GB2404787B - Apparatus and method for investigating semiconductor wafers - Google Patents

Apparatus and method for investigating semiconductor wafers

Info

Publication number
GB2404787B
GB2404787B GB0423092A GB0423092A GB2404787B GB 2404787 B GB2404787 B GB 2404787B GB 0423092 A GB0423092 A GB 0423092A GB 0423092 A GB0423092 A GB 0423092A GB 2404787 B GB2404787 B GB 2404787B
Authority
GB
United Kingdom
Prior art keywords
semiconductor wafers
investigating
investigating semiconductor
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0423092A
Other versions
GB2404787A (en
GB0423092D0 (en
Inventor
Robert John Wilby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0016562.1A external-priority patent/GB0016562D0/en
Application filed by Metryx Ltd filed Critical Metryx Ltd
Publication of GB0423092D0 publication Critical patent/GB0423092D0/en
Publication of GB2404787A publication Critical patent/GB2404787A/en
Application granted granted Critical
Publication of GB2404787B publication Critical patent/GB2404787B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB0423092A 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers Expired - Fee Related GB2404787B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0016562.1A GB0016562D0 (en) 2000-07-05 2000-07-05 Apparatus and method for investigating semiconductor wafers
GB0300391A GB2380609B (en) 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers

Publications (3)

Publication Number Publication Date
GB0423092D0 GB0423092D0 (en) 2004-11-17
GB2404787A GB2404787A (en) 2005-02-09
GB2404787B true GB2404787B (en) 2005-04-13

Family

ID=34066584

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0423092A Expired - Fee Related GB2404787B (en) 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers

Country Status (1)

Country Link
GB (1) GB2404787B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0804499D0 (en) 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50129405A (en) * 1974-02-25 1975-10-13
JPH03199908A (en) * 1989-12-27 1991-08-30 Shimadzu Corp Film thickness measuring apparatus
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
EP1296367A1 (en) * 2000-05-01 2003-03-26 Hamamatsu Photonics K.K. Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50129405A (en) * 1974-02-25 1975-10-13
JPH03199908A (en) * 1989-12-27 1991-08-30 Shimadzu Corp Film thickness measuring apparatus
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
EP1296367A1 (en) * 2000-05-01 2003-03-26 Hamamatsu Photonics K.K. Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same

Also Published As

Publication number Publication date
GB2404787A (en) 2005-02-09
GB0423092D0 (en) 2004-11-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20190629