FR2921724B1 - Procede de production d'un capteur de haute temperature, puce de capteur de haute temperature obtenue et son utilisation - Google Patents
Procede de production d'un capteur de haute temperature, puce de capteur de haute temperature obtenue et son utilisationInfo
- Publication number
- FR2921724B1 FR2921724B1 FR0856520A FR0856520A FR2921724B1 FR 2921724 B1 FR2921724 B1 FR 2921724B1 FR 0856520 A FR0856520 A FR 0856520A FR 0856520 A FR0856520 A FR 0856520A FR 2921724 B1 FR2921724 B1 FR 2921724B1
- Authority
- FR
- France
- Prior art keywords
- high temperature
- temperature sensor
- producing
- chip obtained
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
- H01C3/04—Iron-filament ballast resistors; Other resistors having variable temperature coefficient
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/10—Protective devices, e.g. casings for preventing chemical attack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
- H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007046900.6A DE102007046900C5 (de) | 2007-09-28 | 2007-09-28 | Hochtemperatursensor und ein Verfahren zu dessen Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2921724A1 FR2921724A1 (fr) | 2009-04-03 |
| FR2921724B1 true FR2921724B1 (fr) | 2014-03-21 |
Family
ID=40433426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0856520A Active FR2921724B1 (fr) | 2007-09-28 | 2008-09-29 | Procede de production d'un capteur de haute temperature, puce de capteur de haute temperature obtenue et son utilisation |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8183974B2 (https=) |
| JP (3) | JP5641683B2 (https=) |
| KR (1) | KR101489001B1 (https=) |
| DE (1) | DE102007046900C5 (https=) |
| FR (1) | FR2921724B1 (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8162536B2 (en) * | 2008-12-15 | 2012-04-24 | Delphi Technologies, Inc. | Combined sensor |
| DE102009007940B4 (de) * | 2009-02-06 | 2010-11-18 | Heraeus Sensor Technology Gmbh | Nichtleitfähiges Zirkonoxid |
| DE102009017676B3 (de) * | 2009-04-16 | 2010-08-05 | Heraeus Sensor Technology Gmbh | Hochtemperatursensor mit Chipdrähten aus Chromoxid bildender Eisenlegierung |
| DE102009045794A1 (de) | 2009-10-19 | 2011-04-28 | Innovative Sensor Technology Ist Ag | Sensor zur Bestimmung mindestens einer physikalischen Prozessgröße |
| DE102010050315C5 (de) * | 2010-11-05 | 2014-12-04 | Danfoss Silicon Power Gmbh | Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule |
| DE102011051845B3 (de) * | 2011-07-14 | 2012-10-25 | Heraeus Sensor Technology Gmbh | Messwiderstand mit Schutzrahmen |
| JP5736348B2 (ja) * | 2012-06-21 | 2015-06-17 | 立山科学工業株式会社 | 薄膜抵抗体温度センサとその製造方法 |
| DE102012110210B4 (de) * | 2012-10-25 | 2017-06-01 | Heraeus Sensor Technology Gmbh | Hochtemperaturchip mit hoher Stabilität |
| JP6404726B2 (ja) | 2014-03-07 | 2018-10-17 | 日本特殊陶業株式会社 | 感温素子及び温度センサ |
| DE102014104219B4 (de) * | 2014-03-26 | 2019-09-12 | Heraeus Nexensos Gmbh | Keramikträger sowie Sensorelement, Heizelement und Sensormodul jeweils mit einem Keramikträger und Verfahren zur Herstellung eines Keramikträgers |
| EP3136067B1 (en) * | 2014-04-21 | 2019-01-30 | Kyocera Corporation | Wiring substrate and temperature sensing element |
| JP6430910B2 (ja) | 2015-08-05 | 2018-11-28 | 日本特殊陶業株式会社 | 感温素子および温度センサ |
| CN109073479B (zh) * | 2016-04-26 | 2021-02-19 | 京瓷株式会社 | 传感器基板以及传感器装置 |
| JP2018066592A (ja) * | 2016-10-17 | 2018-04-26 | Koa株式会社 | 白金温度センサ素子 |
| JP6821384B2 (ja) * | 2016-10-17 | 2021-01-27 | Koa株式会社 | 白金温度センサ素子 |
| DE102017104162A1 (de) | 2017-02-28 | 2018-08-30 | Innovative Sensor Technology Ist Ag | Sensorelement und thermischer Strömungssensor zur Bestimmung einer physikalischen Größe eines Messmediums |
| JP2018146404A (ja) * | 2017-03-06 | 2018-09-20 | Koa株式会社 | 温度センサ素子 |
| JP6929126B2 (ja) * | 2017-05-16 | 2021-09-01 | Koa株式会社 | 温度センサ素子 |
| JP6929125B2 (ja) * | 2017-05-16 | 2021-09-01 | Koa株式会社 | 温度センサ素子 |
| DE102018110889A1 (de) * | 2017-05-16 | 2018-11-22 | Koa Corporation | Temperatursensor-Element |
| EP3404405A1 (de) * | 2017-05-18 | 2018-11-21 | Heraeus Sensor Technology GmbH | Sensor zur bestimmung von gasparametern |
| EP3409467B1 (de) | 2017-05-30 | 2019-07-03 | Heraeus Nexensos GmbH | Heizer mit einem co-gesinterten mehrschichtenaufbau |
| US10371581B2 (en) * | 2017-06-02 | 2019-08-06 | Sensata Technologies, Inc. | Alumina diffusion barrier for sensing elements |
| DE102017222495A1 (de) | 2017-12-12 | 2019-06-13 | Heraeus Sensor Technology Gmbh | Sensor mit thermoschockbeständigem Substrat |
| DE102018101419A1 (de) * | 2018-01-23 | 2019-07-25 | Biotronik Se & Co. Kg | Elektrischer Widerstand, insbesondere für medizinische Implantate |
| DE202019002164U1 (de) | 2019-05-17 | 2019-06-21 | Heraeus Nexensos Gmbh | Verbesserter Hochtemperaturchip |
| DE102019113127A1 (de) * | 2019-05-17 | 2020-11-19 | Georg Bernitz | Messfühler |
| US20210247218A1 (en) * | 2020-02-10 | 2021-08-12 | Hutchinson Technology Incorporated | Systems And Methods To Increase Sensor Robustness |
| CN112268632B (zh) * | 2020-10-19 | 2022-11-04 | 中国电子科技集团公司第四十九研究所 | 一种温度系数可调的耐1000℃高温金属薄膜热电阻及其制备方法 |
| CN113529037A (zh) * | 2021-07-19 | 2021-10-22 | 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 | 一种铂薄膜温度传感器的封装方法 |
| EP4470980A1 (de) * | 2023-06-02 | 2024-12-04 | Yageo Nexensos GmbH | Temperatursensor mit fixiertropfen und runden poren (rohs) |
| EP4470979A1 (de) * | 2023-06-02 | 2024-12-04 | Yageo Nexensos GmbH | Brechbarer temperatursensor mit rohs konformem fixiertropfen |
| DE102023126209A1 (de) | 2023-09-27 | 2025-03-27 | Innovative Sensor Technology Ist Ag | Vorrichtung zum Erfassen der Temperatur eines Mediums oder zum Heizen des Mediums und Herstellungsverfahren |
| CN121068047B (zh) * | 2025-11-05 | 2026-02-24 | 深圳汇北川科技股份有限公司 | 一种用于固态电池的抗干扰高稳定性薄膜铂温度传感器 |
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| KR100422333B1 (ko) | 2000-07-31 | 2004-03-10 | 이노스텍 (주) | 단결정 거대 입자로 구성된 금속 박막 제조 방법 및 그 금속 박막 |
| JP4016627B2 (ja) | 2000-11-22 | 2007-12-05 | 株式会社デンソー | 温度センサ |
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| US7106167B2 (en) * | 2002-06-28 | 2006-09-12 | Heetronix | Stable high temperature sensor system with tungsten on AlN |
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| JP4221565B2 (ja) * | 2002-11-14 | 2009-02-12 | 明陽電機株式会社 | 耐熱耐振型温度センサ |
| DE10358282A1 (de) | 2003-12-12 | 2005-07-28 | Georg Bernitz | Bauelement und Verfahren zu dessen Herstellung |
| ATE367573T1 (de) | 2004-02-24 | 2007-08-15 | Electrovac | Temperaturmessfühler |
| JP4168035B2 (ja) * | 2004-03-08 | 2008-10-22 | 日本特殊陶業株式会社 | 白金抵抗体式温度センサ |
| DE102004034185B3 (de) | 2004-07-15 | 2006-01-05 | Zitzmann, Heinrich, Dr. | Temperaturfühler und Verfahren zu dessen Herstellung |
| JP4253642B2 (ja) * | 2005-02-25 | 2009-04-15 | 日本特殊陶業株式会社 | 温度センサ |
| DE102007038680A1 (de) | 2007-08-15 | 2009-02-26 | Heraeus Sensor Technology Gmbh | Rußsensor mit glatter, reiner Al2O3-Oberfläche |
-
2007
- 2007-09-28 DE DE102007046900.6A patent/DE102007046900C5/de active Active
-
2008
- 2008-09-25 US US12/237,742 patent/US8183974B2/en active Active
- 2008-09-26 KR KR20080094807A patent/KR101489001B1/ko active Active
- 2008-09-29 JP JP2008249692A patent/JP5641683B2/ja not_active Expired - Fee Related
- 2008-09-29 FR FR0856520A patent/FR2921724B1/fr active Active
-
2014
- 2014-03-04 JP JP2014041721A patent/JP5855149B2/ja not_active Expired - Fee Related
-
2015
- 2015-10-20 JP JP2015206268A patent/JP5976186B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5855149B2 (ja) | 2016-02-09 |
| DE102007046900B4 (de) | 2011-07-21 |
| US8183974B2 (en) | 2012-05-22 |
| JP2009085952A (ja) | 2009-04-23 |
| KR101489001B1 (ko) | 2015-02-02 |
| JP5976186B2 (ja) | 2016-08-23 |
| JP2016011964A (ja) | 2016-01-21 |
| DE102007046900A1 (de) | 2009-04-30 |
| FR2921724A1 (fr) | 2009-04-03 |
| JP5641683B2 (ja) | 2014-12-17 |
| DE102007046900C5 (de) | 2018-07-26 |
| JP2014132272A (ja) | 2014-07-17 |
| KR20090033131A (ko) | 2009-04-01 |
| US20090115567A1 (en) | 2009-05-07 |
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