DE102007046900C5 - Hochtemperatursensor und ein Verfahren zu dessen Herstellung - Google Patents

Hochtemperatursensor und ein Verfahren zu dessen Herstellung Download PDF

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Publication number
DE102007046900C5
DE102007046900C5 DE102007046900.6A DE102007046900A DE102007046900C5 DE 102007046900 C5 DE102007046900 C5 DE 102007046900C5 DE 102007046900 A DE102007046900 A DE 102007046900A DE 102007046900 C5 DE102007046900 C5 DE 102007046900C5
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Germany
Prior art keywords
ceramic
layer
glass ceramic
intermediate layer
temperature sensor
Prior art date
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DE102007046900.6A
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German (de)
English (en)
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DE102007046900B4 (de
DE102007046900A1 (de
Inventor
Dr. Wienand Karlheinz
Thomas Loose
Margit Sander
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Yageo Nexensos GmbH
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Heraeus Sensor Technology GmbH
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Application filed by Heraeus Sensor Technology GmbH filed Critical Heraeus Sensor Technology GmbH
Priority to DE102007046900.6A priority Critical patent/DE102007046900C5/de
Priority to US12/237,742 priority patent/US8183974B2/en
Priority to KR20080094807A priority patent/KR101489001B1/ko
Priority to FR0856520A priority patent/FR2921724B1/fr
Priority to JP2008249692A priority patent/JP5641683B2/ja
Publication of DE102007046900A1 publication Critical patent/DE102007046900A1/de
Publication of DE102007046900B4 publication Critical patent/DE102007046900B4/de
Priority to JP2014041721A priority patent/JP5855149B2/ja
Priority to JP2015206268A priority patent/JP5976186B2/ja
Publication of DE102007046900C5 publication Critical patent/DE102007046900C5/de
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/04—Iron-filament ballast resistors; Other resistors having variable temperature coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
DE102007046900.6A 2007-09-28 2007-09-28 Hochtemperatursensor und ein Verfahren zu dessen Herstellung Active DE102007046900C5 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102007046900.6A DE102007046900C5 (de) 2007-09-28 2007-09-28 Hochtemperatursensor und ein Verfahren zu dessen Herstellung
US12/237,742 US8183974B2 (en) 2007-09-28 2008-09-25 1200° C. film resistor
KR20080094807A KR101489001B1 (ko) 2007-09-28 2008-09-26 1200℃ 피막 저항기
JP2008249692A JP5641683B2 (ja) 2007-09-28 2008-09-29 １２００℃膜抵抗体
FR0856520A FR2921724B1 (fr) 2007-09-28 2008-09-29 Procede de production d'un capteur de haute temperature, puce de capteur de haute temperature obtenue et son utilisation
JP2014041721A JP5855149B2 (ja) 2007-09-28 2014-03-04 １２００℃膜抵抗体
JP2015206268A JP5976186B2 (ja) 2007-09-28 2015-10-20 １２００℃膜抵抗体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007046900.6A DE102007046900C5 (de) 2007-09-28 2007-09-28 Hochtemperatursensor und ein Verfahren zu dessen Herstellung

Publications (3)

Publication Number Publication Date
DE102007046900A1 DE102007046900A1 (de) 2009-04-30
DE102007046900B4 DE102007046900B4 (de) 2011-07-21
DE102007046900C5 true DE102007046900C5 (de) 2018-07-26

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Application Number Title Priority Date Filing Date
DE102007046900.6A Active DE102007046900C5 (de) 2007-09-28 2007-09-28 Hochtemperatursensor und ein Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (1) US8183974B2 (https=)
JP (3) JP5641683B2 (https=)
KR (1) KR101489001B1 (https=)
DE (1) DE102007046900C5 (https=)
FR (1) FR2921724B1 (https=)

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US8162536B2 (en) * 2008-12-15 2012-04-24 Delphi Technologies, Inc. Combined sensor
DE102009007940B4 (de) * 2009-02-06 2010-11-18 Heraeus Sensor Technology Gmbh Nichtleitfähiges Zirkonoxid
DE102009017676B3 (de) * 2009-04-16 2010-08-05 Heraeus Sensor Technology Gmbh Hochtemperatursensor mit Chipdrähten aus Chromoxid bildender Eisenlegierung
DE102009045794A1 (de) 2009-10-19 2011-04-28 Innovative Sensor Technology Ist Ag Sensor zur Bestimmung mindestens einer physikalischen Prozessgröße
DE102010050315C5 (de) * 2010-11-05 2014-12-04 Danfoss Silicon Power Gmbh Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule
DE102011051845B3 (de) * 2011-07-14 2012-10-25 Heraeus Sensor Technology Gmbh Messwiderstand mit Schutzrahmen
JP5736348B2 (ja) * 2012-06-21 2015-06-17 立山科学工業株式会社 薄膜抵抗体温度センサとその製造方法
DE102012110210B4 (de) * 2012-10-25 2017-06-01 Heraeus Sensor Technology Gmbh Hochtemperaturchip mit hoher Stabilität
JP6404726B2 (ja) 2014-03-07 2018-10-17 日本特殊陶業株式会社 感温素子及び温度センサ
DE102014104219B4 (de) * 2014-03-26 2019-09-12 Heraeus Nexensos Gmbh Keramikträger sowie Sensorelement, Heizelement und Sensormodul jeweils mit einem Keramikträger und Verfahren zur Herstellung eines Keramikträgers
EP3136067B1 (en) * 2014-04-21 2019-01-30 Kyocera Corporation Wiring substrate and temperature sensing element
JP6430910B2 (ja) 2015-08-05 2018-11-28 日本特殊陶業株式会社 感温素子および温度センサ
CN109073479B (zh) * 2016-04-26 2021-02-19 京瓷株式会社 传感器基板以及传感器装置
JP2018066592A (ja) * 2016-10-17 2018-04-26 Koa株式会社 白金温度センサ素子
JP6821384B2 (ja) * 2016-10-17 2021-01-27 Koa株式会社 白金温度センサ素子
DE102017104162A1 (de) 2017-02-28 2018-08-30 Innovative Sensor Technology Ist Ag Sensorelement und thermischer Strömungssensor zur Bestimmung einer physikalischen Größe eines Messmediums
JP2018146404A (ja) * 2017-03-06 2018-09-20 Koa株式会社 温度センサ素子
JP6929126B2 (ja) * 2017-05-16 2021-09-01 Koa株式会社 温度センサ素子
JP6929125B2 (ja) * 2017-05-16 2021-09-01 Koa株式会社 温度センサ素子
DE102018110889A1 (de) * 2017-05-16 2018-11-22 Koa Corporation Temperatursensor-Element
EP3404405A1 (de) * 2017-05-18 2018-11-21 Heraeus Sensor Technology GmbH Sensor zur bestimmung von gasparametern
EP3409467B1 (de) 2017-05-30 2019-07-03 Heraeus Nexensos GmbH Heizer mit einem co-gesinterten mehrschichtenaufbau
US10371581B2 (en) * 2017-06-02 2019-08-06 Sensata Technologies, Inc. Alumina diffusion barrier for sensing elements
DE102017222495A1 (de) 2017-12-12 2019-06-13 Heraeus Sensor Technology Gmbh Sensor mit thermoschockbeständigem Substrat
DE102018101419A1 (de) * 2018-01-23 2019-07-25 Biotronik Se & Co. Kg Elektrischer Widerstand, insbesondere für medizinische Implantate
DE202019002164U1 (de) 2019-05-17 2019-06-21 Heraeus Nexensos Gmbh Verbesserter Hochtemperaturchip
DE102019113127A1 (de) * 2019-05-17 2020-11-19 Georg Bernitz Messfühler
US20210247218A1 (en) * 2020-02-10 2021-08-12 Hutchinson Technology Incorporated Systems And Methods To Increase Sensor Robustness
CN112268632B (zh) * 2020-10-19 2022-11-04 中国电子科技集团公司第四十九研究所 一种温度系数可调的耐1000℃高温金属薄膜热电阻及其制备方法
CN113529037A (zh) * 2021-07-19 2021-10-22 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 一种铂薄膜温度传感器的封装方法
EP4470980A1 (de) * 2023-06-02 2024-12-04 Yageo Nexensos GmbH Temperatursensor mit fixiertropfen und runden poren (rohs)
EP4470979A1 (de) * 2023-06-02 2024-12-04 Yageo Nexensos GmbH Brechbarer temperatursensor mit rohs konformem fixiertropfen
DE102023126209A1 (de) 2023-09-27 2025-03-27 Innovative Sensor Technology Ist Ag Vorrichtung zum Erfassen der Temperatur eines Mediums oder zum Heizen des Mediums und Herstellungsverfahren
CN121068047B (zh) * 2025-11-05 2026-02-24 深圳汇北川科技股份有限公司 一种用于固态电池的抗干扰高稳定性薄膜铂温度传感器

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EP1619485A1 (de) 2004-02-24 2006-01-25 Electrovac, Fabrikation elektrotechnischer Spezialartikel Gesellschaft m.b.H. Temperaturmessfühler
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DE102007038680A1 (de) 2007-08-15 2009-02-26 Heraeus Sensor Technology Gmbh Rußsensor mit glatter, reiner Al2O3-Oberfläche

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JP5855149B2 (ja) 2016-02-09
DE102007046900B4 (de) 2011-07-21
US8183974B2 (en) 2012-05-22
JP2009085952A (ja) 2009-04-23
KR101489001B1 (ko) 2015-02-02
JP5976186B2 (ja) 2016-08-23
JP2016011964A (ja) 2016-01-21
DE102007046900A1 (de) 2009-04-30
FR2921724A1 (fr) 2009-04-03
FR2921724B1 (fr) 2014-03-21
JP5641683B2 (ja) 2014-12-17
JP2014132272A (ja) 2014-07-17
KR20090033131A (ko) 2009-04-01
US20090115567A1 (en) 2009-05-07

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