JP5593018B2 - コンプライアンスを有する超小型電子アセンブリ - Google Patents
コンプライアンスを有する超小型電子アセンブリ Download PDFInfo
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- JP5593018B2 JP5593018B2 JP2007557186A JP2007557186A JP5593018B2 JP 5593018 B2 JP5593018 B2 JP 5593018B2 JP 2007557186 A JP2007557186 A JP 2007557186A JP 2007557186 A JP2007557186 A JP 2007557186A JP 5593018 B2 JP5593018 B2 JP 5593018B2
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Description
本出願は、2005年2月25日に出願された米国仮特許出願第60/656,480号の出願日の利益を主張し、本開示を参照により本明細書に組み込む。
本発明は、ウェーハレベル及び半導体チップのパッケージングに関する。より具体的には、本発明は、改良されたコンプライアントなウェーハ及びコンプライアントな半導体パッケージ構造及びそれらを形成及び検査する方法に関する。
Claims (44)
- 第1の面と、前記第1の面においてアクセス可能なコンタクトとを有するマイクロエレクトロニクス素子と、
前記マイクロエレクトロニクス素子の前記第1の面の一部分を覆うコンプライアントな層であって、前記第1の面から離間した上部面と、前記上部面から離れる方向に伸びる傾斜遷移面とを有し、少なくとも1つの前記コンタクトの少なくとも一部分が、前記コンプライアントな層の前記傾斜遷移面を超えて露出されている、コンプライアントな層と、
前記コンプライアントな層の前記傾斜遷移面と前記上部面とに沿って伸び、前記コンタクトに接続されている導電性トレースと、
前記コンプライアントな層の上にあり、かつ前記マイクロエレクトロニクス素子の前記第1の面から突出する複数の硬い金属ポストであって、前記硬い金属ポストは前記コンタクトから離れて配置され、前記硬い金属ポストの各々は、前記導電性トレースのうちの1つのトレースから直接伸びかつ前記トレースの高さを超えて該ポストの高さへと伸びるモノリシック金属層を有し、前記モノリシック金属層は、銅、銅合金、金およびこれらの組合せ、およびニッケルからなる群から選択された少なくとも1つの金属から構成され、前記硬い金属ポストの各々は、前記コンプライアントな層に隣接するベースと、前記コンプライアントな層から離れている先端部とを有し、前記ベースは前記コンプライアントな層の面に沿った幅を有し、該幅は前記硬い金属ポストのその他の部分の幅以下である、複数の硬い金属ポストと、
前記導電性トレースの部分を覆い、露出上部面と開口部とを有しているはんだマスクであって、前記硬い金属ポストが前記開口部を介して前記露出上部面の上の高さまで伸びている、はんだマスクと、
を備え、
前記はんだマスクは、前記マイクロエレクトロニクス素子の前記第1の面の上の前記はんだマスクの前記上部面の高さが前記コンプライアントな層の形状によって変化するようなコンフォーマルな層である、
マイクロエレクトロニクスアセンブリ。 - 前記硬い金属ポストの前記先端部が、前記アセンブリ上で最も高い箇所を画定する、請
求項1に記載のアセンブリ。 - 前記コンプライアントな層が、前記マイクロエレクトロニクス素子の前記コンタクトと実質的に位置合わせされた開口部を有する、請求項1に記載のアセンブリ。
- 前記導電性トレースが、前記コンプライアントな層の前記開口部を通過して、前記硬い金属ポストと前記マイクロエレクトロニクス素子の前記コンタクトとを導電的に相互接続する、請求項3に記載のアセンブリ。
- 前記マイクロエレクトロニクス素子が半導体ウェーハである、請求項1に記載のアセンブリ。
- 前記マイクロエレクトロニクス素子が半導体チップである、請求項1に記載のアセンブリ。
- 前記マイクロエレクトロニクス素子の前記第1の面と前記コンプライアントな層との間に配置された絶縁保護層をさらに備える、請求項1に記載のアセンブリ。
- 前記コンプライアントな層が誘電性材料を備える、請求項1に記載のアセンブリ。
- 前記コンプライアントな層は、シリコーン、エポキシ、ポリイミド、熱硬化性ポリマー、フッ素重合体及び熱可塑性ポリマーからなる群から選択された材料を備える、請求項1に記載のアセンブリ。
- 前記傾斜遷移面は、前記コンプライアントな層の前記上部面と前記マイクロエレクトロニクス素子の前記第1の面との間に拡がる、請求項1に記載のアセンブリ。
- 前記コンプライアントな層の前記上部面が平坦である、請求項10に記載のアセンブリ。
- 前記傾斜遷移面は、少なくとも1つの湾曲面を含む、請求項11に記載のアセンブリ。
- 前記少なくとも1つの湾曲面は、前記マイクロエレクトロニクス素子の前記第1の面から広がる湾曲面を含む、請求項12に記載のアセンブリ。
- 前記少なくとも1つの湾曲面は、前記コンプライアントな層の前記上部面から伸びる湾曲面を含む、請求項12に記載のアセンブリ。
- 前記導電性トレースは、前記硬い金属ポストと、前記マイクロエレクトロニクス素子の前記コンタクトとを電気的に相互接続する、請求項1に記載のアセンブリ。
- 前記トレースは、銅、金、ニッケル及び合金、これらの組合せ及び複合物からなる群から選択された少なくとも1つの材料を備える、請求項1に記載のアセンブリ。
- 前記導電性トレースが、前記コンプライアントな層の上に伸びている、請求項1に記載のアセンブリ。
- 前記コンプライアントな層は、前記マイクロエレクトロニクス素子の前記第1の面の上にある複数のコンプライアントなバンプを備える、請求項1に記載のアセンブリ。
- 前記導電性ポストのうちの少なくとも1つは、前記コンプライアントなバンプのうちの
少なくとも1つの上に配置されている、請求項18に記載のアセンブリ。 - 前記導電性ポストが、前記コンプライアントなバンプの上に配置されている、請求項18に記載のアセンブリ。
- 前記硬い金属ポストの各々は、50〜300μmの厚さを有する、請求項1に記載のアセンブリ。
- 第1の面と、前記第1の面においてアクセス可能なコンタクトとを有するマイクロエレクトロニクス素子と、
前記マイクロエレクトロニクス素子の前記第1の面の一部分を覆うコンプライアントな層であって、前記マイクロエレクトロニクス素子の前記第1の面から離間した上部面と、前記上部面から離れる方向に伸びる傾斜遷移面とを有し、前記マイクロエレクトロニクス素子の前記第1の面が少なくとも1つの前記コンタクトと前記傾斜遷移面との間に露出されている、コンプライアントな層と、
前記コンプライアントな層の前記上部面の上にあり、かつ前記マイクロエレクトロニクス素子の前記第1の面から突出し、前記コンタクトから離れて配設された複数の導電性ポストと、
前記導電性ポストと、前記マイクロエレクトロニクス素子の前記コンタクトとを電気的に相互接続する細長い導電性要素と、
前記導電性要素の部分を覆い、露出上部面と開口部とを有しているはんだマスクであって、前記導電性ポストが前記開口部を介して前記露出上部面の上の高さまで伸びている、はんだマスクとを備え、
前記導電性ポストの各々は、前記導電性要素のうちの1つの導電性要素から直接延びかつ前記導電性要素の高さを超えて複数の前記ポストの高さへと伸びるモノリシック金属層を有し、前記モノリシック金属層は、銅、銅合金、金およびこれらの組合せ、およびニッケルからなる群から選択された少なくとも1つの金属から構成され、前記モノリシック金属層は、めっき金属層から構成され、かつ前記導電性トレース要素と接触してめっきされ、
前記はんだマスクは、前記マイクロエレクトロニクス素子の前記第1の面の上の前記はんだマスクの前記上部面の高さが前記コンプライアントな層の形状によって変化するようなコンフォーマルな層である、
マイクロエレクトロニクスアセンブリ。 - 前記マイクロエレクトロニクス素子が半導体ウェーハである、請求項22に記載のアセンブリ。
- 前記マイクロエレクトロニクス素子が半導体チップである、請求項22に記載のアセンブリ。
- 前記コンプライアントな層が複数のコンプライアントなバンプを備え、前記導電性ポストの各々は、前記導電性バンプのうちの1つの上に配置されている、請求項22に記載のアセンブリ。
- 前記コンプライアントな層は、前記マイクロエレクトロニクス素子の前記コンタクトと位置合わせされた開口部を有し、前記コンプライアントな層の前記傾斜遷移面は、前記開口部の少なくとも1つの開口部内に配置されかつ前記マイクロエレクトロニクス素子の前記第1の面から前記コンプライアントな層の前記上部面まで伸び、前記細長い導電性要素は、前記コンプライアントな層の前記傾斜遷移面の上にある、請求項22に記載のアセンブリ。
- 第1の面と、前記第1の面においてアクセス可能なコンタクトとを有するマイクロエレクトロニクス素子と、
前記マイクロエレクトロニクス素子の前記第1の面の一部分を覆うコンプライアントな層であって、前記コンプライアントな層は前記コンタクトの少なくとも1つを完全には覆っていない、コンプライアントな層と、
前記コンプライアントな層の上部面で露出され、前記コンタクトと接続している導電性トレースと、
前記導電性トレースの部分を覆い、露出上部面と開口部とを有する誘電体層と、
前記コンプライアントな層の上にあり、かつ前記マイクロエレクトロニクス素子の前記第1の面から突出する複数の硬い金属ポストであって、前記硬い金属ポストは前記トレースと直接接触しており、前記硬い金属ポストの各々は、前記導電性トレースのうちの1つのトレースから直接伸びかつ前記トレースの高さを超えて複数の前記ポストの高さへと伸びるモノリシック金属層を有し、前記モノリシック金属層は、銅、銅合金、金およびこれらの組合せ、およびニッケルからなる群から選択された少なくとも1つの金属から構成されている、複数の硬い金属ポストと、
を備え、
前記硬い金属ポストは、前記開口部を介して前記誘電体層の前記上部面の上の高さまで伸び、
前記誘電体層は、前記マイクロエレクトロニクス素子の前記第1の面の上の前記誘電体層の前記上部面の高さが前記コンプライアントな層の形状によって変化するようなコンフォーマルな層である、マイクロエレクトロニクスアセンブリ。 - 前記モノリシック金属層は、銅および銅合金からなる群から選択された少なくとも1つの金属から構成されている、請求項1に記載のアセンブリ。
- 前記モノリシック金属層は、銅および銅合金からなる群から選択された少なくとも1つの金属から構成されている、請求項22に記載のアセンブリ。
- 前記モノリシック金属層は、銅および銅合金からなる群から選択された少なくとも1つの金属から構成されている、請求項27に記載のアセンブリ。
- 前記モノリシック金属層は、めっき金属層から構成され、前記トレースと接触してめっきされる、請求項1に記載のアセンブリ。
- 前記モノリシック金属層は、めっき金属層から構成され、前記トレースと接触してめっきされる、請求項27に記載のアセンブリ。
- 前記硬い金属ポストの前記先端部は、前記ポストの前記それぞれのベースの幅と等しい幅を有している、請求項1に記載のアセンブリ。
- 前記コンプライアントな層から離れている前記導電性ポストの先端部は、前記コンプライアントな層に隣接する前記ポストのベースの幅と等しい幅を有している、請求項22に記載のアセンブリ。
- 前記コンプライアントな層から離れている前記硬い金属ポストの先端部は、前記コンプライアントな層に隣接する前記ポストのベースの幅と等しい幅を有している、請求項27に記載のアセンブリ。
- 前記硬い金属ポストの少なくとも1つの前記先端部は、前記少なくとも1つのポストの前記ベースの幅と等しい幅を有している、請求項1に記載のアセンブリ。
- 前記コンプライアントな層から離れている前記導電性ポストの少なくとも1つの先端部は、前記コンプライアントな層に隣接する前記少なくとも1つのポストのベースの幅と等しい幅を有している、請求項22に記載のアセンブリ。
- 前記コンプライアントな層から離れている前記硬い金属ポストの少なくとも1つの先端部は、前記コンプライアントな層に隣接する前記少なくとも1つのポストのベースの幅と等しい幅を有している、請求項27に記載のアセンブリ。
- 前記モノリシック金属層は、前記トレースから少なくとも垂直方向に伸びる真っ直ぐな縁部を有している、請求項1に記載のアセンブリ。
- 前記モノリシック金属層は、前記導電性要素から少なくとも垂直方向に伸びる真っ直ぐな縁部を有している、請求項22に記載のアセンブリ。
- 前記モノリシック金属層は、前記トレースから少なくとも垂直方向に伸びる真っ直ぐな縁部を有している、請求項27に記載のアセンブリ。
- 前記モノリシック金属層の縁部は垂直方向に伸びる、請求項1に記載のアセンブリ。
- 前記モノリシック金属層の縁部は垂直方向に伸びる、請求項22に記載のアセンブリ。
- 前記モノリシック金属層の縁部は垂直方向に伸びる、請求項27に記載のアセンブリ。
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- 2006-02-23 JP JP2007557186A patent/JP5593018B2/ja not_active Expired - Fee Related
- 2006-02-23 EP EP06721033.6A patent/EP1851798B1/en not_active Not-in-force
- 2006-02-23 KR KR1020077020400A patent/KR101267651B1/ko not_active IP Right Cessation
- 2006-02-23 WO PCT/US2006/006554 patent/WO2006091793A1/en active Application Filing
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WO2006091793A1 (en) | 2006-08-31 |
KR20120137441A (ko) | 2012-12-20 |
US7999379B2 (en) | 2011-08-16 |
KR101267651B1 (ko) | 2013-05-23 |
KR101357765B1 (ko) | 2014-02-11 |
CN101128931A (zh) | 2008-02-20 |
CN101128931B (zh) | 2010-05-19 |
WO2006091793A8 (en) | 2007-10-04 |
JP2013138214A (ja) | 2013-07-11 |
US20110266668A1 (en) | 2011-11-03 |
TWI335627B (en) | 2011-01-01 |
US20060194365A1 (en) | 2006-08-31 |
JP2008532291A (ja) | 2008-08-14 |
TW200636878A (en) | 2006-10-16 |
EP1851798A1 (en) | 2007-11-07 |
EP1851798B1 (en) | 2016-08-03 |
KR20070106628A (ko) | 2007-11-02 |
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