TWI496228B - 半導體晶圓監視裝置及方法 - Google Patents
半導體晶圓監視裝置及方法 Download PDFInfo
- Publication number
- TWI496228B TWI496228B TW098107916A TW98107916A TWI496228B TW I496228 B TWI496228 B TW I496228B TW 098107916 A TW098107916 A TW 098107916A TW 98107916 A TW98107916 A TW 98107916A TW I496228 B TWI496228 B TW I496228B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- transporter
- processing
- semiconductor wafers
- wafers
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 83
- 238000000034 method Methods 0.000 title claims description 73
- 238000012544 monitoring process Methods 0.000 title claims description 18
- 235000012431 wafers Nutrition 0.000 claims description 312
- 238000012545 processing Methods 0.000 claims description 119
- 238000005259 measurement Methods 0.000 claims description 117
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 230000008859 change Effects 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 17
- 238000005303 weighing Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 13
- 230000004044 response Effects 0.000 claims description 12
- 230000007723 transport mechanism Effects 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000005468 ion implantation Methods 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 14
- 230000005284 excitation Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 238000005070 sampling Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 238000000560 X-ray reflectometry Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0804499.2A GB0804499D0 (en) | 2008-03-11 | 2008-03-11 | Measurement apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200947578A TW200947578A (en) | 2009-11-16 |
| TWI496228B true TWI496228B (zh) | 2015-08-11 |
Family
ID=39327907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098107916A TWI496228B (zh) | 2008-03-11 | 2009-03-11 | 半導體晶圓監視裝置及方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9349624B2 (enExample) |
| EP (1) | EP2257967A1 (enExample) |
| JP (1) | JP5646349B2 (enExample) |
| GB (1) | GB0804499D0 (enExample) |
| TW (1) | TWI496228B (enExample) |
| WO (1) | WO2009112821A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2638567A2 (de) * | 2010-11-11 | 2013-09-18 | Zimmermann & Schilp Handhabungstechnik GmbH | Belade- und entladeverfahren für eine prozesskassette |
| KR101239354B1 (ko) * | 2010-11-11 | 2013-03-18 | 한국수력원자력 주식회사 | 글로브박스 내의 기압변화 보정기능을 가지는 전자저울 |
| US9901210B2 (en) | 2012-01-04 | 2018-02-27 | Globalfoundries Singapore Pte. Ltd. | Efficient transfer of materials in manufacturing |
| US9846415B2 (en) | 2012-01-19 | 2017-12-19 | Globalfoundries Singapore Pte. Ltd. | Efficient transfer of materials using automated guided vehicles in semiconductor manufacturing |
| US9558978B2 (en) * | 2012-05-04 | 2017-01-31 | Kla-Tencor Corporation | Material handling with dedicated automated material handling system |
| GB201405926D0 (en) * | 2014-04-02 | 2014-05-14 | Metryx Ltd | Semiconductor wafer weighing apparatus and methods |
| US9478408B2 (en) | 2014-06-06 | 2016-10-25 | Lam Research Corporation | Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging |
| US10047438B2 (en) | 2014-06-10 | 2018-08-14 | Lam Research Corporation | Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas |
| US10081869B2 (en) | 2014-06-10 | 2018-09-25 | Lam Research Corporation | Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates |
| JP6198805B2 (ja) * | 2015-02-16 | 2017-09-20 | キヤノン株式会社 | リソグラフィ装置、リソグラフィ方法、プログラム、リソグラフィシステムおよび物品製造方法 |
| US9927725B2 (en) | 2015-02-16 | 2018-03-27 | Canon Kabushiki Kaisha | Lithography apparatus, lithography method, program, lithography system, and article manufacturing method |
| JP6288027B2 (ja) * | 2015-09-28 | 2018-03-07 | 株式会社タツノ | 校正装置及び校正方法 |
| US20180047646A1 (en) * | 2016-02-24 | 2018-02-15 | Kla-Tencor Corporation | Accuracy improvements in optical metrology |
| US10236222B2 (en) | 2017-02-08 | 2019-03-19 | Kla-Tencor Corporation | System and method for measuring substrate and film thickness distribution |
| JP6914062B2 (ja) * | 2017-03-03 | 2021-08-04 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| TWI831656B (zh) * | 2018-01-04 | 2024-02-01 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
| US11056366B2 (en) * | 2018-03-23 | 2021-07-06 | Kla Corporation | Sample transport device with integrated metrology |
| DE102018113786A1 (de) * | 2018-06-08 | 2019-12-12 | Vat Holding Ag | Waferübergabeeinheit und Waferübergabesystem |
| US11177183B2 (en) * | 2018-09-19 | 2021-11-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thickness measurement system and method |
| TWI737996B (zh) * | 2019-05-16 | 2021-09-01 | 華景電通股份有限公司 | 晶圓載具監控系統及其監控方法 |
| KR20220028106A (ko) * | 2019-07-05 | 2022-03-08 | 케이엘에이 코포레이션 | 양자 컴퓨팅을 이용한 동적 샘플링 계획, 최적화된 웨이퍼 측정 경로 및 최적화된 웨이퍼 이송을 통한 팹 관리 |
| CN111430264A (zh) * | 2019-08-16 | 2020-07-17 | 合肥晶合集成电路有限公司 | 半导体加工设备及其装载晶圆盒的控制方法 |
| CN112786474B (zh) * | 2019-11-01 | 2022-07-19 | 芯恩（青岛）集成电路有限公司 | 薄膜沉积设备及半导体工艺方法 |
| US12237189B2 (en) * | 2019-11-19 | 2025-02-25 | Micron Technology, Inc. | Wafer storage devices configured to measure physical properties of wafers stored therein |
| CN110957251B (zh) * | 2019-11-20 | 2022-11-18 | 上海至纯洁净系统科技股份有限公司 | 一种计量晶圆片数的短行程升降装置 |
| CN112802776B (zh) * | 2020-12-31 | 2023-10-20 | 苏州首肯机械有限公司 | 伺服半导体封装压机智能化压力控制系统及控制方法 |
| CN113031669B (zh) * | 2021-02-10 | 2022-04-22 | 国机集团科学技术研究院有限公司 | 一种高品质晶体培植类关键工艺环境振动控制技术分析方法 |
| GB202108212D0 (en) * | 2021-06-09 | 2021-07-21 | Metryx Ltd | Apparatus comprising a weighing device |
| CN115527825A (zh) * | 2021-06-25 | 2022-12-27 | 中微半导体设备(上海)股份有限公司 | 一种用于等离子体处理设备的检测装置及等离子体处理设备 |
| US20230169643A1 (en) * | 2021-11-30 | 2023-06-01 | Applied Materials, Inc. | Monitoring of deposited or etched film thickness using image-based mass distribution metrology |
| KR102673392B1 (ko) * | 2021-12-07 | 2024-06-10 | 에스케이실트론 주식회사 | 웨이퍼 연마량 측정장치 및 그 측정방법 |
| CN115877165B (zh) * | 2023-03-09 | 2023-06-16 | 合肥晶合集成电路股份有限公司 | 一种wat测试设备及其管控方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888994A (en) * | 1987-11-18 | 1989-12-26 | Tel Sagami Limited | Method of carrying objects into and from a furnace, and apparatus for carrying objects into and from a furnace |
| US5625170A (en) * | 1994-01-18 | 1997-04-29 | Nanometrics Incorporated | Precision weighing to monitor the thickness and uniformity of deposited or etched thin film |
| JPH10313038A (ja) * | 1997-05-09 | 1998-11-24 | Dainippon Screen Mfg Co Ltd | 基板処理方法及び同装置 |
| TW519709B (en) * | 2000-07-05 | 2003-02-01 | Metryx Linited | Apparatus and method for investigating semiconductor wafers |
| US20040225462A1 (en) * | 2002-12-03 | 2004-11-11 | Renken Wayne Glenn | Integrated process condition sensing wafer and data analysis system |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH474752A (de) * | 1968-01-26 | 1969-06-30 | Wirth Gallo & Co | Elektrischer Massenmesser |
| JPS6120823A (ja) | 1984-07-10 | 1986-01-29 | Kokusai Gijutsu Kaihatsu Kk | 電子秤 |
| JPS61149828A (ja) | 1984-12-25 | 1986-07-08 | Sharp Corp | 重量測定装置 |
| JP3060394B2 (ja) * | 1991-08-30 | 2000-07-10 | 大日本スクリーン製造株式会社 | 表面処理装置 |
| JP2913962B2 (ja) * | 1991-11-27 | 1999-06-28 | 株式会社島津製作所 | 板状試料測定用天びん |
| JP2647585B2 (ja) * | 1991-11-28 | 1997-08-27 | 三菱電機株式会社 | 自動薄膜計測装置 |
| JP2688554B2 (ja) * | 1992-01-22 | 1997-12-10 | 株式会社日立製作所 | ウェハ異常検知装置及びウェハ検査方法 |
| JPH05248926A (ja) | 1992-03-10 | 1993-09-28 | Shimadzu Corp | 質量変化測定装置 |
| JP2576338B2 (ja) | 1992-07-31 | 1997-01-29 | 株式会社島津製作所 | ウエハ自動秤量システム |
| JP2978696B2 (ja) * | 1993-11-09 | 1999-11-15 | 九州日本電気株式会社 | 半導体ウェハー破損検出方法 |
| JP3324235B2 (ja) * | 1993-11-10 | 2002-09-17 | 株式会社日立製作所 | 加工物の研磨方法及びその研磨装置並びにそれを用いた半導体基板 |
| EP0674158A3 (en) | 1994-03-22 | 1995-11-22 | Kito Engineering 1992 Ltd | Method and device for mass measurement. |
| JP3625617B2 (ja) * | 1997-06-10 | 2005-03-02 | 東京エレクトロン株式会社 | 基板処理装置、カセット内の基板検出装置 |
| JP2974069B2 (ja) * | 1997-09-25 | 1999-11-08 | イノテック株式会社 | 半導体デバイスの製造装置 |
| JPH11195694A (ja) | 1997-12-26 | 1999-07-21 | Kokusai Electric Co Ltd | 基板枚数計測方法及び半導体製造装置 |
| JP4212713B2 (ja) * | 1999-03-19 | 2009-01-21 | シャープ株式会社 | 搬送装置 |
| JP3015021B1 (ja) | 1999-03-05 | 2000-02-28 | 株式会社半導体先端テクノロジーズ | 膨潤性薄膜評価方法および膨潤性薄膜用マイクロバランスシステム |
| JP2001118762A (ja) | 1999-10-18 | 2001-04-27 | Matsushita Electronics Industry Corp | 半導体装置の製造方法および半導体装置の製造装置 |
| GB2404787B (en) | 2000-07-05 | 2005-04-13 | Metryx Ltd | Apparatus and method for investigating semiconductor wafers |
| JP3939101B2 (ja) * | 2000-12-04 | 2007-07-04 | 株式会社荏原製作所 | 基板搬送方法および基板搬送容器 |
| KR20020081726A (ko) * | 2001-04-19 | 2002-10-30 | 삼성전자 주식회사 | 웨이퍼 수량측정장치 |
| JP4001469B2 (ja) * | 2001-06-19 | 2007-10-31 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP2003322625A (ja) * | 2002-04-30 | 2003-11-14 | Hitachi Electronics Eng Co Ltd | 半導体チップ検査方法及び半導体チップ検査装置 |
| US6902647B2 (en) * | 2002-08-29 | 2005-06-07 | Asm International N.V. | Method of processing substrates with integrated weighing steps |
| JP2004103761A (ja) * | 2002-09-09 | 2004-04-02 | Renesas Technology Corp | 半導体装置製造ライン |
| CN1764498A (zh) * | 2003-01-22 | 2006-04-26 | 瓦斯特能量系统有限公司 | 反应器 |
| JP2007208064A (ja) | 2006-02-02 | 2007-08-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
-
2008
- 2008-03-11 GB GBGB0804499.2A patent/GB0804499D0/en not_active Ceased
-
2009
- 2009-03-10 US US12/921,972 patent/US9349624B2/en not_active Expired - Fee Related
- 2009-03-10 EP EP09719206A patent/EP2257967A1/en not_active Withdrawn
- 2009-03-10 WO PCT/GB2009/000646 patent/WO2009112821A1/en not_active Ceased
- 2009-03-10 JP JP2010550254A patent/JP5646349B2/ja not_active Expired - Fee Related
- 2009-03-11 TW TW098107916A patent/TWI496228B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888994A (en) * | 1987-11-18 | 1989-12-26 | Tel Sagami Limited | Method of carrying objects into and from a furnace, and apparatus for carrying objects into and from a furnace |
| US5625170A (en) * | 1994-01-18 | 1997-04-29 | Nanometrics Incorporated | Precision weighing to monitor the thickness and uniformity of deposited or etched thin film |
| JPH10313038A (ja) * | 1997-05-09 | 1998-11-24 | Dainippon Screen Mfg Co Ltd | 基板処理方法及び同装置 |
| TW519709B (en) * | 2000-07-05 | 2003-02-01 | Metryx Linited | Apparatus and method for investigating semiconductor wafers |
| US20040225462A1 (en) * | 2002-12-03 | 2004-11-11 | Renken Wayne Glenn | Integrated process condition sensing wafer and data analysis system |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110015773A1 (en) | 2011-01-20 |
| EP2257967A1 (en) | 2010-12-08 |
| JP5646349B2 (ja) | 2014-12-24 |
| US9349624B2 (en) | 2016-05-24 |
| TW200947578A (en) | 2009-11-16 |
| WO2009112821A1 (en) | 2009-09-17 |
| GB0804499D0 (en) | 2008-04-16 |
| JP2011514006A (ja) | 2011-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |