011077777A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6044080B2 (ja) * | 2011-07-06 | 2016-12-14 | 株式会社リコー | インクジェット式記録ヘッド、インクジェット式記録装置、インクジェット式記録ヘッドの製造装置 |
| WO2014046014A1 (ja) * | 2012-09-20 | 2014-03-27 | 株式会社クラレ | 回路基板およびその製造方法 |
| JP6152557B2 (ja) * | 2012-11-30 | 2017-06-28 | 国立研究開発法人産業技術総合研究所 | フレキシブル電力センサー |
| EP2950386A1 (en) * | 2012-12-18 | 2015-12-02 | Panasonic Corporation | Communication antenna unit and mobile terminal apparatus |
| JP5596887B1 (ja) | 2014-03-07 | 2014-09-24 | 株式会社メイコー | フレキシブル部を有するリジッドプリント配線基板の曲げ戻し方法 |
| US9930793B2 (en) | 2014-03-27 | 2018-03-27 | Intel Corporation | Electric circuit on flexible substrate |
| JP6306410B2 (ja) * | 2014-04-17 | 2018-04-04 | 日本メクトロン株式会社 | フレキシブルプリント基板の製造方法、基板製造用治具および基板製造装置 |
| EP2991460B1 (en) | 2014-08-29 | 2018-11-21 | Nokia Technologies OY | An apparatus and associated methods for deformable electronics |
| WO2016132868A1 (ja) * | 2015-02-17 | 2016-08-25 | Nok株式会社 | 触覚センサの被覆構造及び触覚センサ |
| CN104837296B (zh) * | 2015-04-03 | 2018-01-02 | 淳华科技(昆山)有限公司 | 液晶高分子聚合物材料柔性线路板的假接结构及方法 |
| JP6710053B2 (ja) * | 2016-01-26 | 2020-06-17 | 日本メクトロン株式会社 | フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 |
| JP6703450B2 (ja) * | 2016-07-12 | 2020-06-03 | 日本メクトロン株式会社 | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板の製造装置 |
| JP6901244B2 (ja) * | 2016-07-13 | 2021-07-14 | 日本メクトロン株式会社 | フレキシブルプリント配線板の製造方法 |
| JP6851813B2 (ja) * | 2016-12-22 | 2021-03-31 | 東洋アルミニウム株式会社 | 配線基板 |
| US11225563B2 (en) | 2017-02-16 | 2022-01-18 | Azotek Co., Ltd. | Circuit board structure and composite for forming insulating substrates |
| US11044802B2 (en) | 2017-02-16 | 2021-06-22 | Azotek Co., Ltd. | Circuit board |
| US10813213B2 (en) | 2017-02-16 | 2020-10-20 | Azotek Co., Ltd. | High-frequency composite substrate and insulating structure thereof |
| US10743423B2 (en) | 2017-09-15 | 2020-08-11 | Azotek Co., Ltd. | Manufacturing method of composite substrate |
| US9994429B1 (en) * | 2017-05-15 | 2018-06-12 | Otis Elevator Company | Handrail with a built-in RBI |
| EP3701426B1 (en) * | 2017-10-24 | 2024-11-20 | Avery Dennison Retail Information Services LLC | A planar conductive device that forms a coil for an rfid tag when folded |
| CN108012406A (zh) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | 可拉伸的fpc板及其制作方法 |
| CN108650780B (zh) * | 2018-05-23 | 2019-07-16 | 深圳市爱升精密电路科技有限公司 | 一种柔性印刷电路板 |
| CN108495488B (zh) * | 2018-05-23 | 2019-06-21 | 深圳市汇芯线路科技有限公司 | 一种多层印刷线路板的制作方法 |
| CN108770184B (zh) * | 2018-05-29 | 2019-12-27 | 广州国显科技有限公司 | 柔性电路板、柔性电路板制作方法及柔性显示面板 |
| WO2020204002A1 (ja) * | 2019-03-29 | 2020-10-08 | 富士フイルム株式会社 | 放射線画像撮影装置 |
| WO2021025055A1 (ja) | 2019-08-06 | 2021-02-11 | 株式会社村田製作所 | 樹脂多層基板および樹脂多層基板の製造方法 |
| JP7564995B2 (ja) * | 2021-02-22 | 2024-10-10 | 株式会社オートネットワーク技術研究所 | 配線モジュール |
| CN114698267B (zh) * | 2021-08-09 | 2024-06-04 | 上海航天电子通讯设备研究所 | Lcp多层柔性电路板曲面成型方法 |
| CN113689978A (zh) * | 2021-08-12 | 2021-11-23 | 武汉华星光电半导体显示技术有限公司 | 一种柔性电路板和电子设备 |
| CN113939080A (zh) * | 2021-11-19 | 2022-01-14 | 安捷利电子科技（苏州）有限公司 | 一种电路板网格及其制备方法 |
| CN119342684B (zh) * | 2023-07-21 | 2025-10-14 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板、可穿戴设备以及柔性电路板的制作方法 |
| JP2025075949A (ja) * | 2023-11-01 | 2025-05-15 | ニデックプレシジョン株式会社 | 撮像ユニット |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220787A (ja) * | 1990-01-26 | 1991-09-27 | Yazaki Corp | フレキシブル回路体とその製造方法 |
| TW200642535A (en) * | 2005-02-17 | 2006-12-01 | Nippon Steel Chemical Co | Two-side flexible circuit substrate adapted for repeated bending |
| JP2007305704A (ja) * | 2006-05-10 | 2007-11-22 | Kaneka Corp | 高屈曲性フレキシブル回路基板 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300572A (en) * | 1963-12-18 | 1967-01-24 | Sanders Associates Inc | Extensible and retractable flexible circuit cable |
| JPS6051213B2 (ja) * | 1978-05-30 | 1985-11-13 | 株式会社フジクラ | 伸縮自在なテ−プ電線の製造装置 |
| US5341806A (en) | 1991-04-18 | 1994-08-30 | Physio-Control Corporation | Multiple electrode strip |
| US5316693A (en) * | 1991-04-18 | 1994-05-31 | Idemitsu Kosan Co., Ltd. | Liquid crystal composition and information display apparatus using the liquid crystal composition |
| JPH0576070A (ja) | 1991-09-17 | 1993-03-26 | Nec Corp | リモート・コントロール送信装置 |
| JP2537639Y2 (ja) | 1992-03-21 | 1997-06-04 | 日本メクトロン株式会社 | 可撓性回路基板の折曲げ構造 |
| JP3203883B2 (ja) * | 1993-06-10 | 2001-08-27 | 横河電機株式会社 | プリントコイル形トランス |
| JP2790056B2 (ja) * | 1994-02-04 | 1998-08-27 | 株式会社デンソー | 可撓性プリント配線板とその製造方法 |
| JPH08274417A (ja) * | 1995-03-31 | 1996-10-18 | Matsushita Electric Ind Co Ltd | フレキシブル配線板およびその製造方法 |
| US6027958A (en) * | 1996-07-11 | 2000-02-22 | Kopin Corporation | Transferred flexible integrated circuit |
| US6274225B1 (en) | 1996-10-05 | 2001-08-14 | Nitto Denko Corporation | Circuit member and circuit board |
| JP3592464B2 (ja) | 1996-10-05 | 2004-11-24 | 日東電工株式会社 | 剛性回路部材 |
| CN1115082C (zh) | 1996-10-05 | 2003-07-16 | 日东电工株式会社 | 电路部件和电路板 |
| JPH1154873A (ja) * | 1997-07-31 | 1999-02-26 | Canon Inc | フレキシブルプリント基板 |
| US5906507A (en) * | 1997-08-07 | 1999-05-25 | Howard; James R. | Foldable electrical cord |
| JP4190049B2 (ja) * | 1998-04-07 | 2008-12-03 | 株式会社神戸製鋼所 | 形材の引張曲げ加工方法 |
| JP2000042638A (ja) * | 1998-07-28 | 2000-02-15 | Toyota Motor Corp | 引張り曲げ加工装置 |
| JP2002094191A (ja) * | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | フレキシブル基板およびこれを用いた装置 |
| GB2401492B (en) * | 2000-10-13 | 2005-03-30 | Nokia Corp | Apparatus for routing a flexible circuit |
| JP2003008161A (ja) | 2001-06-26 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 導電体、および回路基板 |
| JP3828412B2 (ja) * | 2001-12-03 | 2006-10-04 | 本田技研工業株式会社 | 閉断面部付きパネル部材の成形方法及び閉断面部付きパネル部材の成形装置 |
| JP3989820B2 (ja) * | 2002-11-18 | 2007-10-10 | 山一電機株式会社 | 多層の配線板およびその製造方法 |
| US6843870B1 (en) * | 2003-07-22 | 2005-01-18 | Epic Biosonics Inc. | Implantable electrical cable and method of making |
| JP2007134473A (ja) * | 2005-11-10 | 2007-05-31 | Matsushita Electric Ind Co Ltd | フレキシブル配線基板およびその製造方法 |
| JP2009526201A (ja) * | 2006-01-26 | 2009-07-16 | コーネル・リサーチ・ファンデーション・インコーポレイテッド | 小試料操作用の微細加工されたツール |
| JP4907328B2 (ja) * | 2006-12-15 | 2012-03-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
| JP2008159908A (ja) * | 2006-12-25 | 2008-07-10 | Teikoku Tsushin Kogyo Co Ltd | フレキシブル回路基板の折り曲げ構造 |
| JP4830881B2 (ja) * | 2007-02-05 | 2011-12-07 | 住友金属鉱山株式会社 | 成形加工用回路基板、および、これを成形加工して得られる立体回路基板 |
| JP2008210891A (ja) * | 2007-02-23 | 2008-09-11 | Fujikura Ltd | フレキシブルプリント基板 |
| WO2010058476A1 (ja) * | 2008-11-21 | 2010-05-27 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
| CN102237628A (zh) * | 2010-05-06 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | 连接件及具有连接件的电子装置 |
-
2009
- 2009-12-24 JP JP2009292801A patent/JP5717961B2/ja active Active
-
2010
- 2010-07-16 US US13/518,470 patent/US9024198B2/en active Active
- 2010-07-16 CN CN201080058828.2A patent/CN102687598B/zh active Active
- 2010-07-16 EP EP10839014.7A patent/EP2519083A4/en not_active Ceased
- 2010-07-16 WO PCT/JP2010/062057 patent/WO2011077777A1/ja not_active Ceased
- 2010-12-20 TW TW099144732A patent/TWI508634B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220787A (ja) * | 1990-01-26 | 1991-09-27 | Yazaki Corp | フレキシブル回路体とその製造方法 |
| TW200642535A (en) * | 2005-02-17 | 2006-12-01 | Nippon Steel Chemical Co | Two-side flexible circuit substrate adapted for repeated bending |
| JP2007305704A (ja) * | 2006-05-10 | 2007-11-22 | Kaneka Corp | 高屈曲性フレキシブル回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011134884A (ja) | 2011-07-07 |
| EP2519083A4 (en) | 2013-09-11 |
| CN102687598A (zh) | 2012-09-19 |
| EP2519083A1 (en) | 2012-10-31 |
| JP5717961B2 (ja) | 2015-05-13 |
| US20140102771A1 (en) | 2014-04-17 |
| CN102687598B (zh) | 2016-01-20 |
| TW201141323A (en) | 2011-11-16 |
| US9024198B2 (en) | 2015-05-05 |
| HK1169777A1 (zh) | 2013-02-01 |
| WO2011077777A1 (ja) | 2011-06-30 |
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