CN101361412A - 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法 - Google Patents

电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法 Download PDF

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Publication number
CN101361412A
CN101361412A CNA200780001653XA CN200780001653A CN101361412A CN 101361412 A CN101361412 A CN 101361412A CN A200780001653X A CNA200780001653X A CN A200780001653XA CN 200780001653 A CN200780001653 A CN 200780001653A CN 101361412 A CN101361412 A CN 101361412A
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China
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electronic unit
electrode
adhesive
semiconductor particles
thermosetting resin
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CN101361412B (zh
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境忠彦
永福秀喜
本村耕治
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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Abstract

目的是提供一种电子部件安装粘合剂，该电子部件安装粘合剂能够降低通过将电子部件相互结合得到的电子部件安装结构中发生短路的可能性并增加电极结合的可靠性；以及这种电子部件安装粘合剂的制作方法、所得到的电子部件安装结构及这种电子部件安装结构的制作方法。在电子部件安装结构10中，第一电路板11和第二电路板13通过电子部件安装粘合剂20相互结合。电子部件安装粘合剂20中，焊料粒子22分散于热固性树脂21内。焊料粒子22在分散于热固性树脂21内之前，在包含氧气的气氛内进行加热处理。第一电路板11的电极12和第二电路板13的电极14通过夹置于电极12和14之间且其表面氧化物膜22a由此破裂的焊料粒子22而相互电连接。

Description

电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法
技术领域
本发明涉及用于将电子部件相互结合的电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法。
背景技术
诸如半导体芯片或者电路板的电子部件结合到另一电子部件的电子部件安装结构中，存在这样的电子部件安装结构，即，两个电子部件通过电子部件安装粘合剂而相互结合，其中在该电子部件安装粘合剂中，焊料粒子分散于热固性树脂内。在这种电子部件安装结构中，两个电子部件通过在该两个电子部件之间的空间内通过热固化该热固性树脂而得到的固化件而牢固地相互结合，且同时，该两个电子部件的电极通过在该热固化树脂的热固化工艺中包含在该热固化树脂中的熔融焊料粒子而相互电连接。
[专利文献1]JP-A-11-4064
发明内容
然而，由于包含在该热固化树脂内的焊料粒子的表面氧化物膜非常薄，例如当焊料粒子相互碰撞时，表面氧化物膜容易破裂。通过加热而已经熔融的焊料粒子趋于与其它熔融焊料粒子组合形成大焊料粒子。因此，如图3所示，当电子部件11和13通过焊料粒子2分散于热固性树脂1内的电子部件安装粘合剂而相互结合时，通常大小的焊料粒子2夹置于其间的电极12和14正常地相互结合，而由于多个焊料粒子2组合使得大小增大的焊料粒子2’夹置于其间的电极12和14具有过量的焊料。结果，焊料桥B会形成于相邻对的电极12和14之间。这意味着短路的问题。
此外，每个焊料粒子2的表面具有许多微小凹凸。如果水附着到焊料粒子2的表面，则容易发生如下现象，即，当热固性树脂1被热固化时水蒸发，且空洞形成于热固性树脂1的固化件和焊料粒子2的表面之间。如果空洞在夹置于彼此相对的电极12和14之间的焊料粒子2的表面上形成，电极12和14的接触面积变小，这导致电极12和14结合可靠性下降的问题。
本发明的目的是提供一种电子部件安装粘合剂，该电子部件安装粘合剂能够降低通过将电子部件相互结合得到的电子部件安装结构中发生短路的可能性并增加电极结合的可靠性；以及这种电子部件安装粘合剂的制作方法、所得到的电子部件安装结构及这种电子部件安装结构的制作方法。
根据本发明，电子部件安装粘合剂包括：热固性树脂和分散于所述热固性树脂内的焊料粒子，该焊料粒子在分散于该热固性树脂内之前在包含氧气的气氛内进行加热处理。
根据本发明，电子部件安装粘合剂的制作方法包括如下步骤：在包含氧气的气氛内对焊料粒子进行加热处理；以及将所述焊料粒子分散于热固性树脂内。
再者，根据本发明，电子部件安装结构包括：第一电子部件的电极和第二电子部件的电极；以及粘合剂固化件，通过热固化主要由热固性树脂制成的电子部件安装粘合剂而得到，其中所述第一电子部件的电极和所述第二电子部件的电极相互电连接且所述第一电子部件和第二电子部件通过粘合剂固化件相互结合，该粘合剂固化件包含焊料粒子，该焊料粒子在包含氧气的气氛内进行加热处理之后分散于该热固性树脂内；以及所述第一电子部件的电极和所述第二电子部件的电极通过焊料粒子相互电连接，该焊料粒子夹置于该电极之间且表面氧化物膜由此破裂。
再者，根据本发明，电子部件安装结构的制作方法，其中第一电子部件的电极和第二电子部件的电极相互电连接且所述第一电子部件和第二电子部件通过粘合剂固化件相互结合，所述粘合剂固化件是通过热固化主要由热固性树脂制成的电子部件安装粘合剂而得到的，所述电子部件安装结构的制作方法的特征在于包括：粘合剂涂布步骤，将电子部件安装粘合剂涂布到第一电子部件，使得所述第一电子部件的电极覆盖有所述电子部件安装粘合剂；以及热压结合步骤，在所述第一电子部件的电极和第二电子部件的电极彼此对准且所述第一电子部件和第二电子部件相对地彼此更为靠近使得该电极相互紧邻之后，通过加热所述第一电子部件和第二电子部件，热固化所述电子部件安装粘合剂来结合所述第一电子部件和第二电子部件，其中在所述粘合剂涂布步骤中涂布到所述第一电子部件的电子部件安装粘合剂包含在包含氧气的气氛内进行加热处理之后分散于所述热固性树脂内的焊料粒子；以及在所述热压结合步骤中，当所述第一电子部件和第二电子部件相对地彼此更为靠近使得该电极相互紧邻时，焊料粒子夹置于所述电极之间且所述焊料粒子的表面氧化物膜因此破裂，由此所述电极通过表面氧化物膜已经破裂的所述焊料粒子而相互电连接。
在根据本发明的电子部件安装粘合剂中，分散于热固性树脂内的焊料粒子在分散于热固性树脂内之前在包含氧气的气氛内进行加热处理。因此，焊料粒子表面的表面氧化物膜厚于未进行加热处理的焊料粒子的表面氧化物膜(即，通过将焊料粒子暴露于空气而不在包含氧气的气氛内进行加热处理而形成的氧化物膜)。当热固性树脂在被热固化之前变得可流动时，这种厚的氧化物膜不破裂且焊料粒子仅仅相互碰撞。仅仅当电子部件安装粘合剂用于结合电子部件时该厚的氧化物膜才破裂，且焊料粒子被压碎夹置于对向的电极之间。
因此，在电子部件安装结构中，其中电子部件通过根据本发明的电子部件安装粘合剂而相互结合且根据本发明的电子部件安装粘合剂的粘合剂固化件夹置于电子部件之间，桥接不会由于焊料粒子组合形成的大焊料粒子而形成于相邻对的电极之间，这与电子部件通过传统电子部件安装粘合剂而相互结合的情形相反，其中该传统电子部件安装粘合剂的焊料粒子在分散于热固性树脂内之前不在包含氧气的气氛内进行加热处理。结果，电子部件安装结构中出现短路的可能性可以大幅降低。
再者，在焊料粒子分散于热固性树脂内之前对焊料粒子进行加热处理，可以蒸发附着到焊料粒子表面的水。因此，当热固性树脂热固化时，焊料粒子表面上不会形成空洞。这防止了焊料粒子与电极的接触面积的减小，且可以由此增加电极结合的可靠性。
附图说明
图1为根据本发明实施例的电子部件安装结构的部分剖面图。
图2示出根据本发明实施例的电子部件安装结构的制作工艺。
图3为传统电子部件安装结构的部分剖面图。
具体实施方式
下面参考附图描述本发明的实施例。图1为根据本发明实施例的电子部件安装结构的部分剖面图。图2示出根据本发明实施例的电子部件安装结构的制作工艺。
如图1所示，电子部件安装结构10中，第一电路板11的电极12和第二电路板13的电极14相互电连接且两个电路板11和13通过粘合剂固化件20’相互结合，其中粘合剂固化件20’是通过热固化主要由热固性树脂21制成的电子部件安装粘合剂(下文中简称为“粘合剂”)20而得到的。第一电路板11和第二电路板13为电子部件的示例。除了电路板之外，电子部件的示例包括半导体芯片、电阻器和电容器。
将参考图2描述电子部件安装结构10的制作工艺。首先，在第一电路板11以电极12朝上的方式保持在保持平台31上之后，粘合剂20通过配给器等涂布到第一电路板11的表面(见图2(a))。完成该操作，使得第一电路板11的所有电极12覆盖有粘合剂20。例如，作为粘合剂20的主要成份的热固性树脂21为环氧树脂、丙烯酸树脂等。假设焊料粒子22的熔点Mp低于或等于热固性树脂21的热固化温度。
在粘合剂20施加到第一电路板11的表面之后，其上吸着有第二电路板13的热压结合头32置于第一电路板11上方。在第一电路板11的电极12和第二电路板13的电极14彼此对准之后，第二电路板13相对地更靠近第一电路板11(热压结合头32下降)，使得第二电路板13的电极14从上方紧邻第一电路板11的电极12。随后，两个电路板11和13被加热(见图2(b))。结果，两个电路板11和13之间的粘合剂20热固化且变为粘合剂固化件20’，由此两个电路板11和13彼此牢固地结合。在该热压结合工艺中，第一电路板11的电极12和第二电路板13的电极14压碎夹置于电极12和电极14之间的粘合剂20这些部分(粘合剂固化件20’)内的焊料粒子22，由此焊料粒子22的表面氧化物膜22a破裂，且电极12和14通过加热而熔融的焊料粒子22相互电连接(见图1中右侧部分放大图)。
经过预定时间之后，两个电路板11和13的加热停止，第二电路板13的吸着解除，且热压结合头32向上退回。由此完成电子部件安装结构10的制作(见图2(c))。
如上所述，电子部件安装结构10的粘合剂固化件20’是通过热固化焊料粒子22分散于热固性树脂21内的粘合剂20而得到的部件。不仅粘合剂固化件20’夹置于第一电路板11和第二电路板13之间来牢固地结合这些电路板，而且包含在粘合剂固化件20’内的焊料粒子22夹置于第一电路板11的电极12和第二电路板13的电极14之间并电连接两个电路电极12和14。也就是说，在本实施例中，粘合剂20(粘合剂固化件20’)起着称为各向异性导电部件的功能：沿垂直方向彼此相对的电极12和14通过焊料粒子22相互电连接，相邻对的电极12和14相互电绝缘。
通过包括将焊料粒子22分散于热固性树脂21内的工艺的制作方法来制作粘合剂20。在焊料粒子22分散于热固性树脂21内之前，焊料粒子22在诸如空气的包含氧气的气氛内进行加热处理。也就是说，包含在粘合剂20内的焊料粒子22在分散于热固性树脂21内之前在包含氧气的气氛内进行加热处理。
通常，在分散于热固性树脂21内之前，焊料粒子的表面覆盖有通过暴露于空气而形成的氧化物膜。在根据本实施例的粘合剂20中，其中焊料粒子22在分散于热固性树脂21内之前在包含氧气的气氛内进行加热处理，焊料粒子22的表面氧化物膜22a厚于未进行加热处理的焊料粒子的表面氧化物膜。例如，初始氧浓度为100ppm时，对于Sn-Pb共晶焊料的情形，加热处理之后氧浓度变为150ppm，为初始值的1.5倍；对于Sn-Zn焊料的情形，加热处理之后氧浓度变为200ppm，为初始值的2倍。当氧浓度如此增大时，焊料粒子22的表面氧化物膜22a变得更厚。当热固性树脂21在被热固化之前变得可流动时，这种厚的氧化物膜22a不破裂且焊料粒子22仅仅相互碰撞(见图1的左手侧部分放大图)。仅仅当粘合剂20用于结合第一电路板11和第二电路板13时该厚的氧化物膜22a才破裂，且焊料粒子22被压碎夹置于对向的电极12和14之间，由此焊料22连接两个电路板11和13的电极12和14(见图1的右手侧放大图)。
因此，在电子部件安装结构10中，其中第一电路板11和第二电路板13通过根据本实施例的粘合剂20而相互结合且粘合剂固化件20’夹置于第一电路板11和第二电路板13之间，桥接不会由于焊料粒子22组合形成的大焊料粒子而形成于相邻对的电极12和14之间，这与电子部件通过传统电子部件安装粘合剂而相互结合的情形相反，其中该传统电子部件安装粘合剂的焊料粒子在分散于热固性树脂内之前不在包含氧气的气氛内进行加热处理。结果，电子部件安装结构10中出现短路的可能性可以大幅降低。
在焊料粒子22分散于热固性树脂21内之前进行的在氧化气氛内加热焊料粒子22可以在任意条件下执行，只要通过使氧化物膜22a的厚度大于正常值(即，通过将焊料粒子暴露于空气而不在包含氧气的气氛内进行加热处理而形成的氧化物膜的厚度)而达到上述效果即可。然而，为了可靠地制作氧化物膜22a，该氧化物膜22a足够厚以在焊料粒子仅仅相互碰撞时不破裂且只有当焊料粒子22被压碎夹置于对向的电极12和14之间时破裂，优选地在高于或等于80℃的温度进行该加热10分钟以上。
在高于或等于100℃的温度对焊料粒子22加热10分钟以上，可以在焊料粒子22分散于热固性树脂21内之前蒸发附着到焊料粒子22表面的水。如果在焊料粒子22分散于热固性树脂21内之前，附着到焊料粒子22表面的水被蒸发，则当热固性树脂21随后热固化时，焊料粒子22表面上不会形成空洞。这防止了焊料粒子22与电极12和14的接触面积的减小，且由此可以增加电极12和14结合的可靠性。
工业应用性
本发明可以减少发生短路的可能性，并增加电子部件安装结构中电极结合的可靠性。

Claims (4)

1.一种电子部件安装粘合剂，包括：
热固性树脂；以及
分散于所述热固性树脂内的焊料粒子，所述焊料粒子在分散于所述热固性树脂内之前在包含氧气的气氛内进行加热处理。
2.一种电子部件安装粘合剂的制作方法，包括如下步骤：
在包含氧气的气氛内对焊料粒子进行加热处理；以及
将所述焊料粒子分散于热固性树脂内。
3.一种电子部件安装结构，包括：
第一电子部件的电极和第二电子部件的电极；以及
粘合剂固化件，通过热固化主要由热固性树脂制成的电子部件安装粘合剂而得到，
其中所述第一电子部件的电极和所述第二电子部件的电极相互电连接，且所述第一电子部件和第二电子部件通过所述粘合剂固化件相互结合，
所述粘合剂固化件包含焊料粒子，所述焊料粒子在包含氧气的气氛内进行加热处理之后分散于所述热固性树脂内；以及
所述第一电子部件的电极和所述第二电子部件的电极通过焊料粒子相互电连接，所述焊料离子夹置于所述电极之间且表面氧化物膜由此破裂。
4.一种电子部件安装结构的制作方法，其中第一电子部件的电极和第二电子部件的电极相互电连接且所述第一电子部件和第二电子部件通过粘合剂固化件相互结合，所述粘合剂固化件是通过热固化主要由热固性树脂制成的电子部件安装粘合剂而得到的，所述电子部件安装结构的制作方法的特征在于包括：
粘合剂涂布步骤，将电子部件安装粘合剂涂布到第一电子部件，使得所述第一电子部件的电极覆盖有所述电子部件安装粘合剂；以及
热压结合步骤，在所述第一电子部件的电极和第二电子部件的电极彼此对准且所述第一电子部件和第二电子部件相对地彼此更为靠近使得所述电极相互紧邻之后，通过加热所述第一电子部件和第二电子部件，热固化所述电子部件安装粘合剂来结合所述第一电子部件和第二电子部件，
其中在所述粘合剂涂布步骤中涂布到所述第一电子部件的电子部件安装粘合剂包含在包含氧气的气氛内进行加热处理之后分散于所述热固性树脂内的焊料粒子；以及
在所述热压结合步骤中，当所述第一电子部件和第二电子部件相对地彼此更为靠近使得所述电极相互紧邻时，焊料粒子夹置于所述电极之间且所述焊料粒子的表面氧化物膜因此破裂，由此所述电极通过表面氧化物膜已经破裂的所述焊料粒子而相互电连接。
CN200780001653XA 2006-09-15 2007-09-13 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法 Active CN101361412B (zh)

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