JP5475250B2 - 半導体装置の製造方法及び半導体装置 - Google Patents
半導体装置の製造方法及び半導体装置 Download PDFInfo
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- JP5475250B2 JP5475250B2 JP2008139409A JP2008139409A JP5475250B2 JP 5475250 B2 JP5475250 B2 JP 5475250B2 JP 2008139409 A JP2008139409 A JP 2008139409A JP 2008139409 A JP2008139409 A JP 2008139409A JP 5475250 B2 JP5475250 B2 JP 5475250B2
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- 239000004065 semiconductor Substances 0.000 title claims description 294
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- 239000010408 film Substances 0.000 description 401
- 239000000758 substrate Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 27
- 239000003990 capacitor Substances 0.000 description 23
- 229910021417 amorphous silicon Inorganic materials 0.000 description 22
- 238000003860 storage Methods 0.000 description 21
- 239000004973 liquid crystal related substance Substances 0.000 description 16
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000005530 etching Methods 0.000 description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 11
- 238000000206 photolithography Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000010306 acid treatment Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78663—Amorphous silicon transistors
- H01L29/78669—Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78678—Polycrystalline or microcrystalline silicon transistor with inverted-type structure, e.g. with bottom gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
始めに、図1を参照して、本実施の形態にかかる半導体装置を有するTFT基板について説明する。図1は、TFT基板の構成を示す平面図である。TFT基板は、液晶表示装置や有機EL表示装置等の平面型表示装置(フラットパネルディスプレイ)に用いることができる。
本実施の形態では、微結晶半導体膜4をゲート電極2上のみに形成する。なお、それ以外の構成、製造方法等は、実施の形態1と同様であるので、説明を省略する。ここで、本実施の形態にかかる半導体装置の構成について図6を用いて説明する。図6は、半導体装置の構成を示す断面図である。
本実施の形態では、微結晶半導体膜4をチャネル領域のみに形成する。なお、それ以外の構成、製造方法等は、実施の形態1と同様であるので、説明を省略する。ここで、本実施の形態にかかる半導体装置の構成について図7を用いて説明する。図7は、半導体装置の構成を示す断面図である。
5 非晶質半導体膜、6 n型非晶質半導体膜、7 ソース電極、8 ドレイン電極、
9 バックチャネルエッチ部、10 保護膜、11 コンタクトホール、
12 画素電極、13 保持容量配線、14 非晶質半導体膜、15 レジスト、
100 TFT基板、101 表示領域、102 額縁領域、
103 走査信号駆動回路、104 表示信号駆動回路、105 画素、
106 外部配線、107 外部配線、108 TFT、109 保持容量、
110 ゲート配線、111 ソース配線、200 ガラス基板、201 ゲート電極、
202 ゲート絶縁膜、203 微結晶シリコン膜、204 a−Si膜、
205 n−a−Si膜、206 バックチャネルエッチ部、207 ソース電極、
208 ドレイン電極、209 SiN膜、210 コンタクトホール、
211 画素電極
Claims (3)
- ゲート電極と、
前記ゲート電極上に形成された絶縁膜と、
前記絶縁膜上に形成された結晶性半導体膜と、
前記結晶性半導体膜上に形成され、パターン端が前記結晶性半導体膜の全てのパターン端より外側に配置され、前記結晶性半導体膜の外側に配置される部分において前記絶縁膜と接する第1非晶質半導体膜と、
前記第1非晶質半導体膜の上部表面に形成され、不純物元素が導入されて導電性を有する互いに分離した二つの第2非晶質半導体膜と、
前記二つの第2非晶質半導体膜の上部に其々接して形成されるソース電極及びドレイン電極と、
前記ドレイン電極に接続される画素電極と、
を備え、
前記結晶性半導体膜は、前記ゲート電極にゲート電圧を印加した際に、チャネルが形成されるチャネル領域に用いられ、
前記第1非晶質半導体膜は、そのパターン端が前記ゲート電極のパターン端より外側に配置されるとともに、前記ゲート電極の外側に配置される部分において前記絶縁膜と接して形成されている半導体装置。 - 前記結晶性半導体膜は、前記ゲート電極上のみに形成された請求項1に記載の半導体装置。
- 前記結晶性半導体膜は、前記ソース電極、及びドレイン電極と重なっておらず、チャネル領域のみに形成された請求項1に記載の半導体装置。
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JP2008139409A JP5475250B2 (ja) | 2008-05-28 | 2008-05-28 | 半導体装置の製造方法及び半導体装置 |
US12/470,080 US7923725B2 (en) | 2008-05-28 | 2009-05-21 | Semiconductor device and a method of manufacturing the same |
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JP5245287B2 (ja) * | 2007-05-18 | 2013-07-24 | ソニー株式会社 | 半導体装置の製造方法、薄膜トランジスタ基板の製造方法および表示装置の製造方法 |
JP5527966B2 (ja) * | 2007-12-28 | 2014-06-25 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
JP5602450B2 (ja) * | 2010-02-12 | 2014-10-08 | 三菱電機株式会社 | 薄膜トランジスタ、その製造方法、及び表示装置 |
US8629445B2 (en) * | 2011-02-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic appliance |
US8900938B2 (en) * | 2012-07-02 | 2014-12-02 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Manufacturing method of array substrate, array substrate and LCD device |
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JP2814319B2 (ja) * | 1991-08-29 | 1998-10-22 | 株式会社日立製作所 | 液晶表示装置及びその製造方法 |
JPH05190857A (ja) | 1992-01-10 | 1993-07-30 | Toshiba Corp | 薄膜トランジスタ |
JPH05226656A (ja) * | 1992-02-13 | 1993-09-03 | Hitachi Ltd | 薄膜半導体装置及びその製造方法 |
JPH0818053A (ja) * | 1994-06-28 | 1996-01-19 | Mitsubishi Electric Corp | 薄膜トランジスタ及びその製造方法 |
JPH1195248A (ja) * | 1997-09-18 | 1999-04-09 | Toshiba Corp | 表示装置用アレイ基板及びその製造方法 |
JP2005167051A (ja) | 2003-12-04 | 2005-06-23 | Sony Corp | 薄膜トランジスタおよび薄膜トランジスタの製造方法 |
JP4577114B2 (ja) | 2005-06-23 | 2010-11-10 | ソニー株式会社 | 薄膜トランジスタの製造方法および表示装置の製造方法 |
JP2007035964A (ja) | 2005-07-27 | 2007-02-08 | Sony Corp | 薄膜トランジスタとその製造方法、及び表示装置 |
JP2008140984A (ja) * | 2006-12-01 | 2008-06-19 | Sharp Corp | 半導体素子、半導体素子の製造方法、及び表示装置 |
JP5226259B2 (ja) * | 2007-08-21 | 2013-07-03 | 株式会社ジャパンディスプレイイースト | 液晶表示装置 |
TWI481029B (zh) | 2007-12-03 | 2015-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
JP5527966B2 (ja) * | 2007-12-28 | 2014-06-25 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
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US20090294769A1 (en) | 2009-12-03 |
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