JP5419435B2 - 有機発光表示装置の製造方法 - Google Patents
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- JP5419435B2 JP5419435B2 JP2008319978A JP2008319978A JP5419435B2 JP 5419435 B2 JP5419435 B2 JP 5419435B2 JP 2008319978 A JP2008319978 A JP 2008319978A JP 2008319978 A JP2008319978 A JP 2008319978A JP 5419435 B2 JP5419435 B2 JP 5419435B2
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/8085—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/80855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/80862—Heat curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/8085—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/80855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/80874—Ultraviolet [UV] curing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
10 カバーウィンド、
20 接着層、
25 接着物質、
30 印刷回路基板、
35 フレキシブル回路基板、
40 集積回路チップ、
50 表示パネルアセンブリ、
51,52 基板、
58 偏光板、
511 基板部材、
532 ドレイン電極、
544 アノード電極、
545 有機発光層、
546 カソード電極、
70 支持部材、
71 底部、
72 側壁部、
725 開口部、
BA 遮光部、
C1 保存キャパシタ、
DL1 データライン、
IOELD 出力電流、
L1 有機発光素子、
T1,T2,C1 駆動回路部、
SL1 スキャンライン、
VDD 電源ライン。
Claims (6)
- 表示領域と実装領域を有する第1基板と、前記第1基板の表示領域に合着された第2基板と、前記第1基板の実装領域に実装された集積回路チップとを含む表示パネルアセンブリを準備する段階と、
カバーウィンドを準備する段階と、
前記カバーウィンドの一の面上に接着物質を備える段階と、
前記接着物質が備えられた一の面が前記第2基板および前記集積回路チップと対向するように、前記カバーウィンドを前記表示パネルアセンブリに合着させる段階と、
前記接着物質が前記第2基板と前記カバーウィンドとの間の空間、および前記第1基板の実装領域と前記カバーウィンドとの間の空間の両空間を埋めて同一材料により一体に形成されている接着層をなすように、前記接着物質を移動させる段階と、
前記接着物質を硬化して前記接着層を形成する段階と、
を含むことを特徴とする有機発光表示装置の製造方法。 - 前記接着物質は、アクリル系樹脂を含み、
前記接着層は、前記接着物質に紫外線を照射して、または熱を加えて硬化されることにより形成されることを特徴とする請求項1に記載の有機発光表示装置の製造方法。 - 前記カバーウィンド上に備えた接着物質の一部が流れて前記表示パネルアセンブリと接触した後、前記カバーウィンドと前記表示パネルアセンブリとを互いに合着させることを特徴とする請求項1または2に記載の有機発光表示装置の製造方法。
- 前記表示パネルアセンブリを支持部材に収納する段階をさらに含み、
前記支持部材は、前記第1基板と平行に形成された底部と、前記底部から伸びて前記第1基板および前記第2基板の側面を囲む側壁部とを含み、
前記側壁部は、前記第1基板および前記第2基板の周縁部から予め設定された距離をおいて離隔配置されることを特徴とする請求項1〜3のいずれか1項に記載の有機発光表示装置の製造方法。 - 前記接着物質は、前記第1基板および前記第2基板の周縁部と前記側壁部との間の空間にも埋められて硬化されることにより前記接着層を形成することを特徴とする請求項4に記載の有機発光表示装置の製造方法。
- 前記予め設定された距離は、200μmよりも大きいことを特徴とする請求項4または5に記載の有機発光表示装置の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0061125 | 2008-06-26 | ||
KR1020080061125A KR100953654B1 (ko) | 2008-06-26 | 2008-06-26 | 유기 발광 표시 장치 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010010122A JP2010010122A (ja) | 2010-01-14 |
JP5419435B2 true JP5419435B2 (ja) | 2014-02-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008319978A Active JP5419435B2 (ja) | 2008-06-26 | 2008-12-16 | 有機発光表示装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8492969B2 (ja) |
EP (1) | EP2139055B1 (ja) |
JP (1) | JP5419435B2 (ja) |
KR (1) | KR100953654B1 (ja) |
CN (1) | CN101615610B (ja) |
TW (1) | TWI413442B (ja) |
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CN101615610A (zh) | 2009-12-30 |
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