JP5383611B2 - Ｌｅｄパッケージ - Google Patents

Ｌｅｄパッケージ Download PDF

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Publication number
JP5383611B2
JP5383611B2 JP2010186505A JP2010186505A JP5383611B2 JP 5383611 B2 JP5383611 B2 JP 5383611B2 JP 2010186505 A JP2010186505 A JP 2010186505A JP 2010186505 A JP2010186505 A JP 2010186505A JP 5383611 B2 JP5383611 B2 JP 5383611B2
Authority
JP
Japan
Prior art keywords
lead frame
resin body
led package
led
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010186505A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011176271A (ja
JP2011176271A5 (https=
Inventor
秀徳 江越
博明 押尾
輝雄 竹内
岩夫 松本
一裕 井上
聡 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2010186505A priority Critical patent/JP5383611B2/ja
Priority to US12/886,890 priority patent/US8637892B2/en
Priority to TW100101959A priority patent/TWI446596B/zh
Priority to CN201110032319.9A priority patent/CN102142513B/zh
Publication of JP2011176271A publication Critical patent/JP2011176271A/ja
Publication of JP2011176271A5 publication Critical patent/JP2011176271A5/ja
Application granted granted Critical
Publication of JP5383611B2 publication Critical patent/JP5383611B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2010186505A 2010-01-29 2010-08-23 Ｌｅｄパッケージ Active JP5383611B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010186505A JP5383611B2 (ja) 2010-01-29 2010-08-23 Ｌｅｄパッケージ
US12/886,890 US8637892B2 (en) 2010-01-29 2010-09-21 LED package and method for manufacturing same
TW100101959A TWI446596B (zh) 2010-01-29 2011-01-19 發光二極體（ｌｅｄ）封裝及其製造方法
CN201110032319.9A CN102142513B (zh) 2010-01-29 2011-01-26 Led封装及制作led封装的方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010019782 2010-01-29
JP2010019782 2010-01-29
JP2010186505A JP5383611B2 (ja) 2010-01-29 2010-08-23 Ｌｅｄパッケージ

Publications (3)

Publication Number Publication Date
JP2011176271A JP2011176271A (ja) 2011-09-08
JP2011176271A5 JP2011176271A5 (https=) 2012-10-11
JP5383611B2 true JP5383611B2 (ja) 2014-01-08

Family

ID=44340853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010186505A Active JP5383611B2 (ja) 2010-01-29 2010-08-23 Ｌｅｄパッケージ

Country Status (4)

Country Link
US (1) US8637892B2 (https=)
JP (1) JP5383611B2 (https=)
CN (1) CN102142513B (https=)
TW (1) TWI446596B (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010512662A (ja) 2006-12-11 2010-04-22 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 透明発光ダイオード
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
JP5464825B2 (ja) * 2008-07-23 2014-04-09 ローム株式会社 Ｌｅｄモジュール
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
KR101034054B1 (ko) * 2009-10-22 2011-05-12 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN102222625A (zh) * 2010-04-16 2011-10-19 展晶科技(深圳)有限公司 发光二极管封装结构及其基座的制造方法
JP5528900B2 (ja) * 2010-04-30 2014-06-25 ローム株式会社 発光素子モジュール
MY170920A (en) * 2010-11-02 2019-09-17 Carsem M Sdn Bhd Leadframe package with recessed cavity for led
KR101851818B1 (ko) 2010-11-11 2018-06-04 니치아 카가쿠 고교 가부시키가이샤 발광 장치와 회로 기판의 제조 방법
TWD145643S (zh) * 2011-04-28 2012-03-01 東芝股份有限公司 發光二極體
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
MY156107A (en) * 2011-11-01 2016-01-15 Carsem M Sdn Bhd Large panel leadframe
US9093621B2 (en) * 2011-12-28 2015-07-28 Nichia Corporation Molded package for light emitting device
CN103205692A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 一种蒸镀用掩模板的加工工艺、返修工艺
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
CN103887410B (zh) 2012-12-21 2017-02-01 展晶科技(深圳)有限公司 发光二极管制造方法
US9166131B2 (en) * 2013-07-17 2015-10-20 Tai-Yin Huang Composite LED package and its application to light tubes
JP2015095486A (ja) * 2013-11-08 2015-05-18 アイシン精機株式会社 半導体装置
TW201543720A (zh) * 2014-05-06 2015-11-16 新世紀光電股份有限公司 封裝結構及其製備方法
DE102014119390A1 (de) * 2014-12-22 2016-06-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム
US11195269B2 (en) * 2015-03-27 2021-12-07 Texas Instruments Incorporated Exposed pad integrated circuit package
JP6896038B2 (ja) * 2015-05-12 2021-06-30 三菱電機株式会社 表示装置
CN106571383B (zh) 2015-10-08 2020-04-28 联华电子股份有限公司 半导体元件及其制作方法
TWI590433B (zh) 2015-10-12 2017-07-01 財團法人工業技術研究院 發光元件以及顯示器的製作方法
WO2017091051A1 (ko) * 2015-11-27 2017-06-01 엘지이노텍 주식회사 발광소자 패키지 및 조명 장치
TWI634679B (zh) * 2017-03-27 2018-09-01 隆達電子股份有限公司 發光二極體裝置及其支架
JP6977338B2 (ja) * 2017-07-03 2021-12-08 大日本印刷株式会社 Ｌｅｄモジュール
KR102641336B1 (ko) * 2017-09-05 2024-02-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
US10998256B2 (en) * 2018-12-31 2021-05-04 Texas Instruments Incorporated High voltage semiconductor device lead frame and method of fabrication
CN112864297B (zh) * 2019-01-29 2022-06-28 泉州三安半导体科技有限公司 一种led封装器件
CN110649145A (zh) * 2019-09-25 2020-01-03 广东晶科电子股份有限公司 一种蚀刻片框架、封装支架和led器件
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798536A (en) * 1996-01-25 1998-08-25 Rohm Co., Ltd. Light-emitting semiconductor device and method for manufacturing the same
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
JP2001326295A (ja) 2000-05-15 2001-11-22 Rohm Co Ltd 半導体装置および半導体装置製造用フレーム
DE10131698A1 (de) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
JP2003110145A (ja) 2001-09-27 2003-04-11 Harvatek Corp 発光ダイオード用の翼形表面実装パッケージ
JP2003110080A (ja) 2001-09-28 2003-04-11 Citizen Electronics Co Ltd 半導体装置
KR100951626B1 (ko) * 2002-03-08 2010-04-09 로무 가부시키가이샤 반도체 칩을 사용한 반도체 장치
US6830496B2 (en) * 2003-01-22 2004-12-14 Kaylu Industrial Corporation Method of fabricating light emitting diode device with multiple encapsulants
JP4522049B2 (ja) 2003-02-14 2010-08-11 三洋電機株式会社 半導体装置
JP3910171B2 (ja) 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
US20040227151A1 (en) * 2003-03-31 2004-11-18 Hitachi Cable, Ltd. Light emitting diode
TWI275189B (en) * 2003-12-30 2007-03-01 Osram Opto Semiconductors Gmbh Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component
JP2006093672A (ja) 2004-08-26 2006-04-06 Toshiba Corp 半導体発光装置
JP3999780B2 (ja) 2004-11-16 2007-10-31 日電精密工業株式会社 リードフレームの製造方法
JP2007027281A (ja) 2005-07-13 2007-02-01 Toshiba Corp 半導体装置
US8044418B2 (en) * 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
JP4865525B2 (ja) * 2006-08-03 2012-02-01 イッツウェル カンパニー リミテッド Ｓｍｌ型発光ダイオードランプ用素子およびその製造方法
JP4306772B2 (ja) 2006-10-05 2009-08-05 日亜化学工業株式会社 発光装置
JP5232394B2 (ja) 2007-02-28 2013-07-10 ローム株式会社 半導体装置の製造方法
US20100163920A1 (en) * 2007-06-14 2010-07-01 Rohm Co., Ltd. Semiconductor light emitting device
TWI455672B (zh) 2007-07-06 2014-10-01 村田製作所股份有限公司 A method for forming a hole for connecting a conductor for a layer, a method for manufacturing a resin substrate and a component-mounted substrate, and a method of manufacturing a resin substrate and a component
KR100998233B1 (ko) * 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
CN101939852A (zh) * 2007-12-24 2011-01-05 三星Led株式会社 发光二极管封装件
KR20100095031A (ko) 2008-02-25 2010-08-27 파나소닉 주식회사 전자부품 모듈의 제조 방법
JP2011159767A (ja) 2010-01-29 2011-08-18 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP5010693B2 (ja) 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
JP5010716B2 (ja) 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
MY155671A (en) 2010-01-29 2015-11-13 Toshiba Kk LED package and method for manufacturing same
JP4951090B2 (ja) 2010-01-29 2012-06-13 株式会社東芝 Ｌｅｄパッケージ
JP2011165833A (ja) 2010-02-08 2011-08-25 Toshiba Corp Ｌｅｄモジュール
JP2011253910A (ja) * 2010-06-01 2011-12-15 Toshiba Corp 発光装置
JP2012113919A (ja) * 2010-11-24 2012-06-14 Toshiba Corp 照明装置
JP2012114286A (ja) * 2010-11-25 2012-06-14 Toshiba Corp Ｌｅｄパッケージ
JP2012234955A (ja) * 2011-04-28 2012-11-29 Toshiba Corp Ｌｅｄパッケージ及びその製造方法

Also Published As

Publication number Publication date
JP2011176271A (ja) 2011-09-08
US8637892B2 (en) 2014-01-28
TWI446596B (zh) 2014-07-21
US20110186902A1 (en) 2011-08-04
CN102142513B (zh) 2014-07-16
TW201145616A (en) 2011-12-16
CN102142513A (zh) 2011-08-03

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