JP5641683B2 - １２００℃膜抵抗体 - Google Patents

１２００℃膜抵抗体 Download PDF

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Publication number
JP5641683B2
JP5641683B2 JP2008249692A JP2008249692A JP5641683B2 JP 5641683 B2 JP5641683 B2 JP 5641683B2 JP 2008249692 A JP2008249692 A JP 2008249692A JP 2008249692 A JP2008249692 A JP 2008249692A JP 5641683 B2 JP5641683 B2 JP 5641683B2
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JP
Japan
Prior art keywords
ceramic
intermediate layer
temperature sensor
film
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008249692A
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English (en)
Japanese (ja)
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JP2009085952A (ja
Inventor
ヴィーナント カールハインツ
ヴィーナント カールハインツ
ローゼ トーマス
ローゼ トーマス
ザンダー マルギット
ザンダー マルギット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yageo Nexensos GmbH
Original Assignee
Heraeus Sensor Technology GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40433426&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5641683(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Heraeus Sensor Technology GmbH filed Critical Heraeus Sensor Technology GmbH
Publication of JP2009085952A publication Critical patent/JP2009085952A/ja
Application granted granted Critical
Publication of JP5641683B2 publication Critical patent/JP5641683B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/04—Iron-filament ballast resistors; Other resistors having variable temperature coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
JP2008249692A 2007-09-28 2008-09-29 １２００℃膜抵抗体 Expired - Fee Related JP5641683B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007046900.6A DE102007046900C5 (de) 2007-09-28 2007-09-28 Hochtemperatursensor und ein Verfahren zu dessen Herstellung
DE102007046900.6 2007-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014041721A Division JP5855149B2 (ja) 2007-09-28 2014-03-04 １２００℃膜抵抗体

Publications (2)

Publication Number Publication Date
JP2009085952A JP2009085952A (ja) 2009-04-23
JP5641683B2 true JP5641683B2 (ja) 2014-12-17

Family

ID=40433426

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008249692A Expired - Fee Related JP5641683B2 (ja) 2007-09-28 2008-09-29 １２００℃膜抵抗体
JP2014041721A Expired - Fee Related JP5855149B2 (ja) 2007-09-28 2014-03-04 １２００℃膜抵抗体
JP2015206268A Expired - Fee Related JP5976186B2 (ja) 2007-09-28 2015-10-20 １２００℃膜抵抗体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2014041721A Expired - Fee Related JP5855149B2 (ja) 2007-09-28 2014-03-04 １２００℃膜抵抗体
JP2015206268A Expired - Fee Related JP5976186B2 (ja) 2007-09-28 2015-10-20 １２００℃膜抵抗体

Country Status (5)

Country Link
US (1) US8183974B2 (https=)
JP (3) JP5641683B2 (https=)
KR (1) KR101489001B1 (https=)
DE (1) DE102007046900C5 (https=)
FR (1) FR2921724B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022528224A (ja) * 2019-05-17 2022-06-09 ヘレウス ネクセンソス ゲーエムベーハー 改良型高温センサ

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US8162536B2 (en) * 2008-12-15 2012-04-24 Delphi Technologies, Inc. Combined sensor
DE102009007940B4 (de) * 2009-02-06 2010-11-18 Heraeus Sensor Technology Gmbh Nichtleitfähiges Zirkonoxid
DE102009017676B3 (de) * 2009-04-16 2010-08-05 Heraeus Sensor Technology Gmbh Hochtemperatursensor mit Chipdrähten aus Chromoxid bildender Eisenlegierung
DE102009045794A1 (de) 2009-10-19 2011-04-28 Innovative Sensor Technology Ist Ag Sensor zur Bestimmung mindestens einer physikalischen Prozessgröße
DE102010050315C5 (de) * 2010-11-05 2014-12-04 Danfoss Silicon Power Gmbh Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule
DE102011051845B3 (de) * 2011-07-14 2012-10-25 Heraeus Sensor Technology Gmbh Messwiderstand mit Schutzrahmen
JP5736348B2 (ja) * 2012-06-21 2015-06-17 立山科学工業株式会社 薄膜抵抗体温度センサとその製造方法
DE102012110210B4 (de) * 2012-10-25 2017-06-01 Heraeus Sensor Technology Gmbh Hochtemperaturchip mit hoher Stabilität
JP6404726B2 (ja) 2014-03-07 2018-10-17 日本特殊陶業株式会社 感温素子及び温度センサ
DE102014104219B4 (de) * 2014-03-26 2019-09-12 Heraeus Nexensos Gmbh Keramikträger sowie Sensorelement, Heizelement und Sensormodul jeweils mit einem Keramikträger und Verfahren zur Herstellung eines Keramikträgers
EP3136067B1 (en) * 2014-04-21 2019-01-30 Kyocera Corporation Wiring substrate and temperature sensing element
JP6430910B2 (ja) 2015-08-05 2018-11-28 日本特殊陶業株式会社 感温素子および温度センサ
CN109073479B (zh) * 2016-04-26 2021-02-19 京瓷株式会社 传感器基板以及传感器装置
JP2018066592A (ja) * 2016-10-17 2018-04-26 Koa株式会社 白金温度センサ素子
JP6821384B2 (ja) * 2016-10-17 2021-01-27 Koa株式会社 白金温度センサ素子
DE102017104162A1 (de) 2017-02-28 2018-08-30 Innovative Sensor Technology Ist Ag Sensorelement und thermischer Strömungssensor zur Bestimmung einer physikalischen Größe eines Messmediums
JP2018146404A (ja) * 2017-03-06 2018-09-20 Koa株式会社 温度センサ素子
JP6929126B2 (ja) * 2017-05-16 2021-09-01 Koa株式会社 温度センサ素子
JP6929125B2 (ja) * 2017-05-16 2021-09-01 Koa株式会社 温度センサ素子
DE102018110889A1 (de) * 2017-05-16 2018-11-22 Koa Corporation Temperatursensor-Element
EP3404405A1 (de) * 2017-05-18 2018-11-21 Heraeus Sensor Technology GmbH Sensor zur bestimmung von gasparametern
EP3409467B1 (de) 2017-05-30 2019-07-03 Heraeus Nexensos GmbH Heizer mit einem co-gesinterten mehrschichtenaufbau
US10371581B2 (en) * 2017-06-02 2019-08-06 Sensata Technologies, Inc. Alumina diffusion barrier for sensing elements
DE102017222495A1 (de) 2017-12-12 2019-06-13 Heraeus Sensor Technology Gmbh Sensor mit thermoschockbeständigem Substrat
DE102018101419A1 (de) * 2018-01-23 2019-07-25 Biotronik Se & Co. Kg Elektrischer Widerstand, insbesondere für medizinische Implantate
DE102019113127A1 (de) * 2019-05-17 2020-11-19 Georg Bernitz Messfühler
US20210247218A1 (en) * 2020-02-10 2021-08-12 Hutchinson Technology Incorporated Systems And Methods To Increase Sensor Robustness
CN112268632B (zh) * 2020-10-19 2022-11-04 中国电子科技集团公司第四十九研究所 一种温度系数可调的耐1000℃高温金属薄膜热电阻及其制备方法
CN113529037A (zh) * 2021-07-19 2021-10-22 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 一种铂薄膜温度传感器的封装方法
EP4470980A1 (de) * 2023-06-02 2024-12-04 Yageo Nexensos GmbH Temperatursensor mit fixiertropfen und runden poren (rohs)
EP4470979A1 (de) * 2023-06-02 2024-12-04 Yageo Nexensos GmbH Brechbarer temperatursensor mit rohs konformem fixiertropfen
DE102023126209A1 (de) 2023-09-27 2025-03-27 Innovative Sensor Technology Ist Ag Vorrichtung zum Erfassen der Temperatur eines Mediums oder zum Heizen des Mediums und Herstellungsverfahren
CN121068047B (zh) * 2025-11-05 2026-02-24 深圳汇北川科技股份有限公司 一种用于固态电池的抗干扰高稳定性薄膜铂温度传感器

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022528224A (ja) * 2019-05-17 2022-06-09 ヘレウス ネクセンソス ゲーエムベーハー 改良型高温センサ
JP7098069B2 (ja) 2019-05-17 2022-07-08 ヘレウス ネクセンソス ゲーエムベーハー 改良型高温センサ

Also Published As

Publication number Publication date
JP5855149B2 (ja) 2016-02-09
DE102007046900B4 (de) 2011-07-21
US8183974B2 (en) 2012-05-22
JP2009085952A (ja) 2009-04-23
KR101489001B1 (ko) 2015-02-02
JP5976186B2 (ja) 2016-08-23
JP2016011964A (ja) 2016-01-21
DE102007046900A1 (de) 2009-04-30
FR2921724A1 (fr) 2009-04-03
FR2921724B1 (fr) 2014-03-21
DE102007046900C5 (de) 2018-07-26
JP2014132272A (ja) 2014-07-17
KR20090033131A (ko) 2009-04-01
US20090115567A1 (en) 2009-05-07

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