GB0804499D0 - Measurement apparatus and method - Google Patents

Measurement apparatus and method

Info

Publication number
GB0804499D0
GB0804499D0 GBGB0804499.2A GB0804499A GB0804499D0 GB 0804499 D0 GB0804499 D0 GB 0804499D0 GB 0804499 A GB0804499 A GB 0804499A GB 0804499 D0 GB0804499 D0 GB 0804499D0
Authority
GB
United Kingdom
Prior art keywords
measurement apparatus
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0804499.2A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Priority to GBGB0804499.2A priority Critical patent/GB0804499D0/en
Publication of GB0804499D0 publication Critical patent/GB0804499D0/en
Priority to PCT/GB2009/000646 priority patent/WO2009112821A1/en
Priority to EP09719206A priority patent/EP2257967A1/en
Priority to US12/921,972 priority patent/US9349624B2/en
Priority to JP2010550254A priority patent/JP5646349B2/ja
Priority to TW098107916A priority patent/TWI496228B/zh
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GBGB0804499.2A 2008-03-11 2008-03-11 Measurement apparatus and method Ceased GB0804499D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GBGB0804499.2A GB0804499D0 (en) 2008-03-11 2008-03-11 Measurement apparatus and method
PCT/GB2009/000646 WO2009112821A1 (en) 2008-03-11 2009-03-10 Semiconductor wafer monitoring apparatus and method
EP09719206A EP2257967A1 (en) 2008-03-11 2009-03-10 Semiconductor wafer monitoring apparatus and method
US12/921,972 US9349624B2 (en) 2008-03-11 2009-03-10 Semiconductor wafer monitoring apparatus and method
JP2010550254A JP5646349B2 (ja) 2008-03-11 2009-03-10 半導体ウェハ製造をモニタリングする方法
TW098107916A TWI496228B (zh) 2008-03-11 2009-03-11 半導體晶圓監視裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0804499.2A GB0804499D0 (en) 2008-03-11 2008-03-11 Measurement apparatus and method

Publications (1)

Publication Number Publication Date
GB0804499D0 true GB0804499D0 (en) 2008-04-16

Family

ID=39327907

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0804499.2A Ceased GB0804499D0 (en) 2008-03-11 2008-03-11 Measurement apparatus and method

Country Status (6)

Country Link
US (1) US9349624B2 (enExample)
EP (1) EP2257967A1 (enExample)
JP (1) JP5646349B2 (enExample)
GB (1) GB0804499D0 (enExample)
TW (1) TWI496228B (enExample)
WO (1) WO2009112821A1 (enExample)

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GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
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US9927725B2 (en) 2015-02-16 2018-03-27 Canon Kabushiki Kaisha Lithography apparatus, lithography method, program, lithography system, and article manufacturing method
JP6288027B2 (ja) * 2015-09-28 2018-03-07 株式会社タツノ 校正装置及び校正方法
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US10236222B2 (en) 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
JP6914062B2 (ja) * 2017-03-03 2021-08-04 東京エレクトロン株式会社 基板処理装置および基板処理方法
TWI831656B (zh) * 2018-01-04 2024-02-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
US11056366B2 (en) * 2018-03-23 2021-07-06 Kla Corporation Sample transport device with integrated metrology
DE102018113786A1 (de) * 2018-06-08 2019-12-12 Vat Holding Ag Waferübergabeeinheit und Waferübergabesystem
US11177183B2 (en) * 2018-09-19 2021-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Thickness measurement system and method
TWI737996B (zh) * 2019-05-16 2021-09-01 華景電通股份有限公司 晶圓載具監控系統及其監控方法
KR20220028106A (ko) * 2019-07-05 2022-03-08 케이엘에이 코포레이션 양자 컴퓨팅을 이용한 동적 샘플링 계획, 최적화된 웨이퍼 측정 경로 및 최적화된 웨이퍼 이송을 통한 팹 관리
CN111430264A (zh) * 2019-08-16 2020-07-17 合肥晶合集成电路有限公司 半导体加工设备及其装载晶圆盒的控制方法
CN112786474B (zh) * 2019-11-01 2022-07-19 芯恩（青岛）集成电路有限公司 薄膜沉积设备及半导体工艺方法
US12237189B2 (en) * 2019-11-19 2025-02-25 Micron Technology, Inc. Wafer storage devices configured to measure physical properties of wafers stored therein
CN110957251B (zh) * 2019-11-20 2022-11-18 上海至纯洁净系统科技股份有限公司 一种计量晶圆片数的短行程升降装置
CN112802776B (zh) * 2020-12-31 2023-10-20 苏州首肯机械有限公司 伺服半导体封装压机智能化压力控制系统及控制方法
CN113031669B (zh) * 2021-02-10 2022-04-22 国机集团科学技术研究院有限公司 一种高品质晶体培植类关键工艺环境振动控制技术分析方法
GB202108212D0 (en) * 2021-06-09 2021-07-21 Metryx Ltd Apparatus comprising a weighing device
CN115527825A (zh) * 2021-06-25 2022-12-27 中微半导体设备(上海)股份有限公司 一种用于等离子体处理设备的检测装置及等离子体处理设备
US20230169643A1 (en) * 2021-11-30 2023-06-01 Applied Materials, Inc. Monitoring of deposited or etched film thickness using image-based mass distribution metrology
KR102673392B1 (ko) * 2021-12-07 2024-06-10 에스케이실트론 주식회사 웨이퍼 연마량 측정장치 및 그 측정방법
CN115877165B (zh) * 2023-03-09 2023-06-16 合肥晶合集成电路股份有限公司 一种wat测试设备及其管控方法

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GB2404787B (en) 2000-07-05 2005-04-13 Metryx Ltd Apparatus and method for investigating semiconductor wafers
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KR20020081726A (ko) * 2001-04-19 2002-10-30 삼성전자 주식회사 웨이퍼 수량측정장치
JP4001469B2 (ja) * 2001-06-19 2007-10-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2003322625A (ja) * 2002-04-30 2003-11-14 Hitachi Electronics Eng Co Ltd 半導体チップ検査方法及び半導体チップ検査装置
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
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Also Published As

Publication number Publication date
US20110015773A1 (en) 2011-01-20
EP2257967A1 (en) 2010-12-08
JP5646349B2 (ja) 2014-12-24
US9349624B2 (en) 2016-05-24
TW200947578A (en) 2009-11-16
WO2009112821A1 (en) 2009-09-17
JP2011514006A (ja) 2011-04-28
TWI496228B (zh) 2015-08-11

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)