JP5329028B2 - 電子部品実装構造体の製造方法 - Google Patents

電子部品実装構造体の製造方法 Download PDF

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Publication number
JP5329028B2
JP5329028B2 JP2006251071A JP2006251071A JP5329028B2 JP 5329028 B2 JP5329028 B2 JP 5329028B2 JP 2006251071 A JP2006251071 A JP 2006251071A JP 2006251071 A JP2006251071 A JP 2006251071A JP 5329028 B2 JP5329028 B2 JP 5329028B2
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Japan
Prior art keywords
electronic component
solder particles
electrodes
electronic components
adhesive
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JP2006251071A
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English (en)
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JP2008069317A (ja
Inventor
忠彦 境
秀喜 永福
耕治 本村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2006251071A priority Critical patent/JP5329028B2/ja
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to EP07807671A priority patent/EP2062468A1/en
Priority to US12/096,446 priority patent/US20090161328A1/en
Priority to PCT/JP2007/068320 priority patent/WO2008032866A1/en
Priority to KR1020087014842A priority patent/KR20090051002A/ko
Priority to CN200780001653XA priority patent/CN101361412B/zh
Priority to TW96134547A priority patent/TW200816895A/zh
Publication of JP2008069317A publication Critical patent/JP2008069317A/ja
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Publication of JP5329028B2 publication Critical patent/JP5329028B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
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Description

本発明は、電子部品実装構造体の製造方法に関するものである。
半導体チップや回路基板等の電子部品が他の電子部品と接合されて成る電子部品実装構造体の中には、両電子部品が熱硬化性樹脂に半田粒子を分散させた電子部品実装用接着剤により接合されたものがある。このような電子部品実装構造体では、両電子部品に挟まれた空間で熱硬化した熱硬化性樹脂の硬化物によって両電子部品が強固に結合されると同時に、熱硬化性樹脂の熱硬化工程において溶融した熱硬化性樹脂中の半田粒子によって両電子部品の電極が電気的に接続される。
特開平１１−４０６４号公報
ところが、熱硬化性樹脂中の半田粒子は表面の酸化膜が非常に薄いことから、半田粒子同士の衝突等によって容易に破れてしまい、加熱によって溶融した半田粒子は他の溶融した半田粒子とくっついて大きな半田粒子になり易い。このため、図３に示すように、熱硬化性樹脂１に半田粒子２を分散させた電子部品実装用接着剤を用いて電子部品１１，１３同士を接着した場合、通常の大きさの半田粒子２を挟み込んだ電極１２，１４は正常に接続されるが、複数の半田粒子２がくっついて大きくなった半田粒子２′を挟み込んだ電極１２，１４は半田の供給量が過多となり、隣接する電極同士が半田によって繋がるブリッジＢが形成されて、短絡が生じるという問題点があった。
また、半田粒子２の表面には多数の微小な凹凸があり、半田粒子２の表面に水が付着している場合には熱硬化性樹脂１の熱硬化時においてその水が蒸発し、熱硬化樹脂１の硬化物と半田粒子２の表面との間にボイドが生じ易かった。対向する電極１２，１４間に挟み込まれた半田粒子２の表面にボイドが生じていると電極１２，１４との接触面積が減少し、電極間の接合信頼性が低下するという問題点があった。
そこで本発明は、電子部品同士を接合して得られた電子部品実装構造体における短絡の発生の低減と電極間の接合信頼性の向上を図ることができる電子部品実装構造体の製造方法を提供することを目的とする。
請求項１に記載の電子部品実装構造体の製造方法は、第１の電子部品の電極と第２の電子部品の電極が電気的に接続され、熱硬化性樹脂を主成分とする電子部品実装用接着剤が熱硬化した接着剤硬化物によって両電子部品が接合された電子部品実装構造体の製造方法であって、第１の電子部品の電極を覆って電子部品実装用接着剤を塗布する接着剤塗布工程と、第１の電子部品の電極と第２の電子部品の電極の位置合わせをしたうえで両電極が近接するように両電子部品を相対的に近づけて加熱し、電子部品実装用接着剤を熱硬化させて両電子部品を接合する熱圧着工程とを含み、接着剤塗布工程において第１の電子部品に塗布される電子部品実装用接着剤には表面の水分を蒸発させるために酸素含有雰囲気中で加熱処理が施された後に熱硬化性樹脂に分散された半田粒子が含まれており、前記熱圧着工程において第１の電子部品の電極と第２の電子部品の電極が近接するように両電子部品を近づけた際、両電極の間に半田粒子を挟みこんで半田粒子の表面の酸化膜を破り、その酸化膜が破られ、且つ加熱によって溶融された半田粒子によって両電極を電気的に接続させる。
本発明の電子部品実装用接着剤は、熱硬化性樹脂に分散される半田粒子が熱硬化性樹脂に分散される前に予め酸素含有雰囲気中で加熱処理されているため、半田粒子の表面の酸化膜は通常の厚さ（酸素含有雰囲気中で加熱処理せず、空気中に晒されたことによって生じる酸化膜の厚さ）よりも厚くなっている。このような厚い酸化膜は熱硬化前の熱硬化性樹脂が流動して半田粒子同士がぶつかり合った程度では破れず、電子部品実装用接着剤が電子部品同士の接合に使用され、半田粒子が対向する電極の間に挟まれて押し潰されたときに初めて破れる。
従って、本発明の電子部品実装用接着剤により電子部品同士が接合され、本発明の電子部品実装用接着剤の硬化物が電子部品同士の間に介在している電子部品実装構造体では、熱硬化性樹脂に分散させる前の半田粒子が酸素含有雰囲気中で加熱処理されていない従来の電子部品実装用接着剤によって電子部品同士が接合された場合のように、他の半田粒子とくっついた大きな半田粒子により隣接する電極間にブリッジが形成されるようなことがなく、電子部品実装構造体における短絡の発生を著しく低減することができる。
また、半田粒子に加熱処理を施すことによって、熱硬化性樹脂に分散される前に半田粒子の表面に付着していた水が蒸発させることができるので、熱硬化性樹脂の熱硬化時において半田粒子の表面にボイドが生じることはなく、半田粒子と電極の間の接触面積の減少を防いで電極間の接合信頼性を向上させることができる。
以下、図面を参照して本発明の実施の形態について説明する。図１は本発明の一実施の形態における電子部品実装構造体の部分断面図、図２は本発明の一実施の形態における電子部品実装構造体の製造工程説明図である。
図１において、電子部品実装構造体１０は、第１の回路基板１１の電極１２と第２の回路基板１３の電極１４が電気的に接合され、熱硬化性樹脂２１を主成分とする電子部品実装用接着剤（以下、単に接着剤と称する）２０が熱硬化した接着剤硬化物２０′によって両回路基板１１，１３が接合されたものである。第１の回路基板１１と第２の回路基板１３はそれぞれ電子部品の一例であり、回路基板の他に半導体チップや抵抗、コンデンサ等
であってもよい。
電子部品実装構造体１０の製造手順は、図２に示すように、先ず第１の回路基板１１をその電極１２が上を向くように保持台３１の上面に保持した後、ディスペンサ等によって接着剤２０を第１の回路基板１１の表面に塗布する（図２（ａ））。このとき第１の回路基板１１の全ての電極１２が接着剤２０によって覆われるようにする。ここで、接着剤２０の主成分である熱硬化性樹脂２１は、例えばエポキシ系樹脂やアクリル系樹脂等から成り、半田粒子２２は、熱硬化性樹脂２１の熱硬化温度以下の融点Ｍｐを有するものとする。
接着剤２０を第１の回路基板１１の表面に塗布したら、第２の回路基板１３を吸着した熱圧着ヘッド３２を第１の回路基板１１の上方に位置させる。そして、第２の回路基板１１の電極１２と第２の回路基板１３の電極１４の位置合わせをしたうえで、第２の回路基板１３の電極１４が第１の回路基板１１の電極１２に上方から近接するように第２の回路基板１３を第１の回路基板１１に相対的に近づけて（熱圧着ヘッド３２を下降させて）、両回路基板１１，１２を加熱する（図２（ｂ））。これにより両回路基板１１，１３の間の接着剤２０は熱硬化して接着剤硬化物２０′となり、両回路基板１１，１３は強固に接合される。また、この熱圧着工程の際、第１の回路基板１１の電極１２と第２の回路基板１３の電極１４はその間に挟み込んだ接着剤２０（接着剤硬化物２０′）中の半田粒子２２を押し潰すので、半田粒子２２の表面の酸化膜２２ａは破れ、加熱によって溶融された半田粒子２２によって両電極１２，１４は電気的に接続される（図１中に示す右側の部分拡大図参照）。
一定時間が経過したら両回路基板１１，１３の加熱を停止し、第２の回路基板１３の吸着を解除した上で熱圧着ヘッド３２を上方へ退去させる。これにより電子部品実装構造体１０の製造が完了する（図２（ｃ））。
上記のように電子部品実装構造体１０の接着剤硬化物２０′は熱硬化性樹脂２１に半田粒子２２を分散させて成る接着剤２０を熱硬化させたものであり、第１の回路基板１１と第２の回路基板１３の間に介在して両回路基板１１，１３を強固に結合するとともに、含有する半田粒子２２を第１の回路基板１１の電極１２と第２の回路基板１３の電極１４の間に介在させて、両電極１２，１４を電気的に接続させている。すなわち、この実施の形態では、接着剤２０（接着剤硬化物２０′）はいわゆる異方導電性材料として機能しており、上下に対向する電極１２，１４は半田粒子２２を介して電気的に接続される一方、横方向、すなわち隣接する電極間は電気的に絶縁された状態となっている。
接着剤２０は、熱硬化性樹脂２１に半田粒子２２を分散させる工程を含む製造方法によって製造されるが、熱硬化性樹脂２１に半田粒子２２を分散させる前に、半田粒子２２を空気中などの酸素含有雰囲気中で加熱処理しておくようにする。すなわち、この接着剤２０に含まれる半田粒子２２は、熱硬化性樹脂２１に分散される前に酸素含有雰囲気中で加熱処理されたものである。
半田粒子２２の表面は通常、熱硬化性樹脂２１に分散される前に空気中に晒されたことによって生じた酸化膜２２ａによって覆われているが、本実施の形態における接着剤２０のように、熱硬化性樹脂２１に分散される前の半田粒子２２が酸素含有雰囲気中で加熱処理されているものでは、半田粒子２２の表面の酸化膜２２ａは上記加熱処理がなされていないものよりも厚くなっている。例えば、初期酸素濃度が１００ｐｐｍである場合、加熱処理後の酸素濃度はＳｎＰｂ共晶半田では１．５倍の１５０ｐｐｍ、ＳｎＺｎ半田では２倍の２００ｐｐｍとなり、このような酸素濃度の増大に伴って半田粒子２２の表面の酸化膜２２ａの厚さも大きくなる。このような厚い酸化膜２２ａは熱硬化前の熱硬化性樹脂２
１が流動して半田粒子２２同士がぶつかり合った程度では破れず（図１中に示す左側の部分拡大図参照）、接着剤２０が第１の回路基板１１と第２の回路基板１３の接合に使用され、半田粒子２２が対向する電極１２，１４の間に挟まれて押し潰されたときに初めて破れ、両回路基板１１，１３の電極１２，１４同士を接続する（図１中に示す右側の拡大図参照）。
従って、本実施の形態における接着剤２０により第１の回路基板１１と第２の回路基板１３が接合され、接着剤硬化物２０′が第１の回路基板１１と第２の回路基板１３の間に介在している電子部品実装構造体１０では、熱硬化性樹脂２１に分散させる前の半田粒子２２が酸素含有雰囲気中で加熱処理されていない従来の電子部品実装用接着剤によって電子部品同士が接合された場合とは異なり、他の半田粒子とくっついた大きな半田粒子によって隣接する電極間にブリッジが形成されるようなことがないので、電子部品実装構造体１０における短絡の発生を著しく低減することができる。
ここで、熱硬化性樹脂２１に分散させる前に行う半田粒子２２の酸素含有雰囲気中での加熱は、酸化膜２２ａの厚さを通常の厚さ（酸素含有雰囲気中で加熱処理せず、空気中に晒されたことによって生じる酸化膜２２ａの厚さ）よりも厚くして上記効果を得るためであればどのような条件下での加熱であってもよいが、半田粒子２２同士がぶつかり合った程度では破れず、半田粒子２２が対向する電極１３，１４の間に挟まれて押し潰されたときに初めて破れるような酸化膜２２ａの厚さが確実に得られるようにするためには、８０℃以上の温度で１０分以上の加熱を行うことが好ましい。
また、半田粒子２２を１００℃以上の温度で１０分以上加熱するようにすれば、熱硬化性樹脂２１に分散される前に半田粒子２２の表面に付着していた水を蒸発させることができる。熱硬化性樹脂２１に分散させる前に半田粒子２２の表面に付着していた水が蒸発されれば、その後に熱硬化性樹脂２１を熱硬化させたときでも半田粒子２２の表面にボイドが生じることはなく、半田粒子２２と電極１２，１４の間の接触面積の減少を防いで電極１２，１４間の接合信頼性を向上させることができる。
電子部品実装構造体における短絡の発生の低減と電極間の接合信頼性の向上を図ることができる。
本発明の一実施の形態における電子部品実装構造体の部分断面図 本発明の一実施の形態における電子部品実装構造体の製造工程説明図 従来の電子部品実装構造体の部分断面図
符号の説明
１０ 電子部品実装構造体
１１ 第１の回路基板（第１の電子部品）
１２ 電極
１３ 第２の回路基板（第２の電子部品）
１４ 電極
２０ 電子部品実装用接着剤
２０′ 接着剤硬化物
２１ 熱硬化性樹脂
２２ 半田粒子
２２ａ 酸化膜

Claims (1)

  1. 第１の電子部品の電極と第２の電子部品の電極が電気的に接続され、熱硬化性樹脂を主成分とする電子部品実装用接着剤が熱硬化した接着剤硬化物によって両電子部品が接合された電子部品実装構造体の製造方法であって、第１の電子部品の電極を覆って電子部品実装用接着剤を塗布する接着剤塗布工程と、第１の電子部品の電極と第２の電子部品の電極の位置合わせをしたうえで両電極が近接するように両電子部品を相対的に近づけて加熱し、電子部品実装用接着剤を熱硬化させて両電子部品を接合する熱圧着工程とを含み、接着剤塗布工程において第１の電子部品に塗布される電子部品実装用接着剤には表面の水分を蒸発させるために酸素含有雰囲気中で加熱処理が施された後に熱硬化性樹脂に分散された半田粒子が含まれており、前記熱圧着工程において第１の電子部品の電極と第２の電子部品の電極が近接するように両電子部品を近づけた際、両電極の間に半田粒子を挟みこんで半田粒子の表面の酸化膜を破り、その酸化膜が破られ、且つ加熱によって溶融された半田粒子によって両電極を電気的に接続させることを特徴とする電子部品実装構造体の製造方法。
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JP2006251071A JP5329028B2 (ja) 2006-09-15 2006-09-15 電子部品実装構造体の製造方法
US12/096,446 US20090161328A1 (en) 2006-09-15 2007-09-13 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure
PCT/JP2007/068320 WO2008032866A1 (en) 2006-09-15 2007-09-13 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure
KR1020087014842A KR20090051002A (ko) 2006-09-15 2007-09-13 전자 부품 실장용 접착제, 전자 부품 실장용 접착제의 제조방법, 전자 부품 실장 구조체, 및 전자 부품 실장구조체의 제조 방법
EP07807671A EP2062468A1 (en) 2006-09-15 2007-09-13 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure
CN200780001653XA CN101361412B (zh) 2006-09-15 2007-09-13 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法
TW96134547A TW200816895A (en) 2006-09-15 2007-09-14 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure

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JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
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KR101880053B1 (ko) 2017-04-26 2018-07-20 (주)노피온 갭퍼를 포함하는 이방성 도전 접착제의 제조방법 및 갭퍼를 이용하는 부품 실장방법

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CN101361412B (zh) 2011-08-24
CN101361412A (zh) 2009-02-04
KR20090051002A (ko) 2009-05-20
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