JP5294862B2 - 繰返し可能な熱処理方法および機器 - Google Patents

繰返し可能な熱処理方法および機器 Download PDF

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JP5294862B2
JP5294862B2 JP2008530288A JP2008530288A JP5294862B2 JP 5294862 B2 JP5294862 B2 JP 5294862B2 JP 2008530288 A JP2008530288 A JP 2008530288A JP 2008530288 A JP2008530288 A JP 2008530288A JP 5294862 B2 JP5294862 B2 JP 5294862B2
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flash
workpiece
radiant
temperature
processor circuit
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Japanese (ja)
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JP2009508337A (ja
JP2009508337A5 (enExample
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カム、デーヴィッド、マルコム
デッツ、セルジー
マクドネル、ケヴィン
スチュアート、グレッグ
トラム、ティルマン
ルーディック、イゴール
カルドジェルシック、リュボミール
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マトソン テクノロジー、インコーポレイテッド
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Radiation Pyrometers (AREA)
JP2008530288A 2005-09-14 2006-09-14 繰返し可能な熱処理方法および機器 Active JP5294862B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US71648805P 2005-09-14 2005-09-14
US60/716,488 2005-09-14
PCT/CA2006/001518 WO2007030941A1 (en) 2005-09-14 2006-09-14 Repeatable heat-treating methods and apparatus

Publications (3)

Publication Number Publication Date
JP2009508337A JP2009508337A (ja) 2009-02-26
JP2009508337A5 JP2009508337A5 (enExample) 2009-11-05
JP5294862B2 true JP5294862B2 (ja) 2013-09-18

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US (1) US9482468B2 (enExample)
JP (1) JP5294862B2 (enExample)
CN (1) CN101288035B (enExample)
WO (1) WO2007030941A1 (enExample)

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CN112432968B (zh) * 2020-10-21 2022-08-30 中国核动力研究设计院 辐照后反应堆结构材料热导率测试样的制备方法及试样盒
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JP5346484B2 (ja) * 2008-04-16 2013-11-20 大日本スクリーン製造株式会社 熱処理方法および熱処理装置
JP5356725B2 (ja) * 2008-05-13 2013-12-04 大日本スクリーン製造株式会社 熱処理装置
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US9482468B2 (en) 2016-11-01
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WO2007030941A1 (en) 2007-03-22
US20070069161A1 (en) 2007-03-29

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