FR2910701B1 - Module de puce et son procede de production - Google Patents

Module de puce et son procede de production

Info

Publication number
FR2910701B1
FR2910701B1 FR0708718A FR0708718A FR2910701B1 FR 2910701 B1 FR2910701 B1 FR 2910701B1 FR 0708718 A FR0708718 A FR 0708718A FR 0708718 A FR0708718 A FR 0708718A FR 2910701 B1 FR2910701 B1 FR 2910701B1
Authority
FR
France
Prior art keywords
producing
same
chip module
chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0708718A
Other languages
English (en)
Other versions
FR2910701A1 (fr
Inventor
Hipper Andreas Muller
Frank Puschner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of FR2910701A1 publication Critical patent/FR2910701A1/fr
Application granted granted Critical
Publication of FR2910701B1 publication Critical patent/FR2910701B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
FR0708718A 2006-12-20 2007-12-14 Module de puce et son procede de production Expired - Fee Related FR2910701B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006060411A DE102006060411B3 (de) 2006-12-20 2006-12-20 Chipmodul und Verfahren zur Herstellung eines Chipmoduls

Publications (2)

Publication Number Publication Date
FR2910701A1 FR2910701A1 (fr) 2008-06-27
FR2910701B1 true FR2910701B1 (fr) 2014-05-09

Family

ID=39477917

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0708718A Expired - Fee Related FR2910701B1 (fr) 2006-12-20 2007-12-14 Module de puce et son procede de production

Country Status (3)

Country Link
US (1) US7714454B2 (fr)
DE (1) DE102006060411B3 (fr)
FR (1) FR2910701B1 (fr)

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JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8354304B2 (en) * 2008-12-05 2013-01-15 Stats Chippac, Ltd. Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
EP2712491B1 (fr) 2011-05-27 2019-12-04 Mc10, Inc. Structure électronique flexible
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
WO2013022853A1 (fr) 2011-08-05 2013-02-14 Mc10, Inc. Procédés de ballonnets de cathéter et appareil utilisant des éléments de détection
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
JP2015521894A (ja) 2012-07-05 2015-08-03 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 流量センシングを含むカテーテルデバイス
JP2016500869A (ja) 2012-10-09 2016-01-14 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 衣類と一体化されたコンフォーマル電子回路
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
DE102013104567A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Chipanordnung, Chipkartenanordnung und Verfahren zum Herstellen einer Chipanordnung
WO2014182239A1 (fr) 2013-05-07 2014-11-13 Smartflex Technology Pte Ltd Modules de cartes à puce ultra-minces ayant des bosses de connexion disposées dans des vias d'un substrat et procédés de fabrications de ceux-ci
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
JP2016532468A (ja) 2013-10-07 2016-10-20 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 検知および分析のためのコンフォーマルセンサシステム
US9949691B2 (en) 2013-11-22 2018-04-24 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
EP3079624A1 (fr) * 2013-12-11 2016-10-19 Caretag Surgical ApS Fixation et protection d'une étiquette d'identification électronique
CN105874606B (zh) 2014-01-06 2021-01-12 Mc10股份有限公司 包封适形电子系统和器件及其制作和使用方法
EP3114911B1 (fr) 2014-03-04 2023-05-03 Medidata Solutions, Inc. Boîtier d'encapsulation souple en plusieurs parties pour dispositifs électroniques
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
EP3258837A4 (fr) 2015-02-20 2018-10-10 Mc10, Inc. Détection et configuration automatiques de dispositifs à porter sur soi sur la base d'un état, d'un emplacement et/ou d'une orientation sur le corps
US10398343B2 (en) 2015-03-02 2019-09-03 Mc10, Inc. Perspiration sensor
WO2017015000A1 (fr) 2015-07-17 2017-01-26 Mc10, Inc. Raidisseur conducteur, procédé de fabrication d'un raidisseur conducteur, ainsi qu'adhésif conducteur et couches d'encapsulation
WO2017031129A1 (fr) 2015-08-19 2017-02-23 Mc10, Inc. Dispositifs de flux de chaleur portables et procédés d'utilisation
WO2017059215A1 (fr) 2015-10-01 2017-04-06 Mc10, Inc. Procédé et système d'interaction avec un environnement virtuel
WO2017062508A1 (fr) 2015-10-05 2017-04-13 Mc10, Inc. Procédé et système de neuromodulation et de stimulation
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
WO2017147053A1 (fr) 2016-02-22 2017-08-31 Mc10, Inc. Système, dispositif et procédé pour acquisition sur le corps de nœud de capteur et de concentrateur couplés d'informations de capteur
WO2017184705A1 (fr) 2016-04-19 2017-10-26 Mc10, Inc. Procédé et système de mesure de transpiration
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
CN108198764B (zh) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 电子元器件制造方法
US20210134757A1 (en) * 2019-11-04 2021-05-06 Xilinx, Inc. Fanout integration for stacked silicon package assembly

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Also Published As

Publication number Publication date
US20080211087A1 (en) 2008-09-04
US7714454B2 (en) 2010-05-11
FR2910701A1 (fr) 2008-06-27
DE102006060411B3 (de) 2008-07-10

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