JP5646349B2 - 半導体ウェハ製造をモニタリングする方法 - Google Patents

半導体ウェハ製造をモニタリングする方法 Download PDF

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Publication number
JP5646349B2
JP5646349B2 JP2010550254A JP2010550254A JP5646349B2 JP 5646349 B2 JP5646349 B2 JP 5646349B2 JP 2010550254 A JP2010550254 A JP 2010550254A JP 2010550254 A JP2010550254 A JP 2010550254A JP 5646349 B2 JP5646349 B2 JP 5646349B2
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wafer
transporter
processing
semiconductor
loaded
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JP2011514006A5 (enExample
JP2011514006A (ja
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ウィルビー，ロバート・ジョン
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Metryx Ltd
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Metryx Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2010550254A 2008-03-11 2009-03-10 半導体ウェハ製造をモニタリングする方法 Expired - Fee Related JP5646349B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0804499.2 2008-03-11
GBGB0804499.2A GB0804499D0 (en) 2008-03-11 2008-03-11 Measurement apparatus and method
PCT/GB2009/000646 WO2009112821A1 (en) 2008-03-11 2009-03-10 Semiconductor wafer monitoring apparatus and method

Publications (3)

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JP2011514006A JP2011514006A (ja) 2011-04-28
JP2011514006A5 JP2011514006A5 (enExample) 2012-04-05
JP5646349B2 true JP5646349B2 (ja) 2014-12-24

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US (1) US9349624B2 (enExample)
EP (1) EP2257967A1 (enExample)
JP (1) JP5646349B2 (enExample)
GB (1) GB0804499D0 (enExample)
TW (1) TWI496228B (enExample)
WO (1) WO2009112821A1 (enExample)

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CN112802776B (zh) * 2020-12-31 2023-10-20 苏州首肯机械有限公司 伺服半导体封装压机智能化压力控制系统及控制方法
CN113031669B (zh) * 2021-02-10 2022-04-22 国机集团科学技术研究院有限公司 一种高品质晶体培植类关键工艺环境振动控制技术分析方法
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CN115527825A (zh) * 2021-06-25 2022-12-27 中微半导体设备(上海)股份有限公司 一种用于等离子体处理设备的检测装置及等离子体处理设备
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Publication number Publication date
US20110015773A1 (en) 2011-01-20
EP2257967A1 (en) 2010-12-08
US9349624B2 (en) 2016-05-24
TW200947578A (en) 2009-11-16
WO2009112821A1 (en) 2009-09-17
GB0804499D0 (en) 2008-04-16
JP2011514006A (ja) 2011-04-28
TWI496228B (zh) 2015-08-11

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