JP5694459B2 - 積層セラミック電子部品及びその実装基板 - Google Patents
積層セラミック電子部品及びその実装基板 Download PDFInfo
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- JP5694459B2 JP5694459B2 JP2013154306A JP2013154306A JP5694459B2 JP 5694459 B2 JP5694459 B2 JP 5694459B2 JP 2013154306 A JP2013154306 A JP 2013154306A JP 2013154306 A JP2013154306 A JP 2013154306A JP 5694459 B2 JP5694459 B2 JP 5694459B2
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- 239000000919 ceramic Substances 0.000 title claims description 104
- 239000003985 ceramic capacitor Substances 0.000 description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000007747 plating Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
110 セラミック本体
111 誘電体層
121、121’、122、122’ 第1及び第2内部電極
131、132 第1及び第2外部電極
Claims (11)
- 実装に供するための積層セラミック電子部品において、
厚さ方向に積層された複数の誘電体層を含み、幅をW、厚さをTと規定するとき、T/W>1.0を満たすセラミック本体と、
前記セラミック本体内において前記誘電体層を介して対向するように配置され、前記セラミック本体の両端面を通じて交互に露出した複数の第1及び第2内部電極と、
前記セラミック本体の両端面から上下両主面まで形成され、前記第1及び第2内部電極とそれぞれ電気的に連結された第1及び第2外部電極と、を含み、
前記セラミック本体の高さをa、前記セラミック本体の上側主面に形成された第1及び第2外部電極の上端から前記セラミック本体の下側主面に形成された第1及び第2外部電極の下端までの距離をbと規定するとき、0.990≦a/b<1の範囲を満たす、積層セラミック電子部品。 - 前記誘電体層の平均厚さをtdとすると、0.1μm≦td≦0.6μmを満たす、請求項1に記載の積層セラミック電子部品。
- 前記第1及び第2内部電極の厚さは、0.6μm以下である、請求項1に記載の積層セラミック電子部品。
- 前記誘電体層の平均厚さをtd、前記第1及び第2内部電極の厚さをteと規定するとき、te/td≦0.833を満たす、請求項1に記載の積層セラミック電子部品。
- 前記誘電体層の積層数は、500層以上である、請求項1に記載の積層セラミック電子部品。
- 実装に供するための積層セラミック電子部品において、
幅方向に積層された複数の誘電体層を含み、幅をW、厚さをTと規定するとき、T/W>1.0を満たすセラミック本体と、
前記セラミック本体内において前記誘電体層を介して対向するように配置され、前記セラミック本体の両端面を通じて交互に露出した複数の第1及び第2内部電極と、
前記セラミック本体の両端面から上下両主面まで形成され、前記第1及び第2内部電極とそれぞれ電気的に連結された第1及び第2外部電極と、を含み、
前記セラミック本体の高さをa、前記セラミック本体の上側主面に形成された第1及び第2外部電極の上端から前記セラミック本体の下側主面に形成された第1及び第2外部電極の下端までの距離をbと規定するとき、0.990≦a/b<1の範囲を満たす、積層セラミック電子部品。 - 前記誘電体層の平均厚さをtdとすると、0.1μm≦td≦0.6μmを満たす、請求項6に記載の積層セラミック電子部品。
- 前記第1及び第2内部電極の厚さは、0.6μm以下である、請求項6に記載の積層セラミック電子部品。
- 前記誘電体層の平均厚さをtd、前記第1及び第2内部電極の厚さをteと規定するとき、te/td≦0.833を満たす、請求項6に記載の積層セラミック電子部品。
- 前記誘電体層の積層数は、500層以上である、請求項6に記載の積層セラミック電子部品。
- 上部に第1及び第2電極パッドを有する印刷回路基板と、
前記第1及び第2電極パッド上に設置された請求項1から10のいずれか一項に記載の積層セラミック電子部品と、を含む、積層セラミック電子部品の実装基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0046769 | 2013-04-26 | ||
KR1020130046769A KR101496816B1 (ko) | 2013-04-26 | 2013-04-26 | 적층 세라믹 전자 부품 및 그 실장 기판 |
Publications (2)
Publication Number | Publication Date |
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JP2014216641A JP2014216641A (ja) | 2014-11-17 |
JP5694459B2 true JP5694459B2 (ja) | 2015-04-01 |
Family
ID=51769434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013154306A Active JP5694459B2 (ja) | 2013-04-26 | 2013-07-25 | 積層セラミック電子部品及びその実装基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9064639B2 (ja) |
JP (1) | JP5694459B2 (ja) |
KR (1) | KR101496816B1 (ja) |
CN (1) | CN104124058A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102185055B1 (ko) * | 2018-10-02 | 2020-12-01 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
CN110459402A (zh) * | 2019-08-28 | 2019-11-15 | 广东风华高新科技股份有限公司 | 一种多层陶瓷电容器 |
KR20190116185A (ko) | 2019-09-20 | 2019-10-14 | 삼성전기주식회사 | 전자 부품 |
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JP3586258B2 (ja) * | 2001-04-27 | 2004-11-10 | Tdk株式会社 | 積層セラミック電子部品の製造方法 |
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-
2013
- 2013-04-26 KR KR1020130046769A patent/KR101496816B1/ko active IP Right Grant
- 2013-07-25 JP JP2013154306A patent/JP5694459B2/ja active Active
- 2013-07-26 US US13/952,573 patent/US9064639B2/en active Active
- 2013-08-08 CN CN201310344203.8A patent/CN104124058A/zh active Pending
Also Published As
Publication number | Publication date |
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JP2014216641A (ja) | 2014-11-17 |
KR20140128074A (ko) | 2014-11-05 |
KR101496816B1 (ko) | 2015-02-27 |
US9064639B2 (en) | 2015-06-23 |
CN104124058A (zh) | 2014-10-29 |
US20140318842A1 (en) | 2014-10-30 |
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