JP5410212B2 - 基板処理装置、基板処理システムおよび検査周辺露光装置 - Google Patents

基板処理装置、基板処理システムおよび検査周辺露光装置 Download PDF

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Publication number
JP5410212B2
JP5410212B2 JP2009213093A JP2009213093A JP5410212B2 JP 5410212 B2 JP5410212 B2 JP 5410212B2 JP 2009213093 A JP2009213093 A JP 2009213093A JP 2009213093 A JP2009213093 A JP 2009213093A JP 5410212 B2 JP5410212 B2 JP 5410212B2
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Prior art keywords
substrate
unit
processing
exposure
surface state
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Japanese (ja)
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JP2011066049A5 (enExample
JP2011066049A (ja
Inventor
真人 柏山
幸彦 稲垣
一也 秋山
憲昭 横野
勲 谷口
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Screen Semiconductor Solutions Co Ltd
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Screen Semiconductor Solutions Co Ltd
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Priority to JP2009213093A priority Critical patent/JP5410212B2/ja
Priority to US12/870,402 priority patent/US8477301B2/en
Publication of JP2011066049A publication Critical patent/JP2011066049A/ja
Publication of JP2011066049A5 publication Critical patent/JP2011066049A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
    • G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2009213093A 2009-09-15 2009-09-15 基板処理装置、基板処理システムおよび検査周辺露光装置 Active JP5410212B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009213093A JP5410212B2 (ja) 2009-09-15 2009-09-15 基板処理装置、基板処理システムおよび検査周辺露光装置
US12/870,402 US8477301B2 (en) 2009-09-15 2010-08-27 Substrate processing apparatus, substrate processing system and inspection/periphery exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009213093A JP5410212B2 (ja) 2009-09-15 2009-09-15 基板処理装置、基板処理システムおよび検査周辺露光装置

Related Child Applications (1)

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JP2013230666A Division JP5680731B2 (ja) 2013-11-06 2013-11-06 基板処理装置および検査周辺露光システム

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JP2011066049A JP2011066049A (ja) 2011-03-31
JP2011066049A5 JP2011066049A5 (enExample) 2012-04-19
JP5410212B2 true JP5410212B2 (ja) 2014-02-05

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US (1) US8477301B2 (enExample)
JP (1) JP5410212B2 (enExample)

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JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
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JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5318403B2 (ja) 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) * 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
JP5575691B2 (ja) * 2011-04-06 2014-08-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記録媒体
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JP5841389B2 (ja) * 2011-09-29 2016-01-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
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JP6118044B2 (ja) * 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6001961B2 (ja) * 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP6058999B2 (ja) 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP6184102B2 (ja) * 2013-01-16 2017-08-23 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 位置合わせ装置および基板処理装置
JP6243784B2 (ja) 2014-03-31 2017-12-06 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP5837150B2 (ja) * 2014-07-01 2015-12-24 東京エレクトロン株式会社 基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記録媒体
TWI627588B (zh) 2015-04-23 2018-06-21 日商思可林集團股份有限公司 檢查裝置及基板處理裝置
JP6473038B2 (ja) * 2015-04-23 2019-02-20 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および基板処理装置
JP2017092306A (ja) * 2015-11-12 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6612632B2 (ja) * 2016-01-26 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2018036235A (ja) 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法
CN108803245B (zh) * 2017-04-28 2020-04-10 上海微电子装备（集团）股份有限公司 硅片处理装置及方法
JP7482702B2 (ja) * 2020-06-30 2024-05-14 東京エレクトロン株式会社 基板処理装置
US11378888B1 (en) 2021-01-07 2022-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Lens adjustment for an edge exposure tool

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JP2011066049A (ja) 2011-03-31
US20110063588A1 (en) 2011-03-17
US8477301B2 (en) 2013-07-02

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