JP5683994B2 - マルチセルアレイを有する半導体発光装置、発光モジュール及び照明装置 - Google Patents

マルチセルアレイを有する半導体発光装置、発光モジュール及び照明装置 Download PDF

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Publication number
JP5683994B2
JP5683994B2 JP2011033514A JP2011033514A JP5683994B2 JP 5683994 B2 JP5683994 B2 JP 5683994B2 JP 2011033514 A JP2011033514 A JP 2011033514A JP 2011033514 A JP2011033514 A JP 2011033514A JP 5683994 B2 JP5683994 B2 JP 5683994B2
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light emitting
substrate
emitting device
region
semiconductor layer
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JP2011171739A5 (enExample
JP2011171739A (ja
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タエ キム、サン
タエ キム、サン
フン キム、タエ
フン キム、タエ
ヨーン キム、ジャエ
ヨーン キム、ジャエ
ソー ハ、ハエ
ソー ハ、ハエ
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

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  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP2011033514A 2010-02-19 2011-02-18 マルチセルアレイを有する半導体発光装置、発光モジュール及び照明装置 Active JP5683994B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0015422 2010-02-19
KR1020100015422A KR101601624B1 (ko) 2010-02-19 2010-02-19 멀티셀 어레이를 갖는 반도체 발광장치, 발광모듈 및 조명장치

Publications (3)

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JP2011171739A JP2011171739A (ja) 2011-09-01
JP2011171739A5 JP2011171739A5 (enExample) 2014-04-10
JP5683994B2 true JP5683994B2 (ja) 2015-03-11

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US (1) US8829540B2 (enExample)
EP (1) EP2365527B1 (enExample)
JP (1) JP5683994B2 (enExample)
KR (1) KR101601624B1 (enExample)
CN (1) CN102169933B (enExample)
TW (1) TWI437702B (enExample)

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Publication number Publication date
US20110204387A1 (en) 2011-08-25
CN102169933A (zh) 2011-08-31
TWI437702B (zh) 2014-05-11
EP2365527B1 (en) 2016-11-02
JP2011171739A (ja) 2011-09-01
CN102169933B (zh) 2014-12-03
KR101601624B1 (ko) 2016-03-09
EP2365527A2 (en) 2011-09-14
US8829540B2 (en) 2014-09-09
EP2365527A3 (en) 2014-01-29
TW201212219A (en) 2012-03-16
KR20110095772A (ko) 2011-08-25

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